C23C28/023

Plated steel sheet having fine and even plating structure
11168389 · 2021-11-09 · ·

Provided is a plated steel sheet having an excellent quality with fine and even plating texture, the plated steel sheet including a base steel sheet and a Zn plating layer formed on the base steel sheet, wherein a Zn crystal in the plating layer has a size of 5 μm or less.

Coated tool and cutting tool including same
11167356 · 2021-11-09 · ·

A coated tool may include a base member and a coating layer located on the base member. The coating layer may include a plurality of AlTi layers including aluminum and titanium as a main component, and a plurality of AlCr layers including aluminum and chromium as a main component. The AlTi layers and the AlCr layers may be located alternately one upon another. The plurality of AlTi layers may include a first AlTi layer and a second AlTi layer located farther away from the base member than the first AlTi layer. Each of the plurality of AlTi layers may further include chromium, and a content ratio of chromium in the second AlTi layer may be higher than a content ratio of chromium in the first AlTi layer.

HIGHLY CORROSION-RESISTANT PLATED STEEL SHEET HAVING EXCELLENT PLATING ADHESION AND RESISTANCE TO LIQUID METAL EMBRITTLEMENT
20210340650 · 2021-11-04 ·

Provided is a highly corrosion-resistant plated steel sheet having plating adhesion and resistance to liquid metal embrittlement. A highly corrosion-resistant plated steel sheet comprises a base steel sheet and a plated layer, which sequentially comprises an Fe—Al alloy layer and an MgZn.sub.2 layer from an interface with the base steel sheet.

COATED STEEL PRODUCT
20230323521 · 2023-10-12 ·

A coated steel product including a base steel, and a coating layer containing a Zn—Al—Mg alloy layer disposed on a surface of the base steel, in which the coating layer has a predetermined chemical composition, the coated steel product including dendrite-shaped MgZn.sub.2 phase having a surface roughness Sa of 50 nm or less on a surface of the Zn—Al—Mg alloy layer, an area ratio of the dendrite-shaped MgZn.sub.2 phase having a surface roughness Sa of 50 nm or less being from 30% to 80% within a region of an observable field of view of 5 mm.sup.2, and among the dendrite-shaped MgZn.sub.2 phase having a surface roughness Sa of 50 nm or less, a number of dendrite-shaped MgZn.sub.2 phase having an area of 0.1 mm.sup.2 or more being from 5 to 100 within a region of an observable field of view of 25 mm.sup.2.

Coated steel material

A coated steel material including: a base steel, and a coating layer containing a Zn—Al—Mg alloy layer disposed on a surface of the base steel, wherein the coating layer has a predetermined chemical composition, and, in a backscattered electron image of the Zn—Al—Mg alloy layer that is obtained at a time of observing the surface of the Zn—Al—Mg alloy layer after polishing to ½ of the layer thickness, under a scanning electron microscope at a magnification of 100×, Al crystals are present, and the average value of the cumulative circumferential length of the Al crystals is 88 to 195 mm/mm.sup.2.

HOT-DIP GALVANIZED STEEL SHEET
20230313356 · 2023-10-05 · ·

This hot-dip galvanized steel sheet includes: a steel sheet; a boundary layer provided on the steel sheet; and a hot-dip galvanized layer provided on the boundary layer, in which the steel sheet has a predetermined chemical composition, in a region between a surface of the steel sheet and a depth of 25 μm from the surface of the steel sheet, an average grain size exceeds 4.0 μm, in a region between a position of 50 μm from the surface of the steel sheet and a position of 100 μm from the surface of the steel sheet, an area ratio of unrecrystallized ferrite is 50% or more, and in the hot-dip galvanized layer, a maximum value of a U concentration is 0.05 mass % or more.

PLATED STEEL SHEETS FOR HOT PRESS FORMING HAVING EXCELLENT HYDROGEN BRITTLENESS RESISTANCE AND IMPACT RESISTANCE, HOT PRESS FORMED PARTS, AND MANUFACTURING METHODS THEREOF

Provided are a plated steel sheet for hot press forming including: a base steel sheet containing, by wt%, 0.14 to 0.5% of C, 0.001 to 1% of Si, 0.3 to 4% of Mn, 0.001 to 0.015% of P, 0.0001 to 0.02% of S, 0.001 to 0.1% of Al, 0.001 to 1% of Cr, 0.001 to 0.02% of N, 0.1% or less of Ti, 0.01% or less of B, 0.005 to 0.1% of Sb, and a balance of Fe and unavoidable impurities; an aluminum or aluminum alloy plating layer provided on at least one surface of the base steel sheet; and a Sb-rich layer provided between the base steel sheet and the plating layer, wherein the plated steel sheet for hot press forming satisfies the following Relational Expressions 1-1 and 1-2, a hot press formed member manufactured using the same, and methods for manufacturing the plated steel sheet for hot press forming and the hot press formed member.

[00001]SbmaxSbcoat1.2­­­[Relational Expression 1-1]

[00002]SbmaxSbcoat2×Δt0.008­­­[Relational Expression 1-2]

[In Relational Expressions 1-1 and 1-2, Sb.sub.coat represents an average content of Sb in the plating layer, and a unit thereof is wt%, Sb.sub.max represents a maximum value of a content of Sb in the Sb-rich layer, and a unit thereof is wt%, and Δt represents a linear distance from a boundary between the plating layer and the Sb-rich layer to a point where Sb.sub.max is measured, and a unit thereof is .Math.m.]

Copper-alloy capping layers for metallization in touch-panel displays

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

Ultrahigh-strength and high-ductility steel sheet having excellent cold formability
11655517 · 2023-05-23 · ·

The present invention relates to an automotive steel sheet and, more specifically, provides: an ultrahigh-strength and high-ductility steel sheet ensuring ultrahigh strength and high ductility and, simultaneously, having excellent cold formability due to a high yield strength ratio, and improved collision characteristics.

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

A package including a first carrier, a seed layer, wires, a die and a molding material is provided. The first carrier is removed to expose the seed layer after disposing a second carrier on the molding material, then the seed layer is removed to expose the wires, and a gold layer is deposited on each of the wires by immersion gold plating, finally a semiconductor device is obtained. The gold layer is provided to protect the wires from oxidation and improve solder joint reliability.