A method of controlling wafer bow in an integrated circuit fabrication process may include characterizing the wafer bow in response to performing one or more first fabrication processes to an active side of an integrated circuit wafer. Determining one or more second fabrication processes, to be applied to a back side of the integrated circuit wafer, to bring the wafer bow to below a predetermined threshold based on the one or more first fabrication processes the method may additionally include performing the one or more second fabrication processes on the back side of the integrated circuit wafer.

The present invention relates to a multilayer coating on a metal substrate comprising (a) A first distinct layer of a first sol-gel composition disposed over the substrate, wherein the first distinct layer comprises an inorganic oxide, (b) a second distinct layer of a second sol-gel composition disposed over the first distinct layer, wherein the second distinct layer comprises silica and ceria, and (c) a third distinct layer of a third sol-gel composition disposed over the third distinct layer, wherein the third distinct layer comprises at least one alkoxysilane and the process for the preparation of thereof.

A plasma processing apparatus includes: a processing chamber disposed inside a vacuum container and in which plasma is formed; and a member which is a member forming an inner wall surface of the processing chamber and is disposed on a surface to be exposed to the plasma and has a coating film formed by spraying of yttrium fluoride or a material containing the yttrium fluoride. A ratio of an orthorhombic crystal of the yttrium fluoride or the material containing the yttrium fluoride forming the coating film relative to the entirety is 60% or more.

An yttrium oxyfluoride sprayed coating contains Y.sub.5O.sub.4F.sub.7 as a main component. In the yttrium oxyfluoride sprayed coating, when the total intensity of all peaks attributable to yttrium oxyfluoride in a diffraction spectrum obtained by X-ray diffractometry is assumed to be 100, the total intensity of all peaks attributable to yttrium fluoride and yttrium oxide is less than 10. Furthermore, in an yttrium oxyfluoride-containing sprayed coating, when the total intensity of all peaks attributable to yttrium oxyfluoride and yttrium fluoride in a diffraction spectrum obtained by X-ray diffractometry is assumed to be 100, the total intensity of all peaks attributable to yttrium oxide is less than 1.

A stage includes a base material including a step portion and an insulating film. The step portion includes a first surface recessed from a top surface of the base material and a second surface recessed from a side surface of the base material. The insulating film includes a plurality of first layers on the first surface and a plurality of second layers on the second surface. In the step portion, each first end portion of the plurality of first layers and each second end portion of the plurality of second layers are alternately stacked. The first surface and the second surface are connected via a corner, and each first end portion and each second end portion are alternately stacked at the corner.

A cutting tool including a base material and a hard layer provided on the base material, in which the hard layer is composed of a compound represented by Ti.sub.aAl.sub.bB.sub.cN, an atomic ratio a is 0.25 or more and less than 0.55, an atomic ratio b of is 0.45 or more and less than 0.75, an atomic ratio c of is more than 0 and 0.1 or less, a sum of the atomic ratio a, the atomic ratio b and the atomic ratio c is 1, a ratio I.sub.(200)/I.sub.(002) of an intensity I.sub.(200) of an X-ray diffraction peak of a (200) plane to an intensity I.sub.(002) of an X-ray diffraction peak of a (002) plane in the hard layer is 2 to 10, and a full width at half maximum of the X-ray diffraction peak of the (002) plane is 2 degrees to 8 degrees.

A coated cutting tool including a substrate and a coating layer formed on the substrate, wherein the coating layer has an alternately laminated structure of a first layer and a second layer, the first layer contains a compound having a composition represented by (Al.sub.aTi.sub.1-a)N (0.80 ≤ a ≤ 0.95), the second layer contains a compound having a composition represented by (Al.sub.bM.sub.cTi.sub.1-b-c)N (M represents at least one of Si or B, 0.80 ≤ b ≤ 0.95, and 0 < c ≤ 0.20), a and b satisfy |a-b| ≤ 0.05, and an average thickness of the alternately laminated structure is 1.0 .Math.m or more and 10.0 .Math.m or less.

A coated cutting tool includes a substrate with a rake side, a clearance side and a cutting edge, and a coating including a first layer and a second layer. The second layer includes an inner layer and an outer layer, wherein the first layer is exposed through an opening in the inner layer and the opening extends over at least a portion of the width of the cutting edge. Thereby, a double layer is provided in critical areas, whereas a single layer is provided in other areas. Preferably, the double oxide layer includes aluminum oxide layers. A method for manufacturing the coated cutting tool is also provided.

Various embodiments herein relate to electrochromic devices, methods of fabricating electrochromic devices, and apparatus for fabricating electrochromic devices. In a number of cases, the electrochromic device may be fabricated to include a particular counter electrode material. The counter electrode material may include a base anodically coloring material. The counter electrode material may further include one or more halogens. The counter electrode material may also include one or more additives.

A surface-coated boron nitride sintered body tool is provided, in which at least a cutting edge portion includes a cubic boron nitride sintered body and a coating film formed on a surface of the cubic boron nitride sintered body. The coating film includes an A layer and a B layer. The A layer is formed of columnar crystals each having a particle size of 10 nm or more and 400 nm or less. The B layer is formed of columnar crystals each having a particle size of 5 nm or more and 70 nm or less. The B layer is formed by alternately stacking two or more compound layers having different compositions. The compound layers each have a thickness of 0.5 nm or more and 300 nm or less.