C23C28/32

Low insertion force contact and method of manufacture
11362451 · 2022-06-14 · ·

A low insertion force contact includes a main body and a spring beam extending from the main body at a mating end of the low insertion force contact. The spring beam has a mating interface configured for mating electrical connection to a mating contact. The spring beam includes a conductive base layer extending to the mating interface. A silver coating layer is provided on the conductive base layer. The silver coating layer is provided at the mating interface. A silver sulfide surface layer forms a solid lubricant directly on the silver coating layer. The silver sulfide surface layer forms a film having a controlled thickness at the mating interface.

A METHOD FOR THE MANUFACTURE OF AN ASSEMBLY BY SUBMERGED ARC WELDING (SAW)

A pre-coated steel substrate wherein the coating including at least one titanate and at least one nanoparticle; a method for the manufacture of an assembly; a method for the manufacture of a coated steel substrate and a coated substrate substrate. It is particularly well suited for construction, shipbuilding and offshore industries.

CONTACT STRUCTURE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CONTACT STRUCTURE

A contact structure is provided, which includes a substrate, a copper layer, an organic composite protective layer, and a nanosilver layer. The copper layer is disposed over the substrate. The organic composite protective layer is disposed over the copper layer to avoid oxidation of the copper layer, in which the organic composite protective layer forms a monomolecular adsorption layer over a surface of the copper layer. The nanosilver layer is disposed over the organic composite protective layer. A method of manufacturing a contact structure is also provided.

Steel sheet for cans, and production method therefor

A steel sheet for cans which exhibits excellent weldability; and a production method therefor include a steel sheet for cans with the surface of a steel sheet in order from the steel sheet side, a chromium metal layer and a hydrous chromium oxide layer. The deposited amount of the chromium metal layer is 65-200 mg/m.sup.2. The deposited amount of the hydrous chromium oxide layer in terms of chromium is 3-30 mg/m.sup.2. The chromium metal layer includes: a base part having a thickness of 7.0 nm or higher; and granular protrusions which are on the base part, have a maximum grain size of 100 nm or lower, and have a number density per unit area of at least 200 per μm.sup.2.

Hot-stamped body

There is provided a hot-stamped body including: a steel base metal; and a metallic layer formed on a surface of the steel base metal, wherein the metallic layer includes: an interface layer that contains, in mass %, Al: 30.0 to 36.0%, has a thickness of 100 nm to 5 μm, and is located in an interface between the metallic layer and the steel base metal; and a principal layer that includes coexisting MgZn.sub.2 phases and insular FeAl.sub.2 phases, is located on the interface layer, and has a thickness of 3 μm to 40 μm.

Electronic device coatings for reflecting mid-spectrum visible light

An electronic device may include conductive structures having a visible-light-reflecting coating. The coating may include a seed layer, transition layers, a neutral-color base layer, and an uppermost layer that forms a single-layer interference film. The neutral-color base layer may be opaque to visible light. The interference film may include silicon and may have an absorption coefficient between 0 and 1. The interference film may include, for example, CrSiN or CrSiCN. The composition of the interference film, the thickness of the interference film, and/or the composition of the base layer may be selected to provide the coating with a desired color near the middle of the visible spectrum (e.g., at green wavelengths). The color may be relatively stable even if the thickness of the coating varies across its area.

CONDUCTIVE ELEMENT

Methods for producing a conductive element precursor and a conductive element, such as a tape or wire, are provided. The methods comprise growing a plurality of carbon nanotubes on a metallic substrate and coating carbon nanotubes of the plurality of carbon nanotubes on the metallic substrate with a metallic material.

OXIDE SUPERCONDUCTING WIRE
20220148763 · 2022-05-12 · ·

An oxide superconducting wire includes a superconducting laminate including an oxide superconducting layer disposed, either directly or indirectly, on a substrate, and a stabilization layer which is a Cu plating layer covering an outer periphery of the superconducting laminate, and a Vickers hardness of the Cu plating layer is in the range of 80 to 190 HV.

PLATED STEEL SHEET

A plated steel sheet includes: a steel sheet; and a plating layer that is formed on at least a part of a surface of the steel sheet, in which a chemical composition of the plating layer includes, by mass %, Al: more than 5.00% and 35.00% or less, Mg: 3.00% to 15.00%, Si: 0% to 2.00%, Ca: 0% to 2.00%, and a remainder of Zn and impurities, in which in a cross section of the plating layer in a thickness direction, the area ratio of a lamellar structure in which an (Al—Zn) phase and a MgZn.sub.2 phase are arranged in layers is 10% to 90%, a lamellar spacing of the lamellar structure is 2.5 μm or less, and the area ratio of an (Al—Zn) dendrite is 35% or less.

LAMINATED BODY AND METHOD OF MANUFACTURING LAMINATED BODY

A laminated body includes a transparent substrate having a laminated film. The laminated film includes a dielectric layer containing silicon nitride, a barrier layer composed of a single film or two or more films, and a metal layer containing silver. The barrier layer has a thickness of from 0.1 nm to 10 nm. Each film of the barrier layer includes a material having a crystal structure of a face-centered cubic structure with a lattice constant of from 3.5 to 4.2, a hexagonal close-packed structure with a lattice constant of from 2.6 to 3.3, a body-centered cubic structure with a lattice constant of from 2.9 to 3.2, or a tetragonal crystal with a lattice constant of from 2.9 to 4.4. The metal layer has a thickness of from 7 nm to 25 nm. An orientation index P of the metal layer falls within a range from 4.5 to 20.