C23C28/44

Extreme ultraviolet mask blank production system with thin absorber and manufacturing system therefor

An extreme ultraviolet (EUV) mask blank production system includes: a substrate handling vacuum chamber for creating a vacuum; a substrate handling platform, in the vacuum, for transporting an ultra-low expansion substrate loaded in the substrate handling vacuum chamber; and multiple sub-chambers, accessed by the substrate handling platform, for forming an EUV mask blank includes: a multi-layer stack, formed above the ultra-low expansion substrate, for reflecting an extreme ultraviolet (EUV) light, and an absorber layer, formed above the multi-layer stack, for absorbing the EUV light at a wavelength of 13.5 nm includes the absorber layer has a thickness of less than 80 nm and less than 2% reflectivity.

COATED CUTTING TOOL
20190030614 · 2019-01-31 · ·

A coated cutting tool comprising a substrate and a coating layer formed on the substrate, wherein: the coating layer has an alternating laminate structure of an alternating laminate of: a first composite nitride layer containing a compound having a composition represented by formula (1) below:


(Al.sub.1-xCr.sub.x)N(1)

(wherein x denotes an atomic ratio of the Cr element based on a total of the Al element and the Cr element and satisfies 0.10x0.50); and a second composite nitride layer containing a compound having a composition represented by formula (2) below:


(Ti.sub.1-ySi.sub.y)N(2)

(wherein y denotes an atomic ratio of the Si element based on a total of the Ti element and the Si element and satisfies 0.00<y<1.00); an average thickness of each of the layers of the first composite nitride layer is from 70 nm or more to 300 nm or less, and an average thickness of each of the layers of the second composite nitride layer is from 70 nm or more to 300 nm or less; pa and a ratio [H/E] of a hardness H of the alternating laminate structure to an elastic modulus E of the alternating laminate structure is from 0.06 or more to 0.08 or less.

ADHESION OF THERMAL SPRAY COATINGS OVER A SMOOTH SURFACE

A coated component is generally provided, along with methods of forming such a coating system. The coated component includes a substrate having a surface with a coating system thereon. The coating system may include a columnar thermal barrier coating (TBC) over the surface of the substrate, with the columnar TBC including surface-connected voids. An intermediate layer is over the columnar TBC layer. The intermediate layer has a surface opposite of the columnar TBC that is rougher than the surface of the columnar TBC. A second TBC is over the intermediate layer.

Method of forming a multilayered coating for improved erosion resistance

A method of applying a coating system to a substrate includes applying a first layer of a high hardness and high modulus of elasticity with an added metal to the substrate, applying a second layer of the high hardness and high modulus of elasticity in combination with the added metal to the first layer. A percent by volume of the added metal in the second layer is lower than the percent by volume of the added metal in the first layer. The method also includes applying two or more intermediate layers formed from an applied mixture of the high hardness, high modulus of elasticity material and a metal material between the first layer and the second layer.

Chromium-based oxidation protection layer

A chromium-based oxidation protection layer for substrates that are subjected to high temperatures in which the layer includes a chromium-containing layer system that has a base layer and a functional layer, the base layer is situated between the substrate and the functional layer, the base layer contains at least mostly chromium nitride, and the functional layer contains chromium oxide. According to certain embodiments, the chromium-containing layer system has a functional layer having a multilayer structure that includes alters deposited individual layers A and B, the composition of the individual layers A differs from the composition of the individual layers B, the individual layers A contain at least mostly aluminum chromium nitride or chromium nitride, and the individual layers B contain at least mostly aluminum chromium oxide or chromium oxide or aluminum chromium oxynitride or chromium oxynitride.

ALUMINUM-IRON ALLOY-COATED STEEL SHEET FOR HOT PRESS FORMING, HAVING EXCELLENT HYDROGEN DELAYED FRACTURE RESISTANCE, PEELING RESISTANCE, AND WELDABILITY AND HOT-FORMED MEMBER USING SAME
20190003029 · 2019-01-03 ·

An AlFe alloy coated steel sheet includes a base steel sheet and an alloy coating layer, wherein the base steel sheet includes, by wt %, C: 0.1%0.5%, Si: 0.01%2%, Mn: 0.01%10%, P: 0.001%0.05%, S: 0.0001%0.02%, Al: 0.001%1.0%, N: 0.001%0.02%, and the balance of Fe and other impurities, wherein the alloy coating layer includes: an AlFe alloy layer I formed on the base steel sheet and having a Vickers hardness of 200800 Hv; an AlFe alloy layer III formed on the AlFe alloy layer I and having a Vickers hardness of 7001200 Hv; and an AlFe alloy layer II formed in the AlFe alloy layer III continuously or discontinuously in a length direction of the steel sheet, and having a Vickers hardness of 400900 Hv, wherein an average oxygen content at a depth of 0.1 m from a surface of the oxide layer is 20% or less by weight.

Hard mask, substrate processing method, and substrate processing apparatus

In a hard mask formed on a target film formed on a substrate, a first film having a stress in a first direction and a second film having a stress in a second direction opposite to the first direction are alternately stacked one or more times.

CUTTING TOOL

A cutting tool comprises a substrate and a coating film disposed on the substrate, wherein the coating film comprises a first layer and a second layer; the first layer has a hardness H.sub.1 of 25 GPa or more and 40 GPa or less; the second layer has a hardness H.sub.2 satisfying 0.5?H.sub.1?H.sub.2?0.9?H.sub.1; and at least one of a ratio I.sub.(200)/(I.sub.(200)+I.sub.(111)+I.sub.(220)) of I.sub.(200) of (200) plane to a sum of X-ray diffraction intensity I.sub.(200) of (200) plane, X-ray diffraction intensity I.sub.(111) of (111) plane, and X-ray diffraction intensity I.sub.(220) of (220) plane of the coating film, a ratio I.sub.(111)/(I.sub.(200)+I.sub.(111)+I.sub.(220)) of I.sub.(111) to the sum, and a ratio I.sub.(220/(I.sub.(200)+I.sub.(111)+I.sub.(220)) of I.sub.(220) to the sum is 0.45 or more.

COATING A BODY WITH A DIAMOND LAYER AND A HARD MATERIAL LAYER
20180347034 · 2018-12-06 · ·

The invention relates to a coated body and to a method for coating a body. The coated body comprises at least a substrate (22), a diamond layer (24) having a thickness of 1-40 ?m, and a hard material layer (26), which is arranged farther outside on the body (10) than the diamond layer (24). The hard material layer (26) comprises at least one metal element and at least one non-metal element. An adhesive layer (32) having a thickness of 2-80 nm is provided between the diamond layer (24) and the hard material layer (26). The adhesive layer (32) contains carbon and at least one metal element. The diamond layer (24) can be applied by means of a CVD method. The hard material layer can be applied by means of a PVD method. The adhesive layer (32) between the diamond layer (24) and the hard material layer (26) can be produced in that, before the hard material layer (26) is applied, the surface of the diamond layer (24) is pretreated by means of HIPIMS metal ion etching, wherein ions are implanted into or diffuse into the surface of the diamond layer (24) by means of metal ion etching.

LOW DIELECTRIC CONSTANT OXIDE AND LOW RESISTANCE OP STACK FOR 3D NAND APPLICATION
20180315592 · 2018-11-01 ·

Embodiments described herein generally relate to methods of manufacturing an oxide/polysilicon (OP) stack of a 3D memory cell for memory devices, such as NAND devices. The methods generally include treatment of the oxide and/or polysilicon materials with precursors during PECVD processes to lower the dielectric constant of the oxide and reduce the resistivity of the polysilicon. In one embodiment, the oxide material is treated with octamethylcyclotetrasiloxane (OMCTS) precursor. In another embodiment, germane (GeH.sub.4) is introduced to a PECVD process to form Si.sub.xGe.sub.(1-x) films with dopant. In yet another embodiment, a plasma treatment process is used to nitridate the interface between layers of the OP stack. The precursors and plasma treatment may be used alone or in any combination to produce OP stacks with low dielectric constant oxide and low resistivity polysilicon.