A rolled metal sheet includes an obverse surface and a reverse surface that is a surface located opposite to the obverse surface. At least either one of the obverse surface and the reverse surface is a processing object. A method for manufacturing a metal mask substrate includes reducing a thickness of the rolled metal sheet to 10 μm or less by etching the processing object by 3 μm or more by use of an acidic etching liquid, and roughening the processing object so that the processing object becomes a resist formation surface that has a surface roughness Rz of 0.2 μm or more, thereby obtaining a metal mask sheet.

A rolled metal sheet includes an obverse surface and a reverse surface that is a surface located opposite to the obverse surface. At least either one of the obverse surface and the reverse surface is a processing object. A method for manufacturing a metal mask substrate includes reducing a thickness of the rolled metal sheet to 10 μm or less by etching the processing object by 3 μm or more by use of an acidic etching liquid, and roughening the processing object so that the processing object becomes a resist formation surface that has a surface roughness Rz of 0.2 μm or more, thereby obtaining a metal mask sheet.

A vapor deposition mask made of metal includes: a front surface configured to oppose a vapor deposition source; and mask holes each including a hole portion having a shape of an inverted frustum. The hole portion of each of the mask holes includes: a small opening including a polygonal edge as seen from a view opposing the front surface of the vapor deposition mask, the edge including corners and linear portions each located between adjacent ones of the corners; and a large opening located on the front surface, the large opening including an edge as seen from the view opposing the front surface of the vapor deposition mask, the edge being shaped such that the corners of the edge of the small opening project outward from the edge of the small opening. The large opening surrounds the small opening as seen from the view opposing the front surface.

A pipe welding structure includes: a channel plate that includes a fluid channel; through-hole plates stacked on the channel plate, each of the through-hole plates having through holes that communicate with each other and forming a combined through hole; and a pipe inserted into the combined through hole and welded to one of the through-hole plates disposed farthest from the channel plate, the pipe internally including a pipe channel that connects to the fluid channel.

A metal plate to be used in the manufacture of a deposition mask comprises: a base metal plate; and a surface layer disposed on the base metal plate, wherein the surface layer includes elements different from those of the base metal plate, or has a composition ratio different from that of the base metal plate, and an etching rate of the base metal plate is greater than the etching rate of the surface layer. An embodiment includes a manufacturing method for a deposition mask having an etching factor greater than or equal to 2.5. The deposition mask of the embodiment includes a deposition pattern region and a non-deposition region, the deposition pattern region includes a plurality of through-holes, the deposition pattern region is divided into an effective region, a peripheral region, and a non-effective region, and through-holes can be formed in the effective region and the peripheral region.

A metal plate to be used in the manufacture of a deposition mask comprises: a base metal plate; and a surface layer disposed on the base metal plate, wherein the surface layer includes elements different from those of the base metal plate, or has a composition ratio different from that of the base metal plate, and an etching rate of the base metal plate is greater than the etching rate of the surface layer. An embodiment includes a manufacturing method for a deposition mask having an etching factor greater than or equal to 2.5. The deposition mask of the embodiment includes a deposition pattern region and a non-deposition region, the deposition pattern region includes a plurality of through-holes, the deposition pattern region is divided into an effective region, a peripheral region, and a non-effective region, and through-holes can be formed in the effective region and the peripheral region.

A light shielding plate including a front surface located on a light incident side, a rear surface facing away from the front surface, and an aperture penetrating through the front and rear surfaces. The aperture includes a first aperture portion and a second aperture portion connected to the first aperture portion via a central opening. The first aperture portion extends from a rear opening in the rear surface toward the central opening and has a shape tapered from the rear surface toward the front surface. The second aperture portion extends from a front opening in the front surface toward the central opening and has a shape tapered from the front surface toward the rear surface. The front opening is larger than the rear opening.

A light shielding plate includes: a front surface located on a light entry side; a rear surface facing away from the front surface; and a hole extending through between the front surface and the rear surface. The hole includes a first hole portion and a second hole portion connected to the first hole portion at a center opening. The first hole portion extends from a rear surface opening in the rear surface to the center opening and is tapered in shape from the rear surface toward the front surface. The second hole portion extends from a front surface opening in the front surface to the center opening and is tapered in shape from the front surface toward the rear surface. The front surface opening is larger in size than the rear surface opening.

Discussed is a deposition mask including a metal plate having a first surface and a second surface opposite to the first surface, wherein the metal plate including an invar, wherein the metal plate includes a plurality of through-hole, wherein the through-hole includes a first surface hole forming in the first surface, a second surface hole forming in the second surface, and a connecting part through which the first surface hole and the second surface hole communicate with each other, and wherein an angle formed by a virtual line connecting the end of the connecting part and the end of the second surface hole, and a virtual line extending in a direction parallel to the second face from the end of the second surface hole is 30 to 60 degrees.

A metal plate for use in manufacture of a deposition mask according to an embodiment is a multilayer metal plate having a thickness of 30 μm or less and containing an alloy of nickel (Ni) and iron (Fe), and comprises: a first outer portion occupying an area corresponding to 20% or less of the total thickness of the metal plate from one surface thereof; a second outer portion occupying an area corresponding to 20% or less of the total thickness from the other surface opposite to the one surface; and a central portion except the first outer portion and the second outer portion, wherein the first outer portion and the second outer portion each have a larger nickel content than that of the central portion. The multilayer metal plate for use in manufacture of a deposition mask according to an embodiment is a multilayer metal plate containing an alloy of nickel (Ni) and iron (Fe), and is manufactured by a method comprising the steps of: forming a nickel-plated layer; forming an iron-plated layer on the nickel-plated layer; forming a multilayer-plated plate in which the nickel-plated layer and the iron-plated layer are alternately and repeatedly arranged; and heat-treating the multilayer-plated plate at a temperature of 300° C. or higher.