To provide a composition for removing photoresist residue and/or polymer residue formed in a process for producing a semiconductor circuit element, and a removal method employing same. A composition for removing photoresist residue and/or polymer residue, the composition containing saccharin and water, and the pH being no greater than 9.7.

To provide a composition for removing photoresist residue and/or polymer residue formed in a process for producing a semiconductor circuit element, and a removal method employing same. A composition for removing photoresist residue and/or polymer residue, the composition containing saccharin and water, and the pH being no greater than 9.7.

Compositions and methods are presented that selectively dissolve calcium from a variety of cementitious materials without dissolving or otherwise degrading calcium silica hydrate (CSH). Preferably, contemplated compositions comprise guanidine bisulfate hydrochloride, which can be prepared from a reaction of urea, hydrochloric acid, and sulfamic acid. Therefore, it is especially contemplated that the compositions contemplated herein are particularly suitable to clean or otherwise condition surfaces of cured concrete, Portland cement-based material, or an aggregate containing CSH.

Compositions and methods are presented that selectively dissolve calcium from a variety of cementitious materials without dissolving or otherwise degrading calcium silica hydrate (CSH). Preferably, contemplated compositions comprise guanidine bisulfate hydrochloride, which can be prepared from a reaction of urea, hydrochloric acid, and sulfamic acid. Therefore, it is especially contemplated that the compositions contemplated herein are particularly suitable to clean or otherwise condition surfaces of cured concrete, Portland cement-based material, or an aggregate containing CSH.

Compositions useful for the selective removal of silicon nitride materials relative to polysilicon, silicon oxide materials and/or silicide materials from a microelectronic device having same thereon are provided. The compositions of the invention are particularly useful in the etching of 3D NAND structures.

A ruthenium-etching solution for carrying out an etching process on ruthenium. The etching solution includes orthoperiodic acid and ammonia, in which a pH is 8 or higher and 10 or lower. A method for manufacturing the ruthenium-etching solution, a method for processing an object to be processed including carrying out an etching process on an object to be processed including ruthenium using the ruthenium-etching solution, and a method for manufacturing a ruthenium-containing wiring.

An object of the present invention is to provide a treatment liquid and a treatment method that are capable of enhancing the corrosion resistance of a net material. This object is achieved by, after forming a chemical conversion treatment film on the surface of a metal material, forming a film using a film-forming treatment liquid, the treatment liquid comprising: a silicon compound containing at least one member selected from the group consisting of alkoxysilyl, alkoxysilylene, and a siloxane bond; an organometallic compound; and water.

An object of the present invention is to provide a treatment liquid and a treatment method that are capable of enhancing the corrosion resistance of a net material. This object is achieved by, after forming a chemical conversion treatment film on the surface of a metal material, forming a film using a film-forming treatment liquid, the treatment liquid comprising: a silicon compound containing at least one member selected from the group consisting of alkoxysilyl, alkoxysilylene, and a siloxane bond; an organometallic compound; and water.

This application relates to a method of manufacturing a knife using a multilayer material. In one aspect, the method includes preparing a multilayer material for manufacturing a knife, and heating and then forging the multilayer material to form a knife-shaped structure including a blade part and a handle part. The method also includes grinding the blade part to form a sharpened knife-edge and applying mud, including kaolin and white clay, to an entire surface of the knife-shaped structure and removing the mud applied to the blade part. The method further includes heating the knife-shaped structure applied with the mud, and quenching the heated knife-shaped structure through oil-cooling. The method further includes etching a surface of the quenched knife-shaped structure to form a pattern on the surface and grinding the surface-etched knife-shaped structure to form a knife having a final shape.

This application relates to a method of manufacturing a knife using a multilayer material. In one aspect, the method includes preparing a multilayer material for manufacturing a knife, and heating and then forging the multilayer material to form a knife-shaped structure including a blade part and a handle part. The method also includes grinding the blade part to form a sharpened knife-edge and applying mud, including kaolin and white clay, to an entire surface of the knife-shaped structure and removing the mud applied to the blade part. The method further includes heating the knife-shaped structure applied with the mud, and quenching the heated knife-shaped structure through oil-cooling. The method further includes etching a surface of the quenched knife-shaped structure to form a pattern on the surface and grinding the surface-etched knife-shaped structure to form a knife having a final shape.