The present invention discloses a chemical mechanical polishing slurry, and the chemical mechanical polishing slurry comprises silica abrasive particles and accelerating agents, wherein the accelerating agents are selected from pyridine compound, piperidine compound, pyrrolidine compound or pyrrole compound and their derivatives, which have one or more carboxyl groups, and pyrimidine compound and its derivatives, which have one or more amino groups. The chemical mechanical polishing slurry can simultaneously increase the removal rate of both silicon nitride and polysilicon.

A highly reactive conversion coating chemistry is used during CAVF processing of high hardness steel alloys such as AMS 6509 and AMS 6517 steel alloys. This chemistry produces a hard, thin, black conversion coating that is not fully rubbed off by the media during the CAVF process. Distressed material regions on the surface of the alloys are not susceptible to forming the conversion coating and remain white. Visual inspection for the presence of such regions is facilitated.

A highly reactive conversion coating chemistry is used during CAVF processing of high hardness steel alloys such as AMS 6509 and AMS 6517 steel alloys. This chemistry produces a hard, thin, black conversion coating that is not fully rubbed off by the media during the CAVF process. Distressed material regions on the surface of the alloys are not susceptible to forming the conversion coating and remain white. Visual inspection for the presence of such regions is facilitated.

This invention relates to a composition for the brightening and/or passivating of stainless steel after pickling. The invention is based on the discovery that the presence of organic compounds containing multiple hydroxyl groups with at least 3, but not more than 8 carbon atoms as a further ingredient of passivating and brightening solution significantly increases the desmutting performance of pickled stainless steel surfaces. The compositions of the invention are especially useful for the passivating and brightening of stainless steel grades being alloyed with sulfur. The invention thus further encompasses a passivating and brightening process for pickled stainless steel surfaces wherein the stainless steel is alloyed with at least 0.10 at.-% of sulfur.

This invention relates to a composition for the brightening and/or passivating of stainless steel after pickling. The invention is based on the discovery that the presence of organic compounds containing multiple hydroxyl groups with at least 3, but not more than 8 carbon atoms as a further ingredient of passivating and brightening solution significantly increases the desmutting performance of pickled stainless steel surfaces. The compositions of the invention are especially useful for the passivating and brightening of stainless steel grades being alloyed with sulfur. The invention thus further encompasses a passivating and brightening process for pickled stainless steel surfaces wherein the stainless steel is alloyed with at least 0.10 at.-% of sulfur.

A chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) containing (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) contains: (A) Inorganic particles, (B) a substituted aromatic compound with at least one carboxylic acid function as corrosion inhibitor, (C) at least one amino acid, (D) at least one oxidizer, (E) an aqueous medium, wherein the CMP composition (Q) has a pH of from 7 to 10.

A chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) containing (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) contains: (A) Inorganic particles, (B) a substituted aromatic compound with at least one carboxylic acid function as corrosion inhibitor, (C) at least one amino acid, (D) at least one oxidizer, (E) an aqueous medium, wherein the CMP composition (Q) has a pH of from 7 to 10.

Chemical mechanical polishing (CMP) compositions and methods for planarizing a nickel phosphorus (NiP) substrate are described. A NiP CMP method comprises abrading a surface of the substrate with a CMP composition. The CMP composition comprises a colloidal silica abrasive suspended in an aqueous carrier having a pH of less than 2, and containing a primary oxidizing agent comprising hydrogen peroxide, a secondary oxidizing agent comprising a metal ion capable of reversible oxidation and reduction in the presence of NiP and hydrogen peroxide, a chelating agent, and glycine. The chelating agent comprises two or three carboxylic acid substituents capable of chelating to the metal ion of the secondary oxidizing agent.

Chemical mechanical polishing (CMP) compositions and methods for planarizing a nickel phosphorus (NiP) substrate are described. A NiP CMP method comprises abrading a surface of the substrate with a CMP composition. The CMP composition comprises a colloidal silica abrasive suspended in an aqueous carrier having a pH of less than 2, and containing a primary oxidizing agent comprising hydrogen peroxide, a secondary oxidizing agent comprising a metal ion capable of reversible oxidation and reduction in the presence of NiP and hydrogen peroxide, a chelating agent, and glycine. The chelating agent comprises two or three carboxylic acid substituents capable of chelating to the metal ion of the secondary oxidizing agent.

A laminate for a see-through electrode includes a transparent base and a metal layer that is provided on at least one of both surfaces of the transparent base. The metal layer has a first surface and a second surface, the first surface facing the transparent base, the second surface being at a side opposite to the first surface. And the second surface has a kurtosis (Rku) ranging from 1.00 to 3.10, inclusive.