A cleaning device includes at least: a main body including a vapor cleaning chamber configured to perform vapor-cleaning on a workpiece and a dipping cleaning chamber configured to perform dip-cleaning on the workpiece; and a condenser provided on the vapor cleaning chamber to be capable of switching between a communication state and a non-communication state with the vapor cleaning chamber via a vapor inlet port, and configured to condense vapor taken in from the vapor inlet port, in which the condenser includes: a condenser casing in which the vapor inlet port is formed; a cooling pipe through which a coolant flows; and a holding member that holds the cooling pipe to detachably house the cooling pipe in the condenser casing.

A cleaning apparatus includes: a cleaning chamber that accommodates an object to be cleaned; a drying chamber connected to the cleaning chamber; a connecting member connecting a first opening provided in the cleaning chamber and a second opening provided in the drying chamber; a valve element positioned inside the cleaning chamber and facing the first opening; a valve seat facing the valve element; and an actuator that drives the valve element.

A cleaning apparatus includes: a cleaning chamber that accommodates an object to be cleaned; a drying chamber connected to the cleaning chamber; a connecting member connecting a first opening provided in the cleaning chamber and a second opening provided in the drying chamber; a valve element positioned inside the cleaning chamber and facing the first opening; a valve seat facing the valve element; and an actuator that drives the valve element.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a process chamber that provides a treatment space, in which a substrate is treated, in an interior thereof, a fluid supply unit that supplies a fluid into the process chamber, and an exhaust units including an exhaust line, through which the fluid in the process chamber is exhausted, the fluid supply unit includes a supply tank, in which the fluid is stored, a supply line connecting the supply tank and the process chamber, a branch line branched from the supply line at a first point of the supply line, and a controller that controls the fluid supply unit, and the controller controls the fluid supply unit such that the fluid is drained from the supply line through the branch line shortly before the fluid is supplied into the process chamber.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a process chamber that provides a treatment space, in which a substrate is treated, in an interior thereof, a fluid supply unit that supplies a fluid into the process chamber, and an exhaust units including an exhaust line, through which the fluid in the process chamber is exhausted, the fluid supply unit includes a supply tank, in which the fluid is stored, a supply line connecting the supply tank and the process chamber, a branch line branched from the supply line at a first point of the supply line, and a controller that controls the fluid supply unit, and the controller controls the fluid supply unit such that the fluid is drained from the supply line through the branch line shortly before the fluid is supplied into the process chamber.

A system for and method of removing residues, deposits, and debris from a substrate that has been marked by a chemical etching process is disclosed. The system includes one or more upper sprayers that deposit a cleaning solution to a top surface of the product as it passes beneath the one or more upper sprayers. The system further includes at least one upper brush that operates to scrub the top surface of the product after the cleaning solution has been applied thereto. The system optionally includes one or more lower sprayers and lower brushes to clean a bottom surface of the product as it is conveyed through the system. The system further includes an air knife system that assists with drying the product prior to exiting the system. The system further includes a controller that is operable to adjust various system parameters.

This vacuum cleaning device is provided with: a vapor chamber in which vapor of a hydrocarbon-based cleaning agent is generated; a condensation chamber; a first heat exchanger in which heat exchange between the vapor and a heating medium is carried out; a cleaning chamber in which a workpiece can be cleaned under vacuum by the condensed cleaning agent that has been generated in the condensation chamber; a compressor that adiabatically compresses and further heats the heating medium that was heated by the first heat exchanger; a second heat exchanger that carries out heat exchange between the heating medium heated by the compressor and the hydrocarbon-based cleaning agent in the vapor chamber; and a vacuum unit that further cools the heating medium that has been cooled by the second heat exchanger by forcing vacuum expansion of the heating medium. The heating medium cycles through the first heat exchanger, the compressor, the second heat exchanger, and the vacuum unit by the heating medium cooled by the vacuum unit being returned to the first heat exchanger.

This vacuum cleaning device is provided with: a vapor chamber in which vapor of a hydrocarbon-based cleaning agent is generated; a condensation chamber; a first heat exchanger in which heat exchange between the vapor and a heating medium is carried out; a cleaning chamber in which a workpiece can be cleaned under vacuum by the condensed cleaning agent that has been generated in the condensation chamber; a compressor that adiabatically compresses and further heats the heating medium that was heated by the first heat exchanger; a second heat exchanger that carries out heat exchange between the heating medium heated by the compressor and the hydrocarbon-based cleaning agent in the vapor chamber; and a vacuum unit that further cools the heating medium that has been cooled by the second heat exchanger by forcing vacuum expansion of the heating medium. The heating medium cycles through the first heat exchanger, the compressor, the second heat exchanger, and the vacuum unit by the heating medium cooled by the vacuum unit being returned to the first heat exchanger.

A cleaning apparatus includes: a cleaning chamber that accommodates an object to be cleaned; a drying chamber connected to the cleaning chamber; a connecting member connecting a first opening provided in the cleaning chamber and a second opening provided in the drying chamber; a valve element positioned inside the cleaning chamber and facing the first opening; a valve seat facing the valve element; and an actuator that drives the valve element.

A cleaning apparatus for metal smallware is provided having a washing chamber configured to carry out a washing cycle and suction means connected to the washing chamber and configured to carry out a discharge cycle, a main absorption column having a first side and a second side opposite each other, wherein the first side is hydraulically connected to the suction means and the second side is hydraulically connected to a supply duct. In particular, the main absorption column is configured to cause an interaction between a gaseous mixture supplied by the suction means and an absorption liquid supplied by the supply duct to perform chemical absorption of a solvent present in the gaseous mixture having air and solvent, in the absorption liquid, and reduce the concentration of solvent in the gaseous mixture having air and solvent.