A method for producing metal titanium by carrying out electrolysis using an anode and a cathode in a molten salt bath, the method using an anode containing metal titanium as the anode, the method comprising a titanium deposition step of depositing metal titanium on the cathode, wherein, in the titanium deposition step, a temperature of the molten salt bath is from 250° C. or more and 600° C. or less, and an average current density of the cathode in a period from the start to 30 minutes later of the titanium deposition step is maintained in a range of 0.01 A/cm.sup.2 to 0.09 A/cm.sup.2.

Lead is recycled from lead paste of lead acid batteries in a process that employs alkaline desulfurization followed by formation of plumbite that is then electrolytically converted to pure lead. Remaining insoluble lead dioxide is removed from the lead plumbite solution and reduced to produce lead oxide that can be fed back to the recovery system. Sulfate is recovered as sodium sulfate, while the so produced lead oxide can be added to lead paste for recovery.

Lead is recycled from lead paste of lead acid batteries in a process that employs alkaline desulfurization followed by formation of plumbite that is then electrolytically converted to pure lead. Remaining insoluble lead dioxide is removed from the lead plumbite solution and reduced to produce lead oxide that can be fed back to the recovery system. Sulfate is recovered as sodium sulfate, while the so produced lead oxide can be added to lead paste for recovery.

The invention relates to a method for manufacturing a plate material which is used in the electrochemical process of metal as a part of a cathode on which surface a metal is deposited. The surface roughness of the plate material for the adhesion between the metal deposit and the plate material is achieved with at least one treatment in a coil processing line.

The invention relates to a method for manufacturing a plate material which is used in the electrochemical process of metal as a part of a cathode on which surface a metal is deposited. The surface roughness of the plate material for the adhesion between the metal deposit and the plate material is achieved with at least one treatment in a coil processing line.

The present invention concerns a process for the recovery of lead from a lead pastel electrolytically, where the pastel contains lead sulfate. The process provides for the leaching of the non-desulfurised pastel and the subsequent removal of the sulfates by precipitation; the leachate containing the lead ions is then subjected to electrolysis for the recovery of metal lead. The present invention further relates to a process for the recovery of lead accumulator components, wherein the lead contained in the pastel of the accumulators is recovered according to the aforesaid process.

The present invention concerns a process for the recovery of lead from a lead pastel electrolytically, where the pastel contains lead sulfate. The process provides for the leaching of the non-desulfurised pastel and the subsequent removal of the sulfates by precipitation; the leachate containing the lead ions is then subjected to electrolysis for the recovery of metal lead. The present invention further relates to a process for the recovery of lead accumulator components, wherein the lead contained in the pastel of the accumulators is recovered according to the aforesaid process.

A vapor deposition metal mask substrate includes a nickel-containing metal sheet including a obverse surface and a reverse surface, which is opposite to the obverse surface. At least one of the obverse surface and the reverse surface is a target surface for placing a resist layer. The target surface has a surface roughness Sa of less than or equal to 0.019 m. The target surface has a surface roughness Sz of less than or equal to 0.308 m.

A vapor deposition metal mask substrate includes a nickel-containing metal sheet including a obverse surface and a reverse surface, which is opposite to the obverse surface. At least one of the obverse surface and the reverse surface is a target surface for placing a resist layer. The target surface has a surface roughness Sa of less than or equal to 0.019 m. The target surface has a surface roughness Sz of less than or equal to 0.308 m.

A vapor deposition metal mask substrate includes a nickel-containing metal sheet including a obverse surface and a reverse surface, which is opposite to the obverse surface. At least one of the obverse surface and the reverse surface is a target surface for placing a resist layer. The target surface has a surface roughness Sa of less than or equal to 0.019 m. The target surface has a surface roughness Sz of less than or equal to 0.308 m.