Patent classifications
C25D1/22
MOULD FOR ELECTROPLATING AND ITS MANUFACTURING PROCESS
A process for manufacturing a mould including: a) providing a first substrate made of photosensitive glass of thickness of at least equal to the height of the mould, b) illuminating the first substrate with UV rays through a mask the windows of which correspond to the depression of the mould in order to create illuminated zones, c) carrying out a heat treatment on the first substrate obtained in step b) in order to crystallize the illuminated zones, d) providing a second substrate having at least one conductive layer on its surface, e) joining the first substrate obtained in step c) with the second substrate so that the conductive layer is located between the first substrate and the second substrate, f) removing the illuminated and crystallized zones of the first substrate so as to uncover the conductive layer, forming a cavity with sidewalls and a bottom occupied by the conductive layer of the mould.
Method for producing tungsten carbide
Provided is a method for efficiently producing tungsten carbide from a raw material mixture comprising at least one valuable containing tungsten. The present invention relates to a method for producing tungsten carbide, comprising the steps of subjecting a raw material mixture comprising at least one valuable containing tungsten to electrolysis using an organic electrolytic solution to dissolve tungsten in the electrolytic solution; and calcining the electrolytic solution containing dissolved tungsten at a temperature of 800 C. or more to obtain tungsten carbide.
Method for producing tungsten carbide
Provided is a method for efficiently producing tungsten carbide from a raw material mixture comprising at least one valuable containing tungsten. The present invention relates to a method for producing tungsten carbide, comprising the steps of subjecting a raw material mixture comprising at least one valuable containing tungsten to electrolysis using an organic electrolytic solution to dissolve tungsten in the electrolytic solution; and calcining the electrolytic solution containing dissolved tungsten at a temperature of 800 C. or more to obtain tungsten carbide.
CONDUCTIVE MICRO PIN
A conductive micro pin includes a body having a first end surface, a second end surface, a first side surface connecting the first end surface and the second end surface, and a first corner between the first end surface and the first side surface, in which the first side surface is substantially flat, and the first corner is substantially rounded.
CONDUCTIVE MICRO PIN
A conductive micro pin includes a body having a first end surface, a second end surface, a first side surface connecting the first end surface and the second end surface, and a first corner between the first end surface and the first side surface, in which the first side surface is substantially flat, and the first corner is substantially rounded.
Copper foil provided with carrier foil, manufacturing method of the copper foil provided with carrier foil, and copper clad laminate for laser drilling manufactured by using the copper foil provided with carrier foil
An object of the present invention is to improve the laser drilling performance of a copper clad laminate whose black-oxide treated surface is used as a laser drilled surface. To achieve the object, a copper foil provided with a carrier foil 1 comprising a layer structure of the carrier foil 2/the releasing layer 3/the bulk copper layer 4 characterized in that metal element-containing particles 5 are disposed between the releasing layer 3 and the bulk copper layer 4 is employed. If the present copper foil provided with a carrier foil is used, a black-oxide treated layer having a color tone excellent in the laser drilling performance can be formed on the surface of the bulk copper layer in the copper clad laminate manufactured.
Copper foil provided with carrier foil, manufacturing method of the copper foil provided with carrier foil, and copper clad laminate for laser drilling manufactured by using the copper foil provided with carrier foil
An object of the present invention is to improve the laser drilling performance of a copper clad laminate whose black-oxide treated surface is used as a laser drilled surface. To achieve the object, a copper foil provided with a carrier foil 1 comprising a layer structure of the carrier foil 2/the releasing layer 3/the bulk copper layer 4 characterized in that metal element-containing particles 5 are disposed between the releasing layer 3 and the bulk copper layer 4 is employed. If the present copper foil provided with a carrier foil is used, a black-oxide treated layer having a color tone excellent in the laser drilling performance can be formed on the surface of the bulk copper layer in the copper clad laminate manufactured.
HOMOGENEOUS SOLID METALLIC ANODE FOR THIN FILM MICROBATTERY
A battery, comprising a cathode comprising a cathode material in contact with a cathode current collector. The battery also comprises an electrolyte. The battery also comprises an anode comprising an electroplated homogeneous solid metallic alloy comprising 100 ppm to 1000 ppm Bi and 100 ppm to 1000 ppm In, and a remainder Zn.
HOMOGENEOUS SOLID METALLIC ANODE FOR THIN FILM MICROBATTERY
A battery, comprising a cathode comprising a cathode material in contact with a cathode current collector. The battery also comprises an electrolyte. The battery also comprises an anode comprising an electroplated homogeneous solid metallic alloy comprising 100 ppm to 1000 ppm Bi and 100 ppm to 1000 ppm In, and a remainder Zn.
CATHODE FOR THIN FILM MICROBATTERY
A battery comprising an anode comprising anode material in contact with a metal anode current collector. The battery further comprises a cathode comprising cathode material in contact with a cathode current collector comprising a transparent conducting oxide (TCO). The battery further comprises an electrolyte with a pH in a range of 3 to 7.