The present invention provides a methodology of making lead foam by an electrochemical process in which non-conducting poly urethane foam was metalized using palladium chloride solution which was then coated with lead using the plating bath containing fluoboric acid, Lead as fluoborate solutions, boric acid and urea. The process was operated at a current density ranging from 0.5 A/dm.sup.2 to 5 A/dm.sup.2, bath pH from 0.5 to 2.0, at temperature range from 30 C. to 50 C., followed with suitable post plating treatments. The surface morphology of the lead foam thus obtained was studied. The composition and purity of the lead foam was characterized with XRD. The porosity obtained depends upon the rate of deposition. The average value of the porosity realized in the range 86-79% with respect to time of deposition 2-6 h and the corresponding thickness of 45 to 60 micron.

Provided is an anode for electroplating which uses an aqueous solution as an electrolytic solution, and the anode which is low in potential when compared with a conventional anode, able to decrease an electrolytic voltage and an electric energy consumption rate and may also be used as an anode for electroplating various types of metals, and which is low in cost. Also provided is a method for electroplating which uses an aqueous solution as an electrolytic solution, in which the anode is low in potential and electrolytic voltage, thereby making it possible to decrease the electric energy consumption rate. The anode for electroplating of the present invention is an anode for electroplating which uses an aqueous solution as an electrolytic solution, in which a catalytic layer containing amorphous ruthenium oxide and amorphous tantalum oxide is formed on a conductive substrate.

A method for electrodeposition of pure phase crystalline SnSb from deep eutectic ethaline is described. Thin films of SnSb were synthesized using a solution containing equimolar Sn(II) and Sb(III) chlorides as precursors, and ethaline (1:2 by weight of choline chloride and ethylene chloride) was used as the solvent for the electrodeposition solution. The purity of the product is important, as the impure phase is found to be detrimental to the material's lifetime as both a sodium-ion and a lithium-ion anode. For sodium-ions, the directly deposited electrode was able to retain 95% capacity after 300 cycles, and only fall below 80% capacity retention after 800 cycles when cycled versus sodium. The electrodeposited SnSb used as a Li-ion battery anode showed stability, only falling below 80% capacity retention after 400 cycles.

A method for electrodeposition of pure phase crystalline SnSb from deep eutectic ethaline is described. Thin films of SnSb were synthesized using a solution containing equimolar Sn(II) and Sb(III) chlorides as precursors, and ethaline (1:2 by weight of choline chloride and ethylene chloride) was used as the solvent for the electrodeposition solution. The purity of the product is important, as the impure phase is found to be detrimental to the material's lifetime as both a sodium-ion and a lithium-ion anode. For sodium-ions, the directly deposited electrode was able to retain 95% capacity after 300 cycles, and only fall below 80% capacity retention after 800 cycles when cycled versus sodium. The electrodeposited SnSb used as a Li-ion battery anode showed stability, only falling below 80% capacity retention after 400 cycles.