Method for electroplating a metal onto a flat substrate P. Surfaces are electrically polarized for metal deposition by feeding thereto at least one first and second forward-reverse pulse current sequences. The first forward-reverse pulse current sequence includes a first forward pulse generating a first cathodic current during a first forward pulse duration t.sub.f1 and having a first forward pulse peak current i.sub.f1, and a first reverse pulse generating a first anodic current during a first reverse pulse duration t.sub.r1 and having a first reverse pulse peak current i.sub.r1, the second forward-reverse pulse current sequence including a second forward pulse generating a second cathodic current during a second forward pulse duration t.sub.f2 and having a second forward pulse peak current i.sub.f2, and a second reverse pulse generating a second anodic current during a second reverse pulse duration t.sub.r2, the second reverse pulse having a second reverse pulse peak current i.sub.r2.

Method for electroplating a metal onto a flat substrate P. Surfaces are electrically polarized for metal deposition by feeding thereto at least one first and second forward-reverse pulse current sequences. The first forward-reverse pulse current sequence includes a first forward pulse generating a first cathodic current during a first forward pulse duration t.sub.f1 and having a first forward pulse peak current i.sub.f1, and a first reverse pulse generating a first anodic current during a first reverse pulse duration t.sub.r1 and having a first reverse pulse peak current i.sub.r1, the second forward-reverse pulse current sequence including a second forward pulse generating a second cathodic current during a second forward pulse duration t.sub.f2 and having a second forward pulse peak current i.sub.f2, and a second reverse pulse generating a second anodic current during a second reverse pulse duration t.sub.r2, the second reverse pulse having a second reverse pulse peak current i.sub.r2.

Disclosed herein is a A polyalkanolamine including the structure of formula L1

[00001]${\left[{\text{A}}^{\text{L}}\right]}_{\text{n}}{\left[{\text{B}}^{\text{L}}\right]}_{\text{m}}$

wherein A.sup.L is B.sup.L is X.sup.L1, X.sup.L2, X.sup.L3 are independently selected from a C.sub.1 to C.sub.6 alkanediyl; Ar.sup.L is a 5 or 6 membered N-heteroaromatic ring system including from 1 to 4 N atoms, which may be unsubstituted or substituted by C.sub.1 to C.sub.6 alkyl; n is an integer of from 2 to 350; m is 0 or an integer of from 1 to 600; o is 1 or an integer of from 2 to 25; B.sup.L1 is a continuation of the backbone B.sup.L by branching; X.sup.L11, X.sup.L12, X.sup.L13 are independently selected from a C.sub.1 to C.sub.6 alkanediyl; X.sup.L21 is a C.sub.1 to C.sub.6 alkanediyl; and derivatives thereof obtainable by N-protonation, N-quaternization, substitution, or polyalkoxylation.

Disclosed herein is a A polyalkanolamine including the structure of formula L1

[00001]${\left[{\text{A}}^{\text{L}}\right]}_{\text{n}}{\left[{\text{B}}^{\text{L}}\right]}_{\text{m}}$

wherein A.sup.L is B.sup.L is X.sup.L1, X.sup.L2, X.sup.L3 are independently selected from a C.sub.1 to C.sub.6 alkanediyl; Ar.sup.L is a 5 or 6 membered N-heteroaromatic ring system including from 1 to 4 N atoms, which may be unsubstituted or substituted by C.sub.1 to C.sub.6 alkyl; n is an integer of from 2 to 350; m is 0 or an integer of from 1 to 600; o is 1 or an integer of from 2 to 25; B.sup.L1 is a continuation of the backbone B.sup.L by branching; X.sup.L11, X.sup.L12, X.sup.L13 are independently selected from a C.sub.1 to C.sub.6 alkanediyl; X.sup.L21 is a C.sub.1 to C.sub.6 alkanediyl; and derivatives thereof obtainable by N-protonation, N-quaternization, substitution, or polyalkoxylation.

A method of controlling chemical concentration in electrolyte includes measuring a chemical concentration in an electrolyte, wherein the electrolyte is contained in a tank; and increasing a vapor flux through an exhaust pipe connected to the tank when the measured chemical concentration is lower than a control lower limit value.

A method of controlling chemical concentration in electrolyte includes measuring a chemical concentration in an electrolyte, wherein the electrolyte is contained in a tank; and increasing a vapor flux through an exhaust pipe connected to the tank when the measured chemical concentration is lower than a control lower limit value.

The invention relates to metallic substrates surface coated with a coating layer comprising a metal and an additive.

A method of producing copper oxide powder includes a high-purity copper acidic solution preparation step (S01) of preparing an acidic solution containing 99.99% by mass or more of copper regarding metal components as 100% by mass, an organic acid salt addition step (S02) of adding an organic acid salt to this high-purity copper acidic solution, an organic acid copper production step (S03) of generating an organic acid copper by reacting the added organic acid salt with copper ions, an organic acid copper recovery step (S04) of recovering the obtained organic acid copper, and a heating step (S05) of forming copper oxide powder by heating the recovered organic acid copper, in which the organic acid forming the organic acid salt has 10 or less carbon atoms, and copper oxide powder.

A method of producing copper oxide powder includes a high-purity copper acidic solution preparation step (S01) of preparing an acidic solution containing 99.99% by mass or more of copper regarding metal components as 100% by mass, an organic acid salt addition step (S02) of adding an organic acid salt to this high-purity copper acidic solution, an organic acid copper production step (S03) of generating an organic acid copper by reacting the added organic acid salt with copper ions, an organic acid copper recovery step (S04) of recovering the obtained organic acid copper, and a heating step (S05) of forming copper oxide powder by heating the recovered organic acid copper, in which the organic acid forming the organic acid salt has 10 or less carbon atoms, and copper oxide powder.

The present invention provides a copper electroplating solution including: (A) a sulfate ion; (B) a compound represented by the following general formula (1); and (C) a copper ion, wherein the copper electroplating solution has a content of the component (B) of from 0.3 part by mass to 50 parts by mass and a content of the component (C) of from 5 parts by mass to 50 parts by mass with respect to 100 parts by mass of a content of the component (A):

##STR00001##

where R.sup.1 and R.sup.2 each independently represent a hydrogen atom, a sodium atom, a potassium atom, or an alkyl group having 1 to 5 carbon atoms, and “n” represents 1 or 2, a method of producing the copper electroplating solution, and a copper electroplating method including using the copper electroplating solution.