A method of forming a coated component using an additive manufacturing system including building a body portion of the component on a build plate. An outer surface of the body portion can include an indentation resulting from the additive manufacturing system. The method further includes performing at least one post-build process on the body portion. The method yet further includes forming a coating layer on an outer surface of the processed body portion. The coating layer may surround a portion of the body component and may impregnate the indentation. A thickness of the coating layer may be a function of at least one of surface roughness, size of the indentation, or a diameter of particles used to build the additive manufactured bracket.

A method for microstructure modification of conducting lines is provided. An electroplating process is performed to deposit the metal thin film/conducting line(s) with a face-centered cubic (FCC) structure and a preferred crystallographic orientation over a surface of a substrate. The metal thin film/ conducting line(s) is subsequently subjected to a thermal annealing process to modify its microstructure with the grain sizes in a range of 5 μm to 100 μm. The thermal annealing process is conducted at the temperature of above 25 degrees Celsius and below 240 degrees Celsius.

A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

According to a method for manufacturing a hologram pattern of the present invention, the hologram pattern is applied to a metal plating layer (not a metal specimen). Accordingly, materials which can be plated are widely applicable. The hologram pattern, which becomes appeared in various colors depending on light and user's vision, can be formed with a simple process.

According to a method for manufacturing a hologram pattern of the present invention, the hologram pattern is applied to a metal plating layer (not a metal specimen). Accordingly, materials which can be plated are widely applicable. The hologram pattern, which becomes appeared in various colors depending on light and user's vision, can be formed with a simple process.

Provided are a semiconductor material based on metal nanowires and a porous nitride, and a preparation method thereof. The semiconductor material includes: a substrate; a buffer layer formed on the substrate; and a composite material layer formed on the buffer layer the composite material layer includes: a transverse porous nitride template layer; and a plurality of metal nanowires filled in pores of the transverse porous nitride template layer.

A method to enable electroplating of nano-silver like gold material ([Ag.sub.25(SR).sub.18].sup.− where SR is a thiolate). The method includes activating a surface of a substrate using first counter flow conditioning rinses (CFCR) with a solution of acetone followed by a solution of alcohol; rinsing the substrate surface; drying using a nitrogen gas; cleaning using a soak-clean solution; activating using an activator solution; rinsing using an ammonia dead rinse solution; conditioning using second CFCR; etching using hydrochloric acid; rinsing third CFCR; depositing woods nickel strike material and electrolytic nickel metal; electrodeposition of a gold strike metal to the surface of the substrate; and electroplating of a nano-silver like gold material and a nano-silver like gold alloy material on to the surface of the substrate using an electroplating solution and a rate of deposition 0.0001 μm/h.

Treatment solutions and methods for improving adhesion of gold electroplating onto metal surfaces are provided herein. More specifically, the disclosure relates to micro-etching stainless steel surfaces using to remove any organic contamination and chromium oxide formed on the surface, neutralize and strip the surface of any iron content, and repassivate the surface with a thin chromium oxide layer, prior to gold electroplating of the stainless steel surfaces.

A metallic terminal includes a terminal body, a first plating layer, a second plating layer, and a third plating layer. The first plating layer is on the terminal body, and the thickness of the first plating layer at the bent portion of the terminal body is 0.3 to 1.75 micrometers, and the thickness of rest portions of the first plating layer is 2 to 10 micrometers. The second plating layer is on the first plating layer and corresponds to the contact portion of the terminal body, and the thickness of the second plating layer is 0.5 to 2 micrometers. The third plating layer is on the first plating layer and corresponds to the soldering portion of the terminal body, and the thickness of the third plating layer is 0.01 to 0.1 micrometers. A manufacturing method of metallic terminal is also provided.