A bonding structure formed on a substrate includes an indium layer and a passivating nickel plating formed on the indium layer. The nickel plating serves to prevent a reaction involving the indium layer.

A bonding structure formed on a substrate includes an indium layer and a passivating nickel plating formed on the indium layer. The nickel plating serves to prevent a reaction involving the indium layer.

Systems, methods, and devices related to hollow metallic objects are disclosed. A solid sacrificial material is formed in a desired three-dimensional shape, and a precursor is deposited about an exterior surface of the solid sacrificial material. The precursor is used to deposit a first conductor about the exterior surface of the solid sacrificial material, and the solid sacrificial material is then removed. The first conductor assumes the three-dimensional shape, and is substantially hollow after removing the solid sacrificial material. Contemplated hollow metallic objects include waveguides, heat pipes, and vapor chambers.

Cards made in accordance with the invention include a specially treated thin decorative layer attached to a thick core layer of metal or ceramic material, where the thin decorative layer is designed to provide selected color(s) and/or selected texture(s) to a surface of the metal cards. Decorative layers for use in practicing the invention include: (a) an anodized metal layer; or (b) a layer of material derived from plant or animal matter (e.g., wood, leather); or (c) an assortment of aggregate binder material (e.g., cement, mortar, epoxies) mixed with laser reactive materials (e.g., finely divided carbon); or (d) a ceramic layer; and (e) a layer of crystal fabric material. The cards may be dual interface smart cards which can be read in a contactless manner and/or via contacts.

Cards made in accordance with the invention include a specially treated thin decorative layer attached to a thick core layer of metal or ceramic material, where the thin decorative layer is designed to provide selected color(s) and/or selected texture(s) to a surface of the metal cards. Decorative layers for use in practicing the invention include: (a) an anodized metal layer; or (b) a layer of material derived from plant or animal matter (e.g., wood, leather); or (c) an assortment of aggregate binder material (e.g., cement, mortar, epoxies) mixed with laser reactive materials (e.g., finely divided carbon); or (d) a ceramic layer; and (e) a layer of crystal fabric material. The cards may be dual interface smart cards which can be read in a contactless manner and/or via contacts.

A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

In a crystal grain size reduction method for a plating film, electroplating is performed in a condition where ions of a plating metal, a nanocarbon, and an anion based surfactant as a dispersion agent for dispersing the nanocarbon have been blended in a plating solution.

In a crystal grain size reduction method for a plating film, electroplating is performed in a condition where ions of a plating metal, a nanocarbon, and an anion based surfactant as a dispersion agent for dispersing the nanocarbon have been blended in a plating solution.

Disclosed is a method for the production of electroplated components. In the disclosed method, an edge layer of a component to be coated is subjected to a mechanical treatment in which the edge layer is deformed at least in portions, consequently the structure of the edge layer being modified at least in portions and hydrogen traps being produced in the modified portions of the edge layer.