A coated electrode includes an electrode, a coating configured to immobilize biomolecules, and a coating configured to improve electron transfer rate. Methods of making the coated electrode are also provided. A biosensor comprises a plurality of electrodes, each electrode including the coated electrode.

A coated electrode includes an electrode, a coating configured to immobilize biomolecules, and a coating configured to improve electron transfer rate. Methods of making the coated electrode are also provided. A biosensor comprises a plurality of electrodes, each electrode including the coated electrode.

Provided is a method of forming a complex plating film using multi-layer graphene metal particles. The method of forming the plating film may include preparing a powder with a metal particle structure coated with multi-layer graphene, and forming a plating film by adding the powder to a plating solution through electric plating.

In examples, an apparatus comprises a substrate having opposite first and second surfaces. The substrate includes a first opening through the substrate. The substrate includes a first sealing layer covering an inner surface of the first opening, with the inner surface extending between the first and second surfaces. The substrate includes contact pads on the second surface. The apparatus also comprises a fluid sensor having a sensor surface facing the second surface and the first opening. The apparatus further includes metal interconnects coupled between the sensor surface and the contact pads. The apparatus also includes a second sealing layer between the second surface and the sensor surface, in which the second sealing layer surrounds the metal interconnects and includes a second opening below the first opening, and at least part of the sensor surface is exposed through the first and second openings.

In examples, an apparatus comprises a substrate having opposite first and second surfaces. The substrate includes a first opening through the substrate. The substrate includes a first sealing layer covering an inner surface of the first opening, with the inner surface extending between the first and second surfaces. The substrate includes contact pads on the second surface. The apparatus also comprises a fluid sensor having a sensor surface facing the second surface and the first opening. The apparatus further includes metal interconnects coupled between the sensor surface and the contact pads. The apparatus also includes a second sealing layer between the second surface and the sensor surface, in which the second sealing layer surrounds the metal interconnects and includes a second opening below the first opening, and at least part of the sensor surface is exposed through the first and second openings.

The present invention provides a catalyst for hydrogen peroxide decomposition with which hydrogen peroxide present in acid-containing water to be treated can be efficiently decomposed at low cost and which is less apt to dissolve away in the water being treated, can be stably used over a long period, and renders acid recovery and recycling possible. The present invention has solved the problems with a catalyst for hydrogen peroxide decomposition which is for use in decomposing hydrogen peroxide present in acid-containing water to be treated, the catalyst including a base and, a catalyst layer that is amorphous, includes a platinum-group metal having catalytic function and a Group-6 element metal having catalytic function and is formed over the base.

The present invention provides a catalyst for hydrogen peroxide decomposition with which hydrogen peroxide present in acid-containing water to be treated can be efficiently decomposed at low cost and which is less apt to dissolve away in the water being treated, can be stably used over a long period, and renders acid recovery and recycling possible. The present invention has solved the problems with a catalyst for hydrogen peroxide decomposition which is for use in decomposing hydrogen peroxide present in acid-containing water to be treated, the catalyst including a base and, a catalyst layer that is amorphous, includes a platinum-group metal having catalytic function and a Group-6 element metal having catalytic function and is formed over the base.

A method of plating a copper substrate with gold that reduces or eliminates the presence of microvoids at the interface of the gold/copper substrate is described. Suitably, live entry of the substrate into the plating bath is performed with application of external current to the bath such that no portion of the substrate is exposed to the bath for more than one second without the application of the external current. Increase of the applied current for gold strike to the mass-transfer-limit for gold reduction accomplishes the full measure of improvement in eliminating microvoids.

A method of plating a copper substrate with gold that reduces or eliminates the presence of microvoids at the interface of the gold/copper substrate is described. Suitably, live entry of the substrate into the plating bath is performed with application of external current to the bath such that no portion of the substrate is exposed to the bath for more than one second without the application of the external current. Increase of the applied current for gold strike to the mass-transfer-limit for gold reduction accomplishes the full measure of improvement in eliminating microvoids.

In accordance with one embodiment of the present disclosure, a method for depositing metal on a reactive metal film on a workpiece includes electrochemically depositing a metallization layer on a seed layer formed on a workpiece using a plating electrolyte having at least one plating metal ion, a pH range of about 1 to about 6, and applying a cathodic potential in the range of about −0.5 V to about −4 V. The workpiece includes a barrier layer disposed between the seed layer and a dielectric surface of the workpiece, the barrier layer including a first metal having a standard electrode potential more negative than 0 V and the seed layer including a second metal having a standard electrode potential more positive than 0 V.