Patent classifications
C25D3/50
Electrolyte for the deposition of anthracite/black rhodium/ruthenium alloy layers
The present invention is directed toward an electrolyte which allows for electrolytically producing a black metal layer consisting of rhodium and ruthenium. The present invention also relates to a method for producing a corresponding article, and to the use of the electrolyte.
Electrolyte for the deposition of anthracite/black rhodium/ruthenium alloy layers
The present invention is directed toward an electrolyte which allows for electrolytically producing a black metal layer consisting of rhodium and ruthenium. The present invention also relates to a method for producing a corresponding article, and to the use of the electrolyte.
ELECTRODE COATING
The present invention provides electrodes comprising a core substrate, and internal layer coating, and an external layer coating and processes to prepare such electrodes.
ELECTRODE COATING
The present invention provides electrodes comprising a core substrate, and internal layer coating, and an external layer coating and processes to prepare such electrodes.
Composite array electrode, preparation method thereof and use thereof
Provided are composite array electrode, preparation method thereof and use thereof. The composite array electrode comprises a microelectrode array substrate, and a modification layer formed on a surface of a microelectrode of the microelectrode array substrate, wherein the modification layer comprises a plurality of electrically conductive layers arranged at intervals on the surface of the microelectrode, an insulating layer arranged on the surface of the microelectrode except the electrically conductive layers, and wherein material for the electrically conductive layers comprises one or more of nano platinum, nano iridium, conductive polymer and carbon nanotubes. The composite array electrode effectively eliminates the influence of edge effect such that the electric field distributes uniformly on the microelectrode surface of the composite array electrode, significantly improving electrochemical performance and detection capability of the electrode.
High temperature corrosion resistant composite structure consisting of ruthenium and its alloys
A structure which is resistant to corrosion at high temperatures comprises a layer of ruthenium and/or ruthenium alloy and a layer of a refractory metal having a high strength at high temperatures, such as rhenium. Further, the structure may include a layer of ceramic such as zirconia or hafnia on the exposed face of the ruthenium layer. Alternative embodiments of the present invention include a catalyst formed from a low strength support structure with a first metal layer and a second ruthenium catalytic layer on top of the first metal layer. Another alternative embodiment of the present invention includes the formation of high purity ruthenium electrodes that are resistant to corrosion at high temperatures.
High temperature corrosion resistant composite structure consisting of ruthenium and its alloys
A structure which is resistant to corrosion at high temperatures comprises a layer of ruthenium and/or ruthenium alloy and a layer of a refractory metal having a high strength at high temperatures, such as rhenium. Further, the structure may include a layer of ceramic such as zirconia or hafnia on the exposed face of the ruthenium layer. Alternative embodiments of the present invention include a catalyst formed from a low strength support structure with a first metal layer and a second ruthenium catalytic layer on top of the first metal layer. Another alternative embodiment of the present invention includes the formation of high purity ruthenium electrodes that are resistant to corrosion at high temperatures.
METHOD FOR MICROSTRUCTURE MODIFICATION OF CONDUCTING LINES
A method for microstructure modification of conducting lines is provided. An electroplating process is performed to deposit the metal thin film/conducting line(s) with a face-centered cubic (FCC) structure and a preferred crystallographic orientation over a surface of a substrate. The metal thin film/ conducting line(s) is subsequently subjected to a thermal annealing process to modify its microstructure with the grain sizes in a range of 5 μm to 100 μm. The thermal annealing process is conducted at the temperature of above 25 degrees Celsius and below 240 degrees Celsius.
Method for manufacturing hologram pattern and specimen including metal plating layer having hologram pattern on surface thereof
According to a method for manufacturing a hologram pattern of the present invention, the hologram pattern is applied to a metal plating layer (not a metal specimen). Accordingly, materials which can be plated are widely applicable. The hologram pattern, which becomes appeared in various colors depending on light and user's vision, can be formed with a simple process.
POROUS BODY, ELECTROCHEMICAL CELL, AND METHOD FOR PRODUCING POROUS BODY
A porous body includes: a porous electrically conductive base material having communication voids and a skeleton forming the voids; and a metal coating film provided on at least a portion of a surface of the skeleton, wherein a porosity of the porous electrically conductive base material is 10% or more, 70% by mass or more of the metal coating film exists in a region lying within 30% from one surface of the porous body as measured in the thickness direction, and a thickness of an oxide film between the skeleton and the metal coating film is 2 nm or less in at least a part of the oxide film. An amount of a metal for the metal coating film has been reduced and growth of an oxide film between the base material and the metal coating film has been suppressed.