Patent classifications
C25D5/022
METHOD FOR OPTICALLY INSCRIBING AND/OR MARKING ROUND STOCK
A method for producing round stock (10) which is provided with at least one inscription and/or marking (16), at least the surface (12) of the round stock (10) consisting of a metallic material, in particular of chromium or steel, for example of hardened steel, chromium-plated steel or stainless steel. In order to improve this method such that disadvantages and shortcomings are avoided, the method includes the following steps: placing on the surface (12) at least one cover (20) which is adapted to the shape of the surface (12) and in particular has the inscription and/or marking (16), such that the region to be provided with the inscription and/or marking (16) is not covered by the cover (20),—exposing the round stock (10) to a first electrolyte (30) together with the cover (20), material being removed from the surface (12) by said electrolyte in the region to be provided with the inscription and/or the marking (16) while producing depressions (14), and—exposing the round stock (10) together with the cover (20) and the depressions (14) not covered by the cover (20) to a second electrolyte (32) by which the depressions (14) are filled to produce the inscription and/or marking (16) which differs from the surface (12) optically, in particular with respect to color. The present invention also relates to round stock (10) which is manufactured from a metallic material, with the round stock being provided with a correspondingly produced inscription and/or marking (16).
Systems and Methods for Forming Metal Matrix Composites
In certain embodiments, a method comprises placing nonconductive fibers adjacent to a conductive material, immersing the nonconductive fibers and the conductive material in a plating medium, and applying a voltage to the conductive material to initiate electroplating. The method further comprises engulfing, by electroplating, the nonconductive fibers in metal to create a metal matrix composite.
PLATING APPARATUS AND PLATING METHOD
To improve uniformity of a plating film-thickness formed on a substrate.
A plating module 400 includes a plating tank 410 for housing a plating solution, a substrate holder 440 for holding a substrate Wf, an anode 430 housed within the plating tank 410, an anode mask 460 arranged between the substrate Wf held by the substrate holder 440 and the anode 430 and provided with an opening 466 in a center, and an ionically resistive element 450 arranged at an interval from the anode mask 460 between the substrate Wf held by the substrate holder 440 and the anode mask 460 and provided with a plurality of holes.
SYSTEMS AND METHODS FOR ELECTROCHEMICAL ADDITIVE MANUFACTURING OF PARTS USING CAPACITIVE SENSING
An electrochemical deposition system includes a cathode and a printhead. The printhead is spaced apart from the cathode, movable relative to the cathode, and comprises a plurality of deposition anodes. The system further comprises a capacitive sensor that includes a first electrically-conductive layer, at a known location relative to the cathode, and a second electrically-conductive layer, at a known location relative to the printhead. The system additionally includes a processor, electrically coupled with the capacitive sensor and configured to determine a distance between the cathode and the printhead in response to a capacitance of the capacitive sensor.
Internal airfoil component electroplating
Method and apparatus are provided for electroplating a surface area of an internal wall defining a cooling cavity present in a gas turbine engine airfoil component.
Tin plating solution, tin plating equipment, and method for fabricating semiconductor device using the tin plating solution
A tin plating solution and a method for fabricating a semiconductor device are provided. The tin plating solution comprises tin ions supplied from a soluble tin electrode, an aliphatic sulfonic acid having a carbon number of 1 to 10, an anti-oxidant, a wetting agent, and a grain refiner that is an aromatic carbonyl compound.
Printed circuit boards having profiled conductive layer and methods of manufacturing same
A multilayer printed circuit board is provided. The multilayer printed circuit board includes a core, a first conductive layer coupled to the core, an insulating layer covering the first conductive layer, and a second conductive layer spaced from the first conductive layer by the insulating layer. The first conductive layer includes a first portion having a first thickness and a second portion having a second thickness greater than the first thickness. The second conductive layer is electrically coupled to the second portion of the first conductive layer by a conductive via extending through the insulating layer.
Method for Fixturing a Gas Turbine Engine Component for an Electroplating Process
A method of using a masking device to mask a portion of a gas turbine engine component for an electroplating process is provided. The masking device includes a main body having sidewalls, a removeable coverplate having an end plate and one or more locking tabs, a fastener located at least partially within the main body, and a shank engaged with the fastener. The method includes placing the gas turbine engine component through an opening in the main body such that the component is held within the main body by a retention slot. The method includes sliding the one or more locking tabs of the removeable coverplate through the opening in the main body such that the removeable coverplate covers the opening of the main body. The method includes securing the one or more locking tabs in one or more relief slots in the sidewalls of the main body.
Method of forming one or more metal and/or metal alloy layers in processes for making transducers in sliders, and related sliders
Disclosed herein are methods of forming one or more transducer elements in a transducer region of a slider by electrodepositing one or more metal ions from an ionic liquid solvent, and related sliders.
Method for controlled growth of carbon nanotubes in a vertically aligned array
Template-guided growth of carbon nanotubes using anodized aluminum oxide nanopore templates provides vertically aligned, untangled planarized arrays of multiwall carbon nanotubes with Ohmic back contacts. Growth by catalytic chemical vapor deposition results in multiwall carbon nanotubes with uniform diameters and crystalline quality, but varying lengths. The nanotube lengths can be trimmed to uniform heights above the template surface using ultrasonic cutting, for example. The carbon nanotube site density can be controlled by controlling the catalyst site density. Control of the carbon nanotube site density enables various applications. For example, the highest possible site density is preferred for thermal interface materials, whereas, for field emission, significantly lower site densities are preferable.