A leak detection apparatus and method and a wafer electroplating method are provided. An air tightness state of a reaction chamber in a wafer electroplating device is detected in advance before a wafer electroplating process is performed, namely whether leak occurs at the reaction chamber is judged by inputting a detection gas to the reaction chamber and detecting a gas pressure value of the detection gas, and whether to perform the wafer electroplating process is determined according to a judgment result.

Disclosed herein are articles having an edge that is partially, or entirely sealed with one or more coatings including a polymeric material. The article may include a coating selected so that one surface (e.g., a face surface) has a desired property (e.g., an appearance, such as a chrome appearance), and a second surface (e.g., a different face surface, or an edge surface) is covered with a different material, where the different coatings provide protection to at least the edge surface. Also disclosed are coating materials including a tracer component. Also disclosed are methods for coating a substrate. Also disclosed are methods for confirming the presence of a coating, particularly on an edge surface.

The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold between the channeled plate and substrate, and on the sides by a flow confinement ring. A seal may be provided between the bottom surface of a substrate holder and the top surface of an element below the substrate holder (e.g., the flow confinement ring). During plating, fluid enters the cross flow manifold through channels in the channeled plate, and through a cross flow inlet, then exits at the cross flow exit, positioned opposite the cross flow inlet. The apparatus may switch between a sealed state and an unsealed state during electroplating, for example by lowering and lifting the substrate and substrate holder as appropriate to engage and disengage the seal.

Fabrication of a double-sided photovoltaic cell, with two opposite active surfaces, comprising a step of depositing, on each active surface, at least one electric contact. The deposition step comprises in particular a shared operation of depositing on each of the active surfaces, implemented by electrolysis in a shared electrolysis tank comprising: a first compartment for depositing a metal layer on a first active surface of the cell, for fabrication of a contact comprising said metal layer on the first active surface; and a second compartment for depositing, by oxidation, a metal oxide conductor layer on the second active surface of the cell, for the fabrication of a contact comprising said metal oxide layer on the second active surface.

The present disclosure illustrates a vertical electroplating module and an electroplating method for a fan-out panel level chip. The vertical electroplating module has an electroplating tank module, an exhaust tank module and a clamping module. A first box of the electroplating tank module has a first receiving chamber, a second receiving chamber and a third receiving chamber, the first receiving chamber is communicated with a bottom of the second receiving chamber, and a top of the second receiving chamber is communicated with the third receiving chamber. The exhaust tank module is communicated with the first receiving chamber and the third receiving chamber respectively via a first pump and a second pump. The clamping module is disposed around the opening on a wall of the second receiving chamber. The production made by the vertical electroplating module can meet a single-side production, without immersing the entire product in the chemical medicine.

A hot-pressed member having excellent post-coating corrosion resistance and excellent resistance spot weldability, a method for manufacturing the hot-pressed member, and a steel sheet for hot pressing suitable for a hot-pressed member having excellent post-coating corrosion resistance and excellent resistance spot weldability. The hot-pressed member includes a Zn-based coated layer on a first side of a steel sheet, and a Zn-based coated layer on a second side of the steel sheet. A coating weight of Zn in the Zn-based coated layer on the first side of the steel sheet is 5 to 35 g/m.sup.2, and an average line roughness Ra of a surface of the Zn-based coated layer on the first side is less than or equal to 2.5 m. The average line roughness Ra of a surface of the Zn-based coated layer on the second side of the steel sheet is greater than or equal to 3.5 m.

An electroplating apparatus is provided that minimizes unplated regions when an alloy plating layer is provided on the surface of a thread on a steel pipe. An electroplating apparatus (10) includes an electrode (1), sealing members (2, 3), and a plating-solution supply unit (4). The electrode (1) faces the thread (Tm). The sealing member (2) is positioned within the steel pipe (P1). The sealing member (3) is attached to the end portion of the steel pipe (P1) and, together with the sealing member (2), forms a receiving space (8). The plating-solution supply unit (4) includes a plurality of nozzles (42). The nozzles (42) are positioned within the receiving space (8) and adjacent one end of the thread (Tm) and arranged around the pipe axis of the steel pipe (P1). The plating-solution supply unit (4) injects a plating solution between the thread (Tm) and electrode (1) through the nozzles (42). The direction in which plating solution is injected from the nozzles (42) is inclined at an angle larger than 20 degrees and smaller than 90 degrees toward the thread (Tm) relative to a plane perpendicular to the pipe axis.

A plating device comprises: a frame body shaped to surround a region to be plated on one principal surface of a substrate; a conveying unit that conveys the substrate to a position below the frame body while supporting the other principal surface of the substrate with the region to be plated faced up; a lifting unit that relatively lifts the substrate with respect to the frame body to form a storage space for storing a plating solution by the frame body and the region to be plated; a supply unit that supplies the plating solution to the storage space; a cathode electrode configured to be electrically connected to the region to be plated; and an anode electrode configured to be held in contact with the plating solution stored in the storage space.

There is provided a shielding plate that adjusts an electric potential distribution on a substrate near the substrate. According to one embodiment, there is provided a plating apparatus for performing a plating process on the substrate. The plating apparatus includes a substrate holder, the shielding plate, and a moving mechanism. The substrate holder holds the substrate. The shielding plate is disposed adjacent to the substrate holder. The moving mechanism moves the shielding plate in a direction of approaching the substrate holder and a direction away from the substrate holder. The shielding plate is moved to the substrate holder by the moving mechanism to be contactable with the substrate holder.

An electroplating apparatus is provided that minimizes unplated regions when an alloy plating layer is provided on the surface of a thread on a steel pipe. An electroplating apparatus (10) includes an electrode (1), sealing members (2, 3), and a plating-solution supply unit (4). The electrode (1) faces the thread (Tm). The sealing member (2) is positioned within the steel pipe (P1). The sealing member (3) is attached to the end portion of the steel pipe (P1) and, together with the sealing member (2), forms a receiving space (8). The plating-solution supply unit (4) includes a plurality of nozzles (42). The nozzles (42) are positioned within the receiving space (8) and adjacent one end of the thread (Tm) and arranged around the pipe axis of the steel pipe (P1). The plating-solution supply unit (4) injects a plating solution between the thread (Tm) and electrode (1) through the nozzles (42). The direction in which plating solution is injected from the nozzles (42) is inclined at an angle larger than 20 degrees and smaller than 90 degrees toward the thread (Tm) relative to a plane perpendicular to the pipe axis.