An apparatus and a method suited for metal plating aircraft engine components that allows the creation a local environment for plating by covering a localized area to be plated so that the localized area to be plated is sealed from remaining parts of the component, thereby eliminating the need for masking remaining parts of the component prior to plating.

Method and apparatus are provided for electroplating a surface area of an internal wall defining a cooling cavity present in a gas turbine engine airfoil component.

Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).

The planchet holder for electrodeposition of materials includes a container cover configured to securely fit over the mouth of a beaker. An elongate suspension post passes through a through-hole in the cover a predetermined distance, and a holder assembly is coupled to the suspension post to be suspended within the beaker at a select height from the bottom of the beaker. A planchet receptacle extends axially from a body of the holder assembly, and a substrate recess is formed at a distal end of the planchet receptacle for selective placement of a planchet. An endcap is secured onto the planchet receptacle to securely capture the planchet, and a port in the endcap exposes one face of the planchet for electrodeposition of a material. The planchet holder holds the planchet stationary within the beaker and exposes only one face for electrodeposition and subsequent analysis, thereby reducing time and costs.

A method used to repair a workpiece through a combination of laser and an electrochemical reaction is provided. A tool anode is arranged on the back side of the workpiece and is spaced therefrom. A laser beam is focused on an outer surface of the workpiece to realize localized repairing on the back side. The method realizes localized coating repairing on the back side of the workpiece through coordination between the thermal effect of the laser and the electrochemical deposition based on the characteristic of high thermal conductivity of the workpiece. The electrodeposition reaction does not occur in regions that do not need to be repaired. The operating process is simple, the cost of the plating solution is largely reduced, and the problem that the coating on the inner wall of the thin-walled workpiece is difficult to repair due to stripping is solved.

The present invention provides a device for single-sided electrolytic treatment of a flat substrate. The device comprises a bath for electrolytic fluid and conveying means for conveying the flat substrate in a conveying direction at the free surface of the fluid in the bath, with the flat substrate being horizontally oriented such that the underside of the flat substrate makes contact with the free surface of the fluid in the bath. The conveying means comprise two conveying elements disposed opposite each other, which extend along two respective conveying paths, which conveying paths each comprise an electrolytic part, which electrolytic parts extend on two opposite longitudinal sides of the bath.

The present invention relates to an electroplating apparatus and an electroplating method, and more specifically, to an electroplating apparatus and an electroplating method, which can plate a target on one side of a substrate while moving an anode horizontally, and consistently maintain the concentration of iron ions in a plating solution through the injection of inert gas when the plating solution is supplied during the plating process, thereby providing excellent plating quality.