Provided is a method for forming a metal film capable of forming a homogeneous metal film having a uniform film thickness by stably ensuring a fluid pressure of an electrolytic solution during film formation. The method places a substrate on a mount base. While sucking a gas between the substrate and a porous film through which the electrolytic solution can pass from a suction port of a suction passage formed on the mount base, the method brings the porous film into contact with the surface of the substrate. The method interrupts the suction passage while the porous film contacts the surface of the substrate. While interrupting the suction passage, the method allows the electrolytic solution to pass through the porous film while pressing the porous film against the surface of the substrate with a fluid pressure of the electrolytic solution and deposits metal from metal ions in the passed electrolytic solution on the surface of the substrate, thereby forming the metal film.

A nickel film is formed on the surface of a metal substrate with a solid electrolyte membrane in contact with a metal substrate while suppressing the corrosion taking place on the metal substrate by a method of forming a nickel film comprising: disposing an anode, a metal substrate that functions as a cathode, and a solid electrolyte membrane comprising a solution that contains nickel ions and chloride ions, such that the solid electrolyte membrane is disposed between the anode and the metal substrate and in contact with the surface of the metal substrate; and applying a voltage between the anode and the metal substrate, so as to form a nickel film on the surface of the metal substrate that is in contact with the solid electrolyte membrane, wherein the concentration of the chloride ions is 0.002 to 0.1 mol/l.

A nickel film is formed on the surface of a metal substrate with a solid electrolyte membrane in contact with a metal substrate while suppressing the corrosion taking place on the metal substrate by a method of forming a nickel film comprising: disposing an anode, a metal substrate that functions as a cathode, and a solid electrolyte membrane comprising a solution that contains nickel ions and chloride ions, such that the solid electrolyte membrane is disposed between the anode and the metal substrate and in contact with the surface of the metal substrate; and applying a voltage between the anode and the metal substrate, so as to form a nickel film on the surface of the metal substrate that is in contact with the solid electrolyte membrane, wherein the concentration of the chloride ions is 0.002 to 0.1 mol/l.

First, a patterned substrate including an insulating substrate, a conductive seed layer, and an insulating layer is prepared. The seed layer is disposed on the insulating substrate, and consists of a first part having a predetermined pattern corresponding to the wiring pattern and a second part as a part other than the first part. The insulating layer is disposed on the second part of the seed layer. Subsequently, a metal layer having a thickness larger than a thickness of the insulating layer is formed on the first part of the seed layer. Here, a voltage is applied between an anode and the seed layer while a resin film containing a metal ion-containing solution is disposed between the patterned substrate and the anode and the resin film and the seed layer are brought into pressure contact. Subsequently, the insulating layer and the second part of the seed layer are removed.

A processing device based on electrochemistry includes a platform, a power supply and at least one modeling mechanism which is arranged under the platform and movable with respect to the platform. The modeling mechanism includes a photoelectric wheel, a light source and a container in which an ionic liquid is stored. The photoelectric wheel is rotatable and partially immersed in the ionic liquid. The photoelectric wheel includes a transparent conductive layer and a photoconductive layer bound together from inside to outside. The transparent conductive layer is electrically connected to an electrode of the power supply, and the platform is electrically connected to the other electrode of the power supply. The light source is arranged inside the photoelectric wheel and emits a light beam to pass through the transparent conductive layer towards the platform to selectively irradiate the photoconductive layer.

Provided is a method for manufacturing a wiring board that forms a wiring layer having favorable adhesion without a resin resist pattern. A method prepares a substrate with seed-layer including: a underlayer on the surface of an insulating substrate; and a seed layer on the surface of the underlayer, the seed layer having a predetermined pattern and containing metal; presses a solid electrolyte membrane against the seed layer and the underlayer, and applies voltage between an anode and the underlayer to reduce metal ions in the membrane and form a metal layer on the surface of the seed layer; and removes an exposed region without the seed layer and the metal layer of the underlayer to form a wiring layer including the underlayer, the seed layer and the metal layer on the surface of the substrate.

An object including a chromium-based coating on a substrate and a method for its production are disclosed. The chromium-based coating having a first layer on the substrate, wherein the first layer has a top surface on the opposite side to the substrate and includes fissures within the first layer, and wherein the material of the first layer is predominantly formed of chromium and chromium carbide; the chromium-based coating further having a second layer on the first layer, the second layer at least partially filling the fissures in the first layer and at least partially covers the top surface of the first layer, wherein the material of the second layer is selected from a group consisting of: chromium oxide, carbon, and a combination of chromium oxide and carbon.

An electrochemical treatment system includes a treatment fluid supply manifold, a fluid return manifold, and an electrode section connected to the treatment fluid supply manifold. A plurality of treatment fluid supply ports feed fluid through or across the electrode and a plurality of fluid return ports proximate the treatment fluid supply ports are connected to the fluid return manifold. A porous pad is coupled to the electrode section for contacting a substrate to be treated and receives the treatment fluid via the plurality of treatment fluid supply ports. The plurality of fluid return ports remove spent and excess treatment fluid and gases from the substrate, the surrounding air, and the porous pad.

It is determined whether an imaginary component at a predetermined frequency of an alternating current impedance is equal to or more than a preliminarily set film-formable value or not. The metallic coating is formed in a state where the substrate is pressed by the solid electrolyte membrane when the imaginary component is equal to or more than the film-formable value in the determining. The metallic coating is formed in a state where the pressing of the substrate by the solid electrolyte membrane is released to separate the solid electrolyte membrane from the substrate, the solid electrolyte membrane is re-tensioned with a constant tensile force, and subsequently, the substrate is pressed by the re-tensioned solid electrolyte membrane when the imaginary component is smaller than the film-formable value in the determining.

Disclosed are an electroplating repair apparatus, an electroplating repair system having the same, and an operating system thereof. The apparatus includes a probe body extending a predefined length in a structure corresponding to an inner diameter part of a tube, an electroplating electrode attached to and surrounding an outer circumferential surface of the probe body, a sealing member attached to opposite end sides of the probe body to seal a target portion to be electroplated, and a solution supply line supplying a solution to the target portion through the inside of the probe body, wherein the apparatus has a structure capable of wholly repairing the inside of the tube including a sealing welding part and an expanded part.