Devices, systems, and/or methods that can facilitate plating one or more metal layers onto a niobium-titanium substrate are provided. According to an embodiment, a device can comprise a niobium-titanium substrate. The device can further comprise a first metal layer plated on a portion of the niobium-titanium substrate. The device can further comprise a second metal layer plated on the first metal layer. The device can further comprise a third metal layer plated on the second metal layer.

A steel sheet for can making and methods for manufacturing the same. The steel sheet includes, in order from a steel sheet side, an iron-nickel diffusion layer, a metallic chromium layer, and a chromium oxide layer. The iron-nickel diffusion layer has a nickel coating weight of 50 mg/m.sup.2 to 500 mg/m.sup.2 per surface of the steel sheet and a thickness of 0.060 μm to 0.500 μm per surface of the steel sheet. The metallic chromium layer includes a flat-like metallic chromium sublayer and a granular metallic chromium sublayer placed on a surface of the flat-like metallic chromium sublayer. The total chromium coating weight of both sublayers per surface of the steel sheet is 60 mg/m.sup.2 to 200 mg/m.sup.2. The chromium oxide layer has a chromium coating weight 3 mg/m.sup.2 to 10 mg/m.sup.2 per surface of the steel sheet in terms of metallic chromium.

The subject disclosure relates to electroplating niobium titanium (Nb/Ti) with a metal capable of being soldered to. According to an embodiment, a structure is provided that comprises a Nb/Ti substrate and a metal layer plated on a portion of the Nb/Ti substrate. The metal layer comprises an electroplated metal layer plated on the portion of the Nb/Ti substrate using electroplating. The metal layer can comprise a metal capable of being soldered to, such as copper. In another embodiment, a cable assembly is provided that comprises a niobium titanium wire, a metal layer plated on a first portion of the niobium titanium wire, and a metal coaxial connector soldered to the metal layer.

The subject disclosure relates to electroplating niobium titanium (Nb/Ti) with a metal capable of being soldered to. According to an embodiment, a structure is provided that comprises a Nb/Ti substrate and a metal layer plated on a portion of the Nb/Ti substrate. The metal layer comprises an electroplated metal layer plated on the portion of the Nb/Ti substrate using electroplating. The metal layer can comprise a metal capable of being soldered to, such as copper. In another embodiment, a cable assembly is provided that comprises a niobium titanium wire, a metal layer plated on a first portion of the niobium titanium wire, and a metal coaxial connector soldered to the metal layer.

A method for plating a metallic material onto a titanium substrate, wherein the titanium substrate includes an outer surface and an oxide layer on the outer surface. The method includes chemically etching the outer surface of the titanium substrate to remove at least a portion of the oxide layer, thereby yielding an etched titanium substrate. The method also includes establishing a cathodic protection current through the etched titanium substrate while the etched titanium substrate is immersed in a cathodic electrolyte solution. The method further includes strike plating a bond promoter layer onto the outer surface of the etched titanium substrate after the establishing of the cathodic protection current. The method lastly includes plating the metallic material onto the bond promoter layer.

The disclosure provides for anti-scale deposition coatings for use on surface, such as on oilfield parts. The coating includes a first, sublayer of a metal, ceramic, or metal-ceramic composite, which is characterized in having a hardness in excess of 35 HRC. The coating includes a second, top layer over the first layer, that is a polymer. A surface of the first layer may be conditioned to have a roughened or patterned topology for receipt of and adherence with the at least one top layer. The first layer may provide the coating with hardness, and the at least one top layer may provide the coating with low-friction and anti-scale properties.

The disclosure provides for anti-scale deposition coatings for use on surface, such as on oilfield parts. The coating includes a first, sublayer of a metal, ceramic, or metal-ceramic composite, which is characterized in having a hardness in excess of 35 HRC. The coating includes a second, top layer over the first layer, that is a polymer. A surface of the first layer may be conditioned to have a roughened or patterned topology for receipt of and adherence with the at least one top layer. The first layer may provide the coating with hardness, and the at least one top layer may provide the coating with low-friction and anti-scale properties.

A heterostructure comprising at least one first surface containing only copper and at least one second surface, opposite the first surface, containing only aluminium or an aluminium alloy with solid solutions present in the alloy, wherein a. an anchoring layer is arranged between the first and second surfaces, wherein b. each slice plane running perpendicular to the anchoring layer has at least one aluminium or aluminium-alloy island surrounded by copper, and c. at most the aluminium alloy solid solutions which are present in the alloy occur in the anchoring layer. Also, an aluminium-copper connector and a heterostructure production method.

A heterostructure comprising at least one first surface containing only copper and at least one second surface, opposite the first surface, containing only aluminium or an aluminium alloy with solid solutions present in the alloy, wherein a. an anchoring layer is arranged between the first and second surfaces, wherein b. each slice plane running perpendicular to the anchoring layer has at least one aluminium or aluminium-alloy island surrounded by copper, and c. at most the aluminium alloy solid solutions which are present in the alloy occur in the anchoring layer. Also, an aluminium-copper connector and a heterostructure production method.

A method of plating a workpiece, the method includes electrochemically removing any oxide on the surface of the workpiece by applying a first waveform to the workpiece and a cathode both placed in a first electrolyte solution, and electroplating the workpiece surface by applying a second waveform to the workpiece and an anode both placed in a second electrolyte solution including a plating material.