Method and apparatus for reducing metal oxide surfaces to modified metal surfaces and cooling the metal surfaces are disclosed. By exposing a metal oxide surface to remote plasma, the metal oxide surface on a substrate can be reduced to pure metal. A remote plasma apparatus can treat the metal oxide surface as well as actively cool, load/unload, and move the substrate within a single standalone apparatus. The remote plasma apparatus can be configured to actively cool the substrate during and/or after reducing the metal oxide to pure metal using an active cooling system. The active cooling system can include one or more of an actively cooled pedestal, an actively cooled showerhead, and one or more cooling gas inlets for delivering cooling gas to cool the substrate.

Method and apparatus for reducing metal oxide surfaces to modified metal surfaces and cooling the metal surfaces are disclosed. By exposing a metal oxide surface to remote plasma, the metal oxide surface on a substrate can be reduced to pure metal. A remote plasma apparatus can treat the metal oxide surface as well as actively cool, load/unload, and move the substrate within a single standalone apparatus. The remote plasma apparatus can be configured to actively cool the substrate during and/or after reducing the metal oxide to pure metal using an active cooling system. The active cooling system can include one or more of an actively cooled pedestal, an actively cooled showerhead, and one or more cooling gas inlets for delivering cooling gas to cool the substrate.

An electroplating apparatus includes a container containing plural portions and an ionic liquid plating solution that is capable of flowing therebetween. The plural portions include at least a first portion containing a counter electrode that includes coating donor material and a second portion that includes a workpiece. A porous scrubber separating the first and second portions has a plurality of metallic outer surfaces in contact with the ionic liquid plating solution. Coating, repair, and regeneration methods using an ionic liquid plating solution are also described.

An electroplating apparatus includes a container containing plural portions and an ionic liquid plating solution that is capable of flowing therebetween. The plural portions include at least a first portion containing a counter electrode that includes coating donor material and a second portion that includes a workpiece. A porous scrubber separating the first and second portions has a plurality of metallic outer surfaces in contact with the ionic liquid plating solution. Coating, repair, and regeneration methods using an ionic liquid plating solution are also described.

A method including: employing pure magnesium or a magnesium alloy as a substrate material, and sanding and cleaning the substrate material; preparing an electrolyte including 0.8-8 mmol/L of Zn.sup.2+, 30-50 mmol/L of Ca.sup., 15-35 mmol/L of H.sub.2PO.sub.4.sup., 0-0.5 mol/L of NaNO.sub.3, and 0-0.05 mmol/L of a magnesium ion complexing agent; employing the substrate material as a cathode, a graphite flake as an anode, heating the electrolyte to a temperature of between 60 and 90 C., and synchronously immersing the cathode and the anode into the electrolyte; and implementing an electrochemical deposition method in the electrolyte for between 20 and 60 min.

One example provides a method. The method includes forming a substrate comprising a metal alloy comprising at least one of aluminium, magnesium, lithium, zinc, titanium, niobium, and copper. The method includes polishing a surface of the substrate using particles comprising chromium metal. The polished surface is electrically conductive.

One example provides a method. The method includes forming a substrate comprising a metal alloy comprising at least one of aluminium, magnesium, lithium, zinc, titanium, niobium, and copper. The method includes polishing a surface of the substrate using particles comprising chromium metal. The polished surface is electrically conductive.

In example implementations, a method for producing a thin film coating is provided. The method includes pre-treating a substrate, placing the substrate in a bath comprising at least phosphoric acid and sulphuric acid to produce a thin anodized layer, rinsing the thin anodized layer in a solution, plating a surface of the thin anodized layer in an electro deposition bath following a plating current profile for a predetermined period, and increasing the plating current to the recommended bath plating current to produce the thin film coating having a desired initial coating thickness.

Method and apparatus for reducing metal oxide surfaces to modified metal surfaces are disclosed. By exposing a metal oxide surface to a remote plasma, the metal oxide surface on a substrate can be reduced to pure metal and the metal reflowed. A remote plasma apparatus can treat the metal oxide surface as well as cool, load/unload, and move the substrate within a single standalone apparatus. The remote plasma apparatus includes a processing chamber and a controller configured to provide a substrate having a metal seed layer in a processing chamber, form a remote plasma of a reducing gas species where the remote plasma includes radicals, ions, and/or ultraviolet (UV) radiation from the reducing gas species, and expose a metal seed layer of the substrate to the remote plasma to reduce oxide of the metal seed layer to metal and to reflow the metal.

Method and apparatus for reducing metal oxide surfaces to modified metal surfaces are disclosed. By exposing a metal oxide surface to a remote plasma, the metal oxide surface on a substrate can be reduced to pure metal and the metal reflowed. A remote plasma apparatus can treat the metal oxide surface as well as cool, load/unload, and move the substrate within a single standalone apparatus. The remote plasma apparatus includes a processing chamber and a controller configured to provide a substrate having a metal seed layer in a processing chamber, form a remote plasma of a reducing gas species where the remote plasma includes radicals, ions, and/or ultraviolet (UV) radiation from the reducing gas species, and expose a metal seed layer of the substrate to the remote plasma to reduce oxide of the metal seed layer to metal and to reflow the metal.