A method of manufacturing a catheter tip by electroplating a conductive material over an insert comprising a negative to a domelike shape thereby forming a shape of the catheter tip comprising a dome with the domelike shape, selectively positioning a plurality of irrigation holes between outer and inner surfaces of the catheter tip, removing the insert thereby leaving the catheter tip and the plurality of irrigation holes, and electropolishing the catheter tip. In other examples, the insert is not removed and instead the step of electroplating causes the insert to be encapsulated with the conductive material thereby forming the catheter tip.

A method of manufacturing a catheter tip by electroplating a conductive material over an insert comprising a negative to a domelike shape thereby forming a shape of the catheter tip comprising a dome with the domelike shape, selectively positioning a plurality of irrigation holes between outer and inner surfaces of the catheter tip, removing the insert thereby leaving the catheter tip and the plurality of irrigation holes, and electropolishing the catheter tip. In other examples, the insert is not removed and instead the step of electroplating causes the insert to be encapsulated with the conductive material thereby forming the catheter tip.

A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying liquid resist on the seed layer formed on the surface of the resin insulating layer, drying the liquid resist applied on the seed layer such that a resist layer is formed on the seed layer, applying pressure and heat simultaneously to an entire surface of the resist layer formed on the seed layer, forming a plating resist on the seed layer from the resist layer formed on the seed layer using a photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the plating resist, removing the plating resist from the seed layer, and removing part of the seed layer exposed from the electrolytic plating film.

Described herein are apparatus and methods for the continuous application of nanolaminated materials by electrodeposition.

Described herein are apparatus and methods for the continuous application of nanolaminated materials by electrodeposition.

An article includes a body, which includes a thermoplastic or thermoset material and a plurality of metallic fibers distributed throughout the thermoplastic or thermoset material and has a first subset of the plurality of metallic fibers extending onto a first surface of the body. The manufactured article includes a metallic coating metallically bonded to the first subset of the plurality of metallic fibers. The metal fibers extending onto the first surface are configured to bond with the metallic coating.

To provide a semi-aromatic polyamide resin composition having excellent good plating properties, low water absorption properties, and solder reflow resistance. A semi-aromatic polyamide resin composition of the present invention comprises: 10 to 200 parts by mass of an inorganic filler (B) and 2 to 30 parts by mass of a toughness improver (C) based on 100 parts by mass of a semi-aromatic polyamide (A), wherein the semi-aromatic polyamide resin (A) satisfies the following (a) and (b): (a) a melting point (Tm) measured by differential scanning calorimetry (DSC) is 280° C. or higher; and (b) an equilibrium water absorption rate at 80° C. and 95% RH is 3.5% or less.

A porous body including a framework having a three-dimensional network structure, the framework having a body including nickel, cobalt, a first element and a second element as constituent elements, the cobalt having a proportion in mass of 0.2 or more and 0.8 or less relative to a total mass of the nickel and the cobalt, the first element including of at least one element selected from the group including of boron, iron and calcium, the second element including of at least one element selected from the group consisting of sodium, magnesium, aluminum, silicon, potassium, titanium, chromium, copper, zinc and tin, the first and second elements together having a proportion in mass of 5 ppm or more and 50,000 ppm or less in total relative to the body of the framework.

Provided herein are apparatuses, systems, and methods for the electrodeposition of nano- or microlaminate coatings, which have improved heat, wear, and corrosion resistance, on a plurality of workpieces.

Provided herein are apparatuses, systems, and methods for the electrodeposition of nano- or microlaminate coatings, which have improved heat, wear, and corrosion resistance, on a plurality of workpieces.