A porous body includes a framework having a three-dimensional network structure, the framework having a body including crystal grains including nickel and cobalt as constituent elements, the cobalt having a proportion in mass of 0.2 or more and 0.8 or less with respect to a total mass of the nickel and the cobalt, the crystal grains having a shorter grain diameter of 2 μm or more, as determined in a first observed image obtained by observing the body of the framework in cross section at a magnification of 200 times.

Provided are a conductive film and a preparation method for the same, which relate to the technical field of conductive films. The preparation method for the conductive film includes: forming a metal process layer on a surface of an insulating layer by means of evaporation deposition, wet electroplating or chemical plating; forming a metal transition layer on a surface of the metal process layer facing away from the insulating layer by means of magnetron sputtering; and forming a metal functional layer on a surface of the metal transition layer facing away from the metal process layer. The conductive film obtained by this preparation method can have relatively good conductivity and density while having a relatively thick metal conductive layer.

A method of manufacturing a printed circuit board a includes preparing an insulating substrate on which a first metal layer is formed, stacking a resist laminate having a plurality of layers on the first metal layer, forming an opening exposing a portion of the first metal layer by patterning the stacked resist laminate having the plurality of layers, forming a second metal layer on the exposed portion of the first metal layer, removing the patterned resist laminate having the plurality of layers, and etching at least another portion of the first metal layer.

A method of making an electrical component includes transmitting electrical energy from a power source through one or more deposition anodes, through an electrolyte solution, and to an intralayer electrical-connection feature of a build plate, such that material is electrochemically deposited onto the intralayer electrical-connection feature and forms an interlayer electrical-connection feature. The method also includes securing a dielectric material so that the dielectric material contacts and electrically insulates the intralayer electrical-connection feature and contacts and at least partially electrically insulates the interlayer electrical-connection feature. The method additionally includes depositing a seed layer onto the dielectric material and the interlayer electrical-connection feature, electrochemically depositing material onto the seed layer, to form at least one second intralayer electrical-connection feature of the electrical component, and removing any one or more portions of the seed layer onto which no portion of the at least one second intralayer electrical-connection feature is formed.

A manufacturing method of a symbol button for a vehicle includes: preparing a button body comprising a side portion, a top portion formed of a polymer material on which a metal is able to be plated; forming an electrically conductive layer on an outside of the button body using a conductive polymer material; forming a plating shielding layer in a form of a symbol using a material on which a metal is not able to be plated on the electrically conductive layer; and performing metal plating on the outside of the button body having the plating shielding layer.

A manufacturing method of a symbol button for a vehicle includes: preparing a button body comprising a side portion, a top portion formed of a polymer material on which a metal is able to be plated; forming an electrically conductive layer on an outside of the button body using a conductive polymer material; forming a plating shielding layer in a form of a symbol using a material on which a metal is not able to be plated on the electrically conductive layer; and performing metal plating on the outside of the button body having the plating shielding layer.

An apparatus and method for plating magnetic cores by periodically transferring a plate directly back and forth between a metal plating environment and an insulation deposit environment. This direct metal to insulation to metal plating is enabled by a nano-scale insulation layer that provides an imperfect coverage of the metal layer while still keeping sufficient insulation to prevent eddy current formation—even during high-frequency current applications. Therefore, this invention enables the practical creation of magnetic cores having layers with widths even under one nanometer and can generate cores having a layer scale that can be varied to suit a variety of uses in the microelectronic industry.

The present invention relates to the technical field of electrocatalytic electrode preparation, and discloses a lead dioxide-carbon nanotube adsorptive electrochemical submicroelectrode, a preparation method, and use thereof. The electrochemical submicroelectrode according to the present invention comprises multiple layers of orderly arranged spherical lead dioxide submicroholes communicating with each other, where the carbon nanotubes are partially or completely inserted (in the form of twigs) in the lead dioxide hole and in the wall of the hole. The combined effect of adsorption and catalysis inside the submicroreactor effectively solves the problems of low catalytic efficiency and diffusion control associated with the conventional flat lead dioxide electrode, thus greatly improving the electrochemical catalytic performance of the electrode.

The present invention relates to the technical field of electrocatalytic electrode preparation, and discloses a lead dioxide-carbon nanotube adsorptive electrochemical submicroelectrode, a preparation method, and use thereof. The electrochemical submicroelectrode according to the present invention comprises multiple layers of orderly arranged spherical lead dioxide submicroholes communicating with each other, where the carbon nanotubes are partially or completely inserted (in the form of twigs) in the lead dioxide hole and in the wall of the hole. The combined effect of adsorption and catalysis inside the submicroreactor effectively solves the problems of low catalytic efficiency and diffusion control associated with the conventional flat lead dioxide electrode, thus greatly improving the electrochemical catalytic performance of the electrode.

Disclosed are a copper-clad laminate film and an electronic device including the same. The copper-clad laminate film includes: a polyimide-based substrate having a fluorine layer disposed on at least one side thereof; a tie-layer disposed on the polyimide-based substrate having the fluorine layer placed thereon; and a copper layer disposed on the tie layer, wherein the tie-layer includes at least one metal element selected from among metal elements of Group 4, Group 6, Group 13, and Group 14 in the Periodic Table, and the at least one metal element may have a metal-oxygen (M-O) bond dissociation energy of 400 kJ/mol or more.