Methods for fabricating dendritic structures and tags include introducing an electrolyte material onto a substrate, into a substrate, or both onto and into a substrate, and applying an electrical potential to at least one pair of electrodes positioned on the substrate to form one or more dendritic structures on the substrate.

An antimicrobial air treatment device and a method of its construction. The antimicrobial air treatment device comprises an antimicrobial metal nanoparticle mesh comprising a steel support mesh and a layer of copper nanoparticles disposed on the steel support mesh. The antimicrobial air treatment device may be in the form of a facemask or a component of a moving air filtration system such as an HVAC system, an automobile cabin air filtration system, and an air purifier. The antimicrobial air treatment device may contain one or more filtration layers of filtration medium. The method of constructing the antimicrobial air treatment device involves the preparation of the antimicrobial metal nanoparticle mesh by an electrodeposition technique.

Silver electroplating compositions deposit rough, matt silver having needle-like grain structures. The rough, matt, silver deposits enable good adhesion with dielectric materials, even in environments of high relative humidity.

A manufacturing method of copper foil and circuit board assembly for high frequency transmission are provided. Firstly, a raw copper foil having a predetermined surface is produced by an electrolyzing process. Subsequently, a roughened layer including a plurality of copper particles is formed on the predetermined surface by an arsenic-free electrolytic roughening treatment and an arsenic-free electrolytic surface protection treatment. Thereafter, a surface treatment layer is formed on the roughened layer, and the roughened layer is made of a material which includes at least one kind of non-copper metal elements and the concentration of the non-copper metal elements is smaller than 400 ppm. By controlling the concentration of the non-copper elements, the resistance of the copper foil can be reduced.

A surface-treated copper foil includes a bulk copper foil and a first surface treatment layer. The first surface treatment layer is disposed on a first surface of the bulk copper foil and includes a roughening layer, where the outermost surface of the first surface treatment layer is a treating surface of the surface-treated copper foil. The material volume (Vm) of the treating surface is 0.06 to 1.45 μm.sup.3/μm.sup.2, and the five-point peak height (S5p) of the treating surface is 0.15 to 2.00 μm.

A method for creating a chrome-plated surface having a matte finish that typically includes: controlling a resistance of a current bridge circuit; depositing a first chromium layer on a substrate positioned in a chromium bath, wherein the first chromium layer is deposited by supplying current from a power source that is electrically connected to the substrate and to anodes positioned in the chromium bath; etching the first chromium layer by engaging a current bridge that closes the current bridge circuit; depositing a first intermediate chromium layer, wherein the first intermediate chromium layer is deposited by supplying current from the power source; etching the first intermediate chromium layer, wherein the first intermediate chromium layer is etched by engaging the current bridge; and depositing a final chromium layer, wherein the final chromium layer is deposited by supplying current from the power source.

An advanced reverse treated electrodeposited copper foil and a copper clad laminate using the same are provided. The advanced reverse treated electrodeposited copper foil has an uneven micro-roughened surface. The micro-roughened surface has a plurality of copper crystals, a plurality of copper whiskers and a plurality of copper crystal groups, which are in a non-uniform distribution to form a non-uniformly distributed horizontal or vertical stripe pattern.

The present invention relates to a surface modifier for electrolytic nickel plating including at least one carboxyl group-containing compound and a nickel electroplating solution including the surface modifier. The use of the nickel electroplating solution according to the present invention enables efficient formation of a plated nickel layer with high surface roughness and mattness even without performing strong electrolysis, unlike in the prior art.

Described herein is a composition for depositing copper on a semiconductor substrate, the composition including (a) copper ions; (b) a grain refiner of formula G1

##STR00001## or salts thereof (c) a complexing agent; and (d) optionally a buffer or a base capable of adjusting the pH to a pH of from 7 to 13; where the variables are as defined herein; and where the pH of the composition is from 7 to 13.

A copper foil with a release layer is provided that capable of forming a circuit, of such as an embedded trace substrate, by a subtractive method in a simple process. A copper foil with a release layer, containing, in this order, a release layer; a barrier layer having dissolution resistance to a copper etchant; and a copper foil.