To provide a Sn-based plated steel sheet capable of exhibiting superior corrosion resistance, yellowing resistance, coating film adhesiveness, and sulphide stain resistance without using a chromate film. A Sn-based plated steel sheet of the present invention includes: a steel sheet; a Sn-based plating layer located on at least one surface of the steel sheet; and a coating layer located on the Sn-based plating layer, wherein the Sn-based plating layer contains 1.0 g/m.sup.2 to 15.0 g/m.sup.2 of Sn per side in terms of metal Sn, the coating layer contains zirconium oxide, and a content of the zirconium oxide is 1.0 mg/m.sup.2 to 10.0 mg/m.sup.2 per side in terms of metal Zr, the zirconium oxide includes zirconium oxide with an amorphous structure, and a crystalline layer whose main component is zirconium oxide with a crystalline structure is present on an upper layer of the zirconium oxide with the amorphous structure.

To provide a manganese-iridium composite oxide, a manganese-iridium composite oxide and a manganese-iridium composite oxide electrode material, having high catalytic activity produced at low cost, to be used as an anode catalyst for oxygen evolution in water electrolysis, and their production methods.

A manganese-iridium composite oxide, which has an iridium metal content ratio (iridium/(manganese+indium)) of 0.1 atomic % or more and 30 atomic % or less, and has interplanar spacings of at least 0.243±0.002 nm, 0.214±0.002 nm, 0.165±0.002 nm, 0.140±0.002 nm, and a manganese-iridium composite oxide electrode material comprising an electrically conductive substrate constituted by fibers at least part of which are covered with the above manganese-iridium composite oxide.

To provide a manganese-iridium composite oxide, a manganese-iridium composite oxide and a manganese-iridium composite oxide electrode material, having high catalytic activity produced at low cost, to be used as an anode catalyst for oxygen evolution in water electrolysis, and their production methods.

A manganese-iridium composite oxide, which has an iridium metal content ratio (iridium/(manganese+indium)) of 0.1 atomic % or more and 30 atomic % or less, and has interplanar spacings of at least 0.243±0.002 nm, 0.214±0.002 nm, 0.165±0.002 nm, 0.140±0.002 nm, and a manganese-iridium composite oxide electrode material comprising an electrically conductive substrate constituted by fibers at least part of which are covered with the above manganese-iridium composite oxide.

A method of producing a silicon-plated metal sheet, comprises: melting at least one of a silicon-containing alkali metal salt or a silicon-containing ammonium salt in a molten salt comprising lithium chloride, potassium chloride, and an alkali metal fluoride to prepare a molten salt electrolytic bath; and performing constant-current pulse electrolysis or constant-potential pulse electrolysis with a metal sheet, serving as a cathode, immersed in the molten-salt electrolytic bath under conditions of a pulse duration of from 0.1 seconds to 3.0 seconds and a duty ratio of from 0.5 to 0.94 to thereby form a silicon layer on the metal sheet.

A method of producing a silicon-plated metal sheet, comprises: melting at least one of a silicon-containing alkali metal salt or a silicon-containing ammonium salt in a molten salt comprising lithium chloride, potassium chloride, and an alkali metal fluoride to prepare a molten salt electrolytic bath; and performing constant-current pulse electrolysis or constant-potential pulse electrolysis with a metal sheet, serving as a cathode, immersed in the molten-salt electrolytic bath under conditions of a pulse duration of from 0.1 seconds to 3.0 seconds and a duty ratio of from 0.5 to 0.94 to thereby form a silicon layer on the metal sheet.

The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm.sup.2 of Ni and said Cr layer containing 10-100 μg/dm.sup.2 of Cr is provided.

The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm.sup.2 of Ni and said Cr layer containing 10-100 μg/dm.sup.2 of Cr is provided.

Electrolytic Etching/Deposition System. A system for continuous circuit fabrication comprising means for storing and dispensing the substrate, means for laminating the substrate, means for printing the substrate, means for optical inspection of the substrate, means for photolithography of the substrate, means for drying the substrate, means for developing the substrate, means for washing the substrate and means for electroplating the substrate.

A three-dimensional electrode-ozone oxidation-electrocatalytic membrane coupled wastewater treatment device, including a circulating fluidized bed reactor. The circulating fluidized bed reactor includes a funnel-shaped internal, a truncated cone, a fiber ball filter, a gas-liquid distribution plate, an inner cylinder, an intermediate cylinder and an outer cylinder. The inner cylinder, the intermediate cylinder and the outer cylinder are coaxial. The inner cylinder is an electrocatalytic membrane assembly; the intermediate cylinder is a gas diffusion electrode; and the outer cylinder is a stainless-steel mesh. A particle electrode is filled between the intermediate cylinder and the outer cylinder, and between the intermediate cylinder and the inner cylinder. The intermediate cylinder is connected to a negative electrode. The inner cylinder and the outer cylinder are connected to a positive electrode. A wastewater treatment method using the device is also provided herein.

A method of electroplating metal onto a transparent conductive oxide layer is described. The method comprises the steps of a) electroplating a zinc or zinc oxide seed layer directly onto the transparent conductive oxide layer and thereafter, b) electroplating one or more additional metal layers over the zinc layer. The one or more additional metal layers may include a cobalt strike layer electroplated over the zinc or zinc oxide seed layer and another metal layer such as copper, electroplated over the cobalt strike layer.