Patent classifications
C25D11/022
SEMICONDUCTOR STRUCTURE WITH SELECTIVE BOTTOM TERMINAL CONTACTING
A semi-conductor structure with selective bottom terminal contacting is described. The semiconductor device comprises a first metal layer disposed over a substrate; a conductive layer disposed over the first metal layer; and a second metal layer disposed over the conductive layer, the second metal layer embedding a porous structure comprising a plurality of pores that extend substantially perpendicularly from a top surface of the porous structure toward the conductive layer, wherein only a subset of the plurality of pores open onto the conductive layer.
Electronic devices having bilayer capping layers and/or barrier layers
In various embodiments, electronic devices such as thin-film transistors and/or touch-panel displays incorporate bilayer capping layers and/or barrier layers.
Porous solid materials and methods for fabrication
Porous solid materials are provided. The porous solid materials include a plurality of interconnected wires forming an ordered network. The porous solid materials may have a predetermined volumetric surface area ranging between 2 m.sup.2/cm.sup.3 and 90 m.sup.2/cm.sup.3, a predetermined porosity ranging between 3% and 90% and an electrical conductivity higher than 100 S/cm. The porous solid materials may have a predetermined volumetric surface area ranging between 3 m.sup.2/cm.sup.3 and 72 m.sup.2/cm.sup.3, a predetermined porosity ranging between 80% and 95% and an electrical conductivity higher than 100 S/cm. The porous solid materials (100) may have a predetermined volumetric surface area ranging between 3 m.sup.2/cm.sup.3 and 85 m.sup.2/cm.sup.3, a predetermined porosity ranging between 65% and 90% and an electrical conductivity higher than 2000 S/cm. Methods for the fabrication of such porous solid materials and devices including such porous solid material are also disclosed.
Components of an electronic device and methods for their assembly
Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
NANOWIRE ARRAY STRUCTURES FOR INTEGRATION, PRODUCTS INCORPORATING THE STRUCTURES, AND METHODS OF MANUFACTURE THEREOF
A nanowire array structure having an array of nanopillars located in a well in a material layer. The nanopillars of the array extend in the direction from the well floor towards the well mouth. A hard mask overlies the outer peripheral nanopillars in the array and extends outwards to cover the remainder of the well mouth. An aperture in the hard mask exposes the nanopillars disposed inwardly of the outer peripheral nanopillars. The hard mask planarizes the structure, avoiding formation of large topological features at the periphery of the array of nanopillars, thus facilitating integration of the structure into a semiconductor product. At least some of the outer peripheral nanopillars may be in pores of anodic oxide. There are also disclosed semiconductor products incorporating such nanowire array structures and methods of their fabrication.
Transforming a Valve Metal Layer Into a Template Comprising a Plurality of Spaced (Nano)channels and Forming Spaced Structures Therein
At least one embodiment relates to a method for transforming at least part of a valve metal layer into a template that includes a plurality of spaced channels aligned longitudinally along a first direction. The method includes a first anodization step that includes anodizing the valve metal layer in a thickness direction to form a porous layer that includes a plurality of channels. Each channel has channel walls and a channel bottom. The channel bottom is coated with a first insulating metal oxide barrier layer as a result of the first anodization step. The method also includes a protective treatment. Further, the method includes a second anodization step after the protective treatment. The second anodization step substantially removes the first insulating metal oxide barrier layer, induces anodization, and creates a second insulating metal oxide barrier layer. In addition, the method includes an etching step.
ELECTRONIC DEVICE AND ELECTRONIC DEVICE HOUSING STRUCTURE
In an embodiment, a housing for an electronic device is colored through an anodizing process. The electronic device includes the housing, which includes a front plate; a rear plate facing away from the front plate; a side member surrounding a space between the front plate and the rear plate; and a support member which is disposed in the space. A portion of the housing is a conductive member formed of an electrically conductive material, which is divided into a first portion and a second portion which is electrically isolated from the first portion. The first portion is colored by a primary anodizing process with a first color, and the second portion is colored by a secondary anodizing process with a second color different from the first color.
STEERING GEAR ASSEMBLY AND METHOD OF MANUFACTURING SAME
A steering gear housing and method of manufacturing same are provided. The steering gear housing is comprised of aluminum alloy and is at least partially anodized. The steering gear housing defines a plurality of mounting apertures. A plurality of nuts is fit into a respective one of the mounting apertures for use in mounting to a vehicle. Each of the nuts defines a plurality of splines for establishing a press-fit relationship between the mounting apertures and the nuts. The method involves casting a steering gear housing defining a plurality of mounting apertures out of aluminum alloy. Next, the casted steering gear housing is at least partially anodized. After anodization, a plurality of nuts is fit into respective ones of the mounting apertures. The nuts define splines for allowing a press-fit relationship to be established between the mounting apertures and the nuts.
Multi-metal golf clubs
A composite material golf club head is provided having a body made from a first metal and a face insert press fitted to a portion of the body and made from a second metal The metals are chosen so that the first metal is heavier than the second metal. The second metal is disposed towards the front and top of the body, and is preferably hard-anodized. In addition, an interlocking structure, for example rectangular or dove tail shaped channels, is provided in the body so that the face insert becomes embedded in the interlocking structure to anchor the face insert to the body. Portions of the golf club head, such as the face insert or sole plate, are anodized to protect against corrosion. The anodized coating is colored to improve aesthetic characteristics or infused with a polymer to increase or reduce friction. Disclosed herein is a golf club head having a body portion and a face insert. The front of the body portion further comprises a cutout sized and dimensioned to receive the face insert. The body portion is preferably made from a high-strength metal such as stainless steel, titanium or titanium alloy. The face insert is preferably comprised of a metal having a lower density than that of the body portion. The face insert comprises an aluminum metal matrix composite (MMC) containing an amount of scandium and zirconium. The golf club head may also include a top line insert made of a lightweight material and at least one heavy weight member disposed to the back of the club head.
Sub-surface marking of product housings
Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on sub-surfaces of the housings. For example, a housing for a particular product can include an outer housing surface and the markings can be provided on a sub-surface the outer housing surface yet still be visible from the outside of the housing. Since the markings are beneath the surface of the housing, the markings are durable.