Patent classifications
C25D11/024
AN ELECTRODE AND A PSEUDO-CAPACITOR BASED ON THE ELECTRODE
The invention provides a process for preparing an electrode, comprising: electrodeposition of metallic ruthenium/ruthenium oxide (Ru.sup.(0)/RuO.sub.2) coating onto a progressively etched nickel surface; and partial electrochemical oxidation of said metallic ruthenium to ruthenium oxide. The electrode produced and a pseudo-capacitor based on the electrode are also disclosed.
Surface-treated aluminum material and method for manufacturing same; and bonded body of surface-treated aluminum material and bonding member comprising said surface-treated aluminum material, and bonding member such as resin, and method for manufacturing said bonded body
There are provided: a surface-treated aluminum material including an aluminum base material and an alkali alternating current electrolytic oxide coating film formed on at least a part of a surface of the aluminum base material, wherein the alkali alternating current electrolytic oxide coating film includes a porous-type aluminum oxide coating film layer formed on a surface side and a barrier-type aluminum oxide coating film layer formed on a base material side, and plural working grooves perpendicular to the direction of plastic working are formed; a method of producing the surface-treated aluminum material; a bonded body of the surface-treated aluminum material and a member to be bonded, including the surface-treated aluminum material and the member to be bonded, such as resin; and a method of producing the bonded body.
ANODIZING METHOD AND MANUFACTURING METHOD FOR AN ANISOTROPIC CONDUCTIVE MEMBER
There are provided an anodizing method by which straight micropores can be formed and a manufacturing method for an anisotropic conductive member in which a filling defect of a conductive material is suppressed. The anodizing method is a method including subjecting a surface of a valve metal plate to a plurality of times of anodization and forming an anodized film having micropores present in a thickness direction of the valve metal plate and having a barrier layer present in the bottom part of the micropores, on the surface of the valve metal plate. In steps of second and subsequent times of anodization of the plurality of times of anodization, a current increasing period and a current keeping period are continuous. The current increasing period is a period in which a quantity of current increase is more than 0 amperes per square meter per second and 0.2 amperes per square meter per second or less, and which is 10 minutes or less. A current is kept at a constant value during a current keeping period, and the constant value is equal to or less than a maximum current value during the current increasing period.
BIODEGRADEABLE IMPLANT COMPRISING COATED METAL ALLOY PRODUCT
The invention relates to a biodegradable implant comprising a surface coated magnesium alloy or zinc alloy product, whereby the coating layer comprises oxides and/or phosphates of from rare-earth elements, Mg, Ca, Zn, Zr, Cu, Fe, Sr, Li, Mn or Ag wherein the coating is preferably generated by plasma electrolytically oxidation (PEO). The invention further comprises a method for preparing the coated magnesium or zinc alloy product of the implant.
METAL OBJECT WITH ROUGHENED SURFACE AND METHOD OF PRODUCTION
Metal objects are treated by anodising the metal object in contact with an aqueous electrolyte, and then subjecting the anodised metal object to a reversed voltage. The anodising is performed in two stages, firstly to passivate with the formation of an oxide layer, and secondly to form regions in the oxide layer having a higher oxygen to metal atom ratio, for example pits or caps, in this oxide layer. The second stage of anodising is performed by applying a multiplicity of voltage cycles, each voltage cycle involving ramping the voltage between a lower threshold voltage and an upper threshold voltage, and then returning to the lower threshold voltage. The reversed voltage step forms a hydrous metal oxide in the regions of higher oxygen to metal atom ratio, and the oxide layer and hydrous metal oxide together constitute a surface layer which is integral with the metal object, and has ion exchange capacity. After the reversed voltage step the metal object is then contacted with a bio-effective material such as a biocidal metal, which is absorbed into the surface of the metal object. The processing time may be reduced by applying the multiple voltage cycles. The invention also provides a treated metal object which can be prepared by treating a metal object having a micro-rough surface according to the method described above.
METHOD AND COMPOSITION FOR SELECTIVE ANODIZATION
A composition for selective anodization, comprising the substances amidosulphuric acid, magnesium sulphate and concentrated sulphuric acid as a base electrolyte and additionally sodium stannate and/or molybdenum oxide. A corresponding method of selectively anodizing a substrate or workpiece includes providing a substrate having a surface which is to be selectively coated, where the substrate is arranged in a tool and forms a coating cell, selectively bathing the surface with the composition for selective anodization, and applying an electric current between substrate (anode) and tool (cathode) for selective anodization of the surface.
Surface treatment method of copper for the assembly of polymer and copper
A method to treat the copper surface to manufacture the metallic assembly with the polymer and copper to have excellent bonding strength is disclosed. The present method is for treating the surface of copper for the bonded coupling of the mixture of polymer and copper by providing a method to treat the surface of copper, with (a) an etching step with electric etching of the surface of copper, (b) the first anodizing stage to anodize the surface of copper, and (c) the second anodizing stage to anodize the above is firstly anodized, after an ultrasonic treatment of the secondly anodized copper, the copper is oxidized again.
METHODS AND APPARATUSES FOR FORMING METAL OXIDE NANOSTRUCTURES
Embodiments of methods and apparatuses for forming the metal oxide nanostructure on surfaces are disclosed. In certain embodiments, the nanostructures can be formed on a substrate made of a nickel titanium alloy, resulting in a nanostructure that can include both titanium oxide and nickel oxide. The nanostructure can be formed on the surface(s) of an implantable medical device, such as a stent.
Transforming a valve metal layer into a template comprising a plurality of spaced (nano)channels and forming spaced structures therein
At least one embodiment relates to a method for transforming at least part of a valve metal layer into a template that includes a plurality of spaced channels aligned longitudinally along a first direction. The method includes a first anodization step that includes anodizing the valve metal layer in a thickness direction to form a porous layer that includes a plurality of channels. Each channel has channel walls and a channel bottom. The channel bottom is coated with a first insulating metal oxide barrier layer as a result of the first anodization step. The method also includes a protective treatment. Further, the method includes a second anodization step after the protective treatment. The second anodization step substantially removes the first insulating metal oxide barrier layer, induces anodization, and creates a second insulating metal oxide barrier layer. In addition, the method includes an etching step.
METAL COMPONENT AND MANUFACTURING METHOD THEREOF AND PROCESS CHAMBER HAVING THE METAL COMPONENT
This invention relates to a metal component, a manufacturing method thereof, and a process chamber having the metal component, and particularly to a metal component useful in a display or semiconductor manufacturing process, a manufacturing method thereof, and a process chamber having the metal component, wherein among addition elements of an aluminum alloy that constitutes the metal substrate of the metal component, the addition element existing on the surface thereof is removed, and a barrier layer having no pores is formed, thereby solving problems attributable to a conventional anodized film having a porous layer and attributable to the addition element in the form of particles on the surface of the metal substrate.