Patent classifications
C25D11/026
METHODS OF MODIFYING THE POROUS SURFACE OF IMPLANTS
Methods are provided for modifying a porous surface of an implantable medical device by subjecting the porous surface to a modified micro-arc oxidation process to improve the ability of the medical device to resist microbial growth, to improve the ability of the medical device to adsorb a bioactive agent or a therapeutic agent, and to improve tissue in-growth and tissue on-growth of the implantable medical device.
BALL VALVE ASSEMBLY
A dielectric insulating insert arranged to be positioned between a drive shaft and a ball shaft of a motorised ball valve assembly. The insert includes a body of dielectric material to form an insulating layer and having opposing sides from each of which extends an engagement portion having a non-circular cross-section and configured to engage, respectively, with the drive shaft and the ball shaft in torque transfer engagement.
ELECTROLYTE FOR MICRO-ARC OXIDATION AND METHOD FOR DYEING SUBSTRATE THEREIN
Disclosed is an electrolyte for micro-arc oxidation, which includes silicate, a fluoride, an alkali metal hydroxide, a pore modifier selected from at least one of triethanolamine and diethanolamine, and a polar solvent. Also disclosed is a method for dyeing a substrate which includes immersing a metal substrate as an anode into the electrolyte, oxidizing the substrate to form an oxide layer on the substrate, applying a solution containing a dye on the oxide layer, and allowing the dye to adhere on the oxide layer, so as to obtain a half-finished product, and forming a sealing layer on the half-finished product.
Method for manufacturing a component, component and gas hob
A method for manufacturing a component for a gas hob, the method comprising treating a surface by plasma electrolytic oxidation.
ELECTRONIC DEVICE HOUSING, MANUFACTURING METHOD OF SAME, AND METAL-RESIN COMPOSITE
Provided is an electronic device housing including a metal member and a plastic antenna cover that are joined and integrated by insert molding. In this electronic device housing, the plastic antenna cover is a molded product of a thermoplastic resin composition containing a thermoplastic polyester resin having a melting point Tm equal to or higher than 250° C.
ALUMINUM-BASED COATING FOR FLAT STEEL PRODUCTS FOR PRESS MOLD HARDENING COMPONENTS, AND METHOD FOR PRODUCING SAME
An aluminum-based coating of a flat steel product is applied in a hot-dipping method and comprises a mass percentage of silicon within a given range. The coating for a flat steel product, in particular for press mold hardening components, offers a shortened required minimum oven dwell time and a sufficiently large processing window when heating in an oven. This is achieved in that the surface of the coating has a degree of absorption for thermal radiation ranging between 0.35 and 0.95 prior to an annealing treatment, where the degree of absorption relates to an oven temperature ranging from 880 to 950° C. during the austenitizing annealing treatment. The invention additionally relates to an improved method for producing a flat steel product with an aluminum-based coating, to an inexpensive method for producing press-hardened components from such flat steel products, and to a press-hardened component made of such flat steel products.
COVERS FOR ELECTRONIC DEVICES
The present disclosure is drawn to covers for electronic devices, methods of making the covers, and electronic devices. In one example, a cover for an electronic device comprising: a metal cover substrate having at least a top surface and a bottom surface; a transparent passivation layer on the top surface of the metal cover substrate; a water-borne graphene coating layer on the transparent passivation layer; and an electrophoretic deposition coating layer on the water-borne graphene coating layer.
COATED METAL ALLOY SUBSTRATE WITH AT LEAST ONE CHAMFERED EDGE AND PROCESS FOR PRODUCTION THEREOF
A coated metal alloy substrate with at least one chamfered edge, a process for producing a coating a metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate with at least one chamfered edge comprises a hydrophobic anti-fingerprint layer deposited on the metal alloy substrate, a passivation layer deposited on the at least one chamfered edge, and a water based paint layer deposited on the passivation layer.
COMPOSITE STRUCTURE AND METHOD OF MAKING THE SAME
A composite structure includes a passivated substrate, a sealing layer, a conductive layer, and a coating layer. The passivated substrate includes a substrate body made of a metallic material that is magnesium or magnesium alloy, and a porous passivation layer which is disposed on the substrate body, and which is made of an oxide of the metallic material. The sealing layer is disposed on the porous passivation layer, and is made of a sealing material. The conductive layer is disposed on the sealing layer, and is made of an electrically conductive material. The coating layer covers the conductive layer, and includes an electrophoretic material and/or a metal. A method of making the composite structure is also disclosed.
METHOD FOR PRODUCING A CERAMIC COATING ON THE SURFACE OF AN ALUMINUM ALLOY SUBSTRATE BY MEANS OF PLASMA ELECTROLYTIC OXIDATION
A method for producing a ceramic coating on the surface of an aluminum alloy substrate by means of plasma electrolytic oxidation may include immersing the substrate as an electrode together with a counter-electrode in an alkaline electrolytic aqueous solution. The method may also include the step of applying an electrical potential sufficient to generate spark discharges on the surface of the substrate for a predefined period of treatment time so as to lead to the formation of the coating. The coating may be aluminum oxides and oxides of any alloying agents of the alloy. The electrolytic aqueous solution may have from 9 to 14 g/l of Na2SiO3, from 2.3 to 2.8 g/l of K3PO4, not less than 5 g/l of Na2WO4.Math.2H20, from 0.4 to 1.5 g/l of Na3AlF6, and NaOH at a concentration such that the electrolytic solution has a pH between 11.8 and 12.0, and a conductivity between 9.5 and 10.5 mS/cm.