Proposed are a laminated anodic aluminum oxide structure in which a plurality of anodic aluminum oxide films are stacked, a guide plate of a probe card using the same, and a probe card having the same. More particularly, proposed are a laminated anodic aluminum oxide structure with a high degree of surface strength, a guide plate of a probe card using the same, and a probe card having the same.

A heat transfer unit for a motor vehicle may include a metallic heat transfer block and a base plate. The heat transfer block may include channels that are configured to be flowed through. The base plate may include an outer region and a material bonding region. The base plate may be exposed towards the outside and may be materially bonded to the heat transfer block in the material bonding region. The base plate may be formed out of an aluminium, an aluminium alloy, or a wrought aluminium alloy. The outer region of the base plate may comprise a protective coating produced by anodising at least in regions, and the material bonding region of the base plate may not have a protective coating produced by anodising.

Aluminium alloys suitable for etched and anodized components, in particular aluminum extrusion alloys of the types containing Magnesium and Silicon, which after being extruded to any wide variety of forms for different applications such as house buildings and other building applications is subjected to etching in a conventional alkaline etching bath and subsequent anodizing, wherein the relation between Cu and Zn is controlled to avoid preferential grain etching and the ratio of Cu/Zn is below 1.

Aluminium alloys suitable for etched and anodized components, in particular aluminum extrusion alloys of the types containing Magnesium and Silicon, which after being extruded to any wide variety of forms for different applications such as house buildings and other building applications is subjected to etching in a conventional alkaline etching bath and subsequent anodizing, wherein the relation between Cu and Zn is controlled to avoid preferential grain etching and the ratio of Cu/Zn is below 1.

A method of preparing a modified-metal surface. The method includes preparing a solution of a phosphorous-based acid in a solvent; immersing a strip of the metal work piece into the solution of the phosphorous-based acid; immersing a strip of a reference metal into the solution of the phosphorous-based acid; supplying a voltage for a duration of time to prepare a phosphorous acid-modified metal work piece; removing the phosphorous acid-modified metal work piece; cleaning and drying the phosphorous acid-modified metal work piece; applying a chitosan solution to the surface in order to attach chitosan/modified chitosan to the phosphorous acid based modified surface; prepare the modified-metal surface; and cleaning and drying the modified-metal surface.

A component for an electronic device can include a part including a first metal and a second metal diffusion bonded to the first metal. The first metal can be aluminum and the second metal can be different from the first metal. A porous aluminum oxide layer can overlie a portion of the first metal and can be disposed adjacent to an interface between the first metal and the second metal. The component can further include a non-metallic material bonded to the part and extending into pores defined by the porous aluminum oxide layer.

A component for an electronic device can include a part including a first metal and a second metal diffusion bonded to the first metal. The first metal can be aluminum and the second metal can be different from the first metal. A porous aluminum oxide layer can overlie a portion of the first metal and can be disposed adjacent to an interface between the first metal and the second metal. The component can further include a non-metallic material bonded to the part and extending into pores defined by the porous aluminum oxide layer.

A housing of an electronic device includes two or more metal portions, each having an oxide film layer formed on a surface thereof, and a non-conductive portion formed to cover at least a portion of the oxide film layer.

Proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure. More particularly, proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure, wherein production yield of the entire product can be improved by repairing a defective region to be made normal.

Proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure. More particularly, proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure, wherein production yield of the entire product can be improved by repairing a defective region to be made normal.