Anodic oxide coatings that provide corrosion resistance to parts having protruding features, such as edges, corners and convex-shaped features, are described. According to some embodiments, the anodic oxide coatings include an inner porous layer and an outer porous layer. The inner layer is adjacent to an underlying metal substrate and is formed under compressive stress anodizing conditions that allow the inner porous layer to be formed generally crack-free. In this way, the inner porous layer acts as a barrier that prevents water or other corrosion-inducing agents from reaching the underlying metal substrate. The outer porous layer can be thicker and harder than the inner porous layer, thereby increasing the overall hardness of the anodic oxide coating.

Anodic oxide coatings that provide corrosion resistance to parts having protruding features, such as edges, corners and convex-shaped features, are described. According to some embodiments, the anodic oxide coatings include an inner porous layer and an outer porous layer. The inner layer is adjacent to an underlying metal substrate and is formed under compressive stress anodizing conditions that allow the inner porous layer to be formed generally crack-free. In this way, the inner porous layer acts as a barrier that prevents water or other corrosion-inducing agents from reaching the underlying metal substrate. The outer porous layer can be thicker and harder than the inner porous layer, thereby increasing the overall hardness of the anodic oxide coating.

A biomedical implant (16, 18) is formed from magnesium (Mg) single crystal (10). The biomedical implant (16, 18) may be biodegradable. The biomedical implant (16, 18) may be post treated to control the mechanical properties and/or corrosion rate thereof said Mg single crystal (10) without changing the chemical composition thereof. A method of making a Mg single crystal (10) for biomedical applications includes filling a single crucible (12) with more than one chamber with polycrystalline Mg, melting at least a portion of said polycrystalline Mg, and forming more than one Mg single crystal (10) using directional solidification.

A biomedical implant (16, 18) is formed from magnesium (Mg) single crystal (10). The biomedical implant (16, 18) may be biodegradable. The biomedical implant (16, 18) may be post treated to control the mechanical properties and/or corrosion rate thereof said Mg single crystal (10) without changing the chemical composition thereof. A method of making a Mg single crystal (10) for biomedical applications includes filling a single crucible (12) with more than one chamber with polycrystalline Mg, melting at least a portion of said polycrystalline Mg, and forming more than one Mg single crystal (10) using directional solidification.

According to one example, preparing a substrate for an electronic device can include forming a deposition layer on a magnesium alloy substrate, anodizing the magnesium alloy substrate, and forming an electrophoretic deposition layer on the anodized magnesium alloy substrate.

According to one example, preparing a substrate for an electronic device can include forming a deposition layer on a magnesium alloy substrate, anodizing the magnesium alloy substrate, and forming an electrophoretic deposition layer on the anodized magnesium alloy substrate.

An electronic device is provided. The electronic device includes a housing that forms a portion of an outer surface of the electronic device and a display disposed in the housing and visually exposed through one side of the housing. The housing includes a first portion containing a metallic material, and the first portion includes a base material layer made of the metallic material, a first film layer that is disposed adjacent to a surface of the housing and that contains oxide of the metallic material, and a second film layer that is disposed between the base material layer and the first film layer and that contains oxide of the metallic material. The first film layer includes a first pore structure that extends in a direction substantially perpendicular to a surface of the first film layer, and the second film layer includes a second pore structure that is at least partially in fluid communication with the first pore structure and that extends in a radial shape toward the base material layer.

The embodiments described herein relate to anodic oxides and methods for forming anodic oxides. The methods involve incorporating an ultraviolet (UV) light absorbing compounds into anodic oxides to prevent color fading of the anodic oxides caused by exposure to UV light. In some embodiments, the UV light absorbing compound includes para-aminobenzoic acid (PABA). The UV light absorbing compound can be incorporated within the anodic oxide during a sealing process. The UV light absorbing compound becomes infused within a seal layer, which is formed during the sealing process. The resultant anodic oxide has a UV light absorbing seal layer that can block UV light from reaching any underlying colorant existing within the anodic oxide.

The embodiments described herein relate to anodic oxides and methods for forming anodic oxides. The methods involve incorporating an ultraviolet (UV) light absorbing compounds into anodic oxides to prevent color fading of the anodic oxides caused by exposure to UV light. In some embodiments, the UV light absorbing compound includes para-aminobenzoic acid (PABA). The UV light absorbing compound can be incorporated within the anodic oxide during a sealing process. The UV light absorbing compound becomes infused within a seal layer, which is formed during the sealing process. The resultant anodic oxide has a UV light absorbing seal layer that can block UV light from reaching any underlying colorant existing within the anodic oxide.

An example method for connectorizing a superconducting cable is described herein. The method can include depositing an oxide layer on a surface of a superconducting cable, electroplating a metal layer on the surface of the superconducting cable, and soldering a connector to the metal layer coated on the surface of the superconducting cable. The oxide layer allows the metal layer to adhere to the surface of the superconducting cable.