In a method for passivating the surface of a tinplate using electrolytic deposition of a passivation layer containing chromium oxide/chromium hydroxide on the surface, the electrolytic deposition of the passivation layer is carried out at least partly from an electrolyte solution which contains a trivalent chromium compound, at least one salt for increasing the conductivity and at least one acid or one base for adjusting a desired pH value and is free from organic complexing agents and free from buffering agents. In order to increase the amount of chromium oxide in the passivation layer, after the electrolytic deposition of the passivation layer, the passivated tinplate is subjected to a thermal treatment in which the passivated tinplate is kept at a treatment temperature of 100° C. or more for a treatment time of at least 0.5 seconds.

Porous solid materials are provided. The porous solid materials include a plurality of interconnected wires forming an ordered network. The porous solid materials may have a predetermined volumetric surface area ranging between 2 m.sup.2/cm.sup.3 and 90 m.sup.2/cm.sup.3, a predetermined porosity ranging between 3% and 90% and an electrical conductivity higher than 100 S/cm. The porous solid materials may have a predetermined volumetric surface area ranging between 3 m.sup.2/cm.sup.3 and 72 m.sup.2/cm.sup.3, a predetermined porosity ranging between 80% and 95% and an electrical conductivity higher than 100 S/cm. The porous solid materials (100) may have a predetermined volumetric surface area ranging between 3 m.sup.2/cm.sup.3 and 85 m.sup.2/cm.sup.3, a predetermined porosity ranging between 65% and 90% and an electrical conductivity higher than 2000 S/cm. Methods for the fabrication of such porous solid materials and devices including such porous solid material are also disclosed.

Porous solid materials are provided. The porous solid materials include a plurality of interconnected wires forming an ordered network. The porous solid materials may have a predetermined volumetric surface area ranging between 2 m.sup.2/cm.sup.3 and 90 m.sup.2/cm.sup.3, a predetermined porosity ranging between 3% and 90% and an electrical conductivity higher than 100 S/cm. The porous solid materials may have a predetermined volumetric surface area ranging between 3 m.sup.2/cm.sup.3 and 72 m.sup.2/cm.sup.3, a predetermined porosity ranging between 80% and 95% and an electrical conductivity higher than 100 S/cm. The porous solid materials (100) may have a predetermined volumetric surface area ranging between 3 m.sup.2/cm.sup.3 and 85 m.sup.2/cm.sup.3, a predetermined porosity ranging between 65% and 90% and an electrical conductivity higher than 2000 S/cm. Methods for the fabrication of such porous solid materials and devices including such porous solid material are also disclosed.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

At least one embodiment relates to a method for transforming at least part of a valve metal layer into a template that includes a plurality of spaced channels aligned longitudinally along a first direction. The method includes a first anodization step that includes anodizing the valve metal layer in a thickness direction to form a porous layer that includes a plurality of channels. Each channel has channel walls and a channel bottom. The channel bottom is coated with a first insulating metal oxide barrier layer as a result of the first anodization step. The method also includes a protective treatment. Further, the method includes a second anodization step after the protective treatment. The second anodization step substantially removes the first insulating metal oxide barrier layer, induces anodization, and creates a second insulating metal oxide barrier layer. In addition, the method includes an etching step.

At least one embodiment relates to a method for transforming at least part of a valve metal layer into a template that includes a plurality of spaced channels aligned longitudinally along a first direction. The method includes a first anodization step that includes anodizing the valve metal layer in a thickness direction to form a porous layer that includes a plurality of channels. Each channel has channel walls and a channel bottom. The channel bottom is coated with a first insulating metal oxide barrier layer as a result of the first anodization step. The method also includes a protective treatment. Further, the method includes a second anodization step after the protective treatment. The second anodization step substantially removes the first insulating metal oxide barrier layer, induces anodization, and creates a second insulating metal oxide barrier layer. In addition, the method includes an etching step.

The present invention relates to a method for chlorination of silver materials in the forms of wire, thick film paste and metallic sheet/disc. The method is environmentally friendly since the process does not produce hazardous chemicals or flammable gas. The electrochemical setup includes position the electrode containing silver materials in the anode and a platinum wire at the cathode. A DC voltage supply between 1 to 5 volts oxidizes the silver surface which receives chloride from imidazolium chloride solution to produce silver chloride on silver wire, film or disc. The imidazolium chloride reagent can be in aqueous solution or polar organic solvents or naturally exists in ionic liquid form. The imidazolium radical cation decomposes to produce a stabilized organic radical and an imidazole molecule. The stabilized radical recombines to produce volatile organic compound that can be recovered by simple distillation. The chlorination reagent can be regenerated by re-introducing the stabilized group at N.sub.1.

The present invention relates to a method for chlorination of silver materials in the forms of wire, thick film paste and metallic sheet/disc. The method is environmentally friendly since the process does not produce hazardous chemicals or flammable gas. The electrochemical setup includes position the electrode containing silver materials in the anode and a platinum wire at the cathode. A DC voltage supply between 1 to 5 volts oxidizes the silver surface which receives chloride from imidazolium chloride solution to produce silver chloride on silver wire, film or disc. The imidazolium chloride reagent can be in aqueous solution or polar organic solvents or naturally exists in ionic liquid form. The imidazolium radical cation decomposes to produce a stabilized organic radical and an imidazole molecule. The stabilized radical recombines to produce volatile organic compound that can be recovered by simple distillation. The chlorination reagent can be regenerated by re-introducing the stabilized group at N.sub.1.

A SUS surface treatment method for manufacturing a polymer-SUS joint structure having excellent bond strength is provided. A SUS surface treatment method for bonding with a polymer composite including a first etching step wherein the SUS surface is etched by acidic solution, a surface treatment step wherein the SUS surface is treated by ultrasonic wave, a second etching step wherein the SUS surface is etched again by acidic solution, a first silane coupling treatment step wherein the SUS surface is treated by anodic oxidation, a third etching step wherein the SUS surface is etched by acidic solution, and a second silane coupling treatment step wherein the SUS surface is treated by anodic oxidation.