A multi-material assembly is provided, as well as methods of making a multi-material assembly. The multi-material assembly includes a first coated structural component and a second structural component. The first coated structural component includes a first uncoated portion, and an adhesive is positioned between the second structural component and the first uncoated portion that secures the first coated structural component to the second structural component.

A coated metal alloy substrate with at least one chamfered edge, a process for producing a coated metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate with at least 10 one chamfered edge comprises a water transfer print layer deposited on the metal alloy substrate, a passivation layer deposited on the at least one chamfered edge, and an electrophoretic deposition layer deposited on the passivation layer.

A coated metal alloy substrate with at least one chamfered edge, a process for producing a coated metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate with at least 10 one chamfered edge comprises a water transfer print layer deposited on the metal alloy substrate, a passivation layer deposited on the at least one chamfered edge, and an electrophoretic deposition layer deposited on the passivation layer.

Examples of an alloy injection molded liquid metal substrate are described. In an example, an alloy injection molded liquid metal substrate includes a liquid metal substrate and an alloy injection molded on a first surface of the liquid metal substrate.

The present invention is directed to an addition polymer comprising an addition polymer backbone; at least one moiety comprising a sulfonic acid group; and at least one carbamate functional group. The present invention is also directed towards methods of making the addition polymer, aqueous resinous dispersions comprising the addition polymer, methods of coating a substrate and coated substrates.

The present invention is directed to an addition polymer comprising an addition polymer backbone; at least one moiety comprising a sulfonic acid group; and at least one carbamate functional group. The present invention is also directed towards methods of making the addition polymer, aqueous resinous dispersions comprising the addition polymer, methods of coating a substrate and coated substrates.

Example embodiments relate to a method of protecting a surface of an e-vaping device portion from corrosion, the method including preparing a coating mixture configured to protect the surface from corrosion, and coating the surface with a protective coating based on the coating mixture, wherein the coating is performed via one of electrodeposition, dipping, spraying, and vapor deposition, and the coating mixture includes at least one of a silane and a resin.

Example embodiments relate to a method of protecting a surface of an e-vaping device portion from corrosion, the method including preparing a coating mixture configured to protect the surface from corrosion, and coating the surface with a protective coating based on the coating mixture, wherein the coating is performed via one of electrodeposition, dipping, spraying, and vapor deposition, and the coating mixture includes at least one of a silane and a resin.

Provided is an electrodeposition dispersion including a polyamide-imide resin, a polar solvent, water, a poor solvent, and a base, in which the polar solvent is an organic solvent having a boiling point of higher than 100° C. and D.sub.(S-P) represented by a formula (1) satisfying a relationship of D.sub.(S-P)<6, and a weight-average molecular weight of the polyamide-imide is 10×10.sup.4 to 30×10.sup.4 or a number-average molecular weight of the polyamide-imide is 2×10.sup.4 to 5×10.sup.4.
D.sub.(S-P)=[(dD.sup.S−dD.sup.P).sup.2+(dP.sup.S−dP.sup.P).sup.2+(dH.sup.S−dH.sup.P).sup.2].sup.1/2  (1)

Provided is an electrodeposition dispersion including a polyamide-imide resin, a polar solvent, water, a poor solvent, and a base, in which the polar solvent is an organic solvent having a boiling point of higher than 100° C. and D.sub.(S-P) represented by a formula (1) satisfying a relationship of D.sub.(S-P)<6, and a weight-average molecular weight of the polyamide-imide is 10×10.sup.4 to 30×10.sup.4 or a number-average molecular weight of the polyamide-imide is 2×10.sup.4 to 5×10.sup.4.
D.sub.(S-P)=[(dD.sup.S−dD.sup.P).sup.2+(dP.sup.S−dP.sup.P).sup.2+(dH.sup.S−dH.sup.P).sup.2].sup.1/2  (1)