A system for electroplating a web of conductive material with a source material comprises a transport mechanism, an electrical contact, a plating bath, and at least one nozzle. The transport mechanism transports the web through the system. The electrical contact electrically engages the web to cause current to flow into the web. The plating bath contains a volume of an electrically conductive liquid contain ions of the source material. The nozzle is configured to flow a low electrical conductivity fluid onto the web. A portion of the web is immersed in the electrically conductive liquid. The current flowing in the web causes the ions of the source material in the electrically conductive liquid to attach to a surface of the portion of the web.

A system for electroplating a web of conductive material with a source material comprises a transport mechanism, an electrical contact, a plating bath, and at least one nozzle. The transport mechanism transports the web through the system. The electrical contact electrically engages the web to cause current to flow into the web. The plating bath contains a volume of an electrically conductive liquid contain ions of the source material. The nozzle is configured to flow a low electrical conductivity fluid onto the web. A portion of the web is immersed in the electrically conductive liquid. The current flowing in the web causes the ions of the source material in the electrically conductive liquid to attach to a surface of the portion of the web.

A belt conveyer 7 includes a metal belt-shaped conveyer main body 9 and a metal clip 8 held on the conveyer main body 9, and clamps an end part on one side of a work 14 by the spring force of the metal clip 8. A roller conveyer 6 includes multiple conveying rollers 10 that rotate in synch with the belt conveyer 7 and supports the work 14 from below where an end part on the other side of the work 14 clamped by the belt conveyer 7 is placed on the plurality of conveying rollers. The work 14 is conveyed in a horizontal position and is subjected to plating, with the end part on the one side of the work 14 clamped by the belt conveyer 7 and end part on the other side of the work 14 placed on the roller conveyer 6.

Systems and methods for coating a metallic component are provided. In one embodiment, a metallic coating may be disposed in a plating bath comprising AlBr3. The metallic coating may be coupled with, or configured as, a working electrode. A counter electrode formed of aluminum may be disposed within the plating bath. An electric current may be applied between the two electrodes resulting in the electrodeposition of aluminum on the metallic component. In one particular embodiment, the plating bath may include LiBr, KBr and CsBr, with AlBr.sub.3 being present in an amount of approximately 80 percent or greater by weight. Various types of metals may be coated with aluminum using embodiments of the present disclosure. Additionally, the methods and systems described herein are amenable to coating of complex geometries.

Systems and methods for coating a metallic component are provided. In one embodiment, a metallic coating may be disposed in a plating bath comprising AlBr3. The metallic coating may be coupled with, or configured as, a working electrode. A counter electrode formed of aluminum may be disposed within the plating bath. An electric current may be applied between the two electrodes resulting in the electrodeposition of aluminum on the metallic component. In one particular embodiment, the plating bath may include LiBr, KBr and CsBr, with AlBr.sub.3 being present in an amount of approximately 80 percent or greater by weight. Various types of metals may be coated with aluminum using embodiments of the present disclosure. Additionally, the methods and systems described herein are amenable to coating of complex geometries.

A method of forming a corrosion-resistant ceramic coating on a metallic substrate, the method comprising providing a passivation layer on a surface of the metallic substrate by electrochemical passivation of the metallic substrate under a first electrical current and using a first electrically conducting solution; and providing the corrosion-resistant ceramic coating on an outermost surface of the metallic substrate, the outermost surface in use adapted to be exposed to a corrosive environment, by plasma electrolytic oxidation of the metallic substrate with the passivation layer, in a second electrically conducting solution and under a second electrical current having a discharge voltage. The first and the second electrically conducting solutions comprise a tetrafluoroborate compound.

A method of forming a corrosion-resistant ceramic coating on a metallic substrate, the method comprising providing a passivation layer on a surface of the metallic substrate by electrochemical passivation of the metallic substrate under a first electrical current and using a first electrically conducting solution; and providing the corrosion-resistant ceramic coating on an outermost surface of the metallic substrate, the outermost surface in use adapted to be exposed to a corrosive environment, by plasma electrolytic oxidation of the metallic substrate with the passivation layer, in a second electrically conducting solution and under a second electrical current having a discharge voltage. The first and the second electrically conducting solutions comprise a tetrafluoroborate compound.

A system is provided for use with a volume of metal particles suspended in electroplating solution. The system includes: a positional tip operable to have a positive electrical bias; a dispenser operable to dispense at least one of the metal particles and the electroplating solution; a metal base depositing system operable to deposit a metal base; a controller operable to control the positional tip to move and to control the dispenser to dispense the at least one of the metal particles and the electroplating solution; and a voltage controller operable to provide the positive electrical bias to the positional tip and to provide a negative electrical bias to the metal base so as to electroplate metal onto the metal base from the particles suspended in the electroplating solution and so as to three-dimensionally print a metal shape.

An anode assembly allowing the anode to be easily pulled up from a plating tank is disclosed. The anode assembly includes: an anode structure; and an anode holder. The anode structure includes: an anode; and a feeding member. The anode holder includes: an anode support frame having a space in which the anode structure is arranged; a conductive bar; and a feeding electrode attached to an end of the conductive bar. One end of the feeding member is fixed to the anode, and the other end of the feeding member is detachably fixed to the conductive bar. The anode support frame has a positioning guide portion into which a lower end of the anode structure is inserted. The anode assembly is configured to allow the anode structure to be separated from the anode holder and pulled up from the plating tank when the feeding member is detached from the conductive bar.

An anode assembly allowing the anode to be easily pulled up from a plating tank is disclosed. The anode assembly includes: an anode structure; and an anode holder. The anode structure includes: an anode; and a feeding member. The anode holder includes: an anode support frame having a space in which the anode structure is arranged; a conductive bar; and a feeding electrode attached to an end of the conductive bar. One end of the feeding member is fixed to the anode, and the other end of the feeding member is detachably fixed to the conductive bar. The anode support frame has a positioning guide portion into which a lower end of the anode structure is inserted. The anode assembly is configured to allow the anode structure to be separated from the anode holder and pulled up from the plating tank when the feeding member is detached from the conductive bar.