Patent classifications
C25D17/04
Systems and methods for preparing and plating of work rolls
The present embodiments are directed to systems and methods for plating of work rolls. In one embodiment, a system includes an inner tank having an inner diameter dimensioned to receive a work roll, and an outer tank, wherein the inner tank is disposed coaxially within the outer tank. The inner tank and the outer tank may each include cylindrical shapes. A temperature regulating tank, positioned outside of the outer tank, may be in fluid communication with an annular space between the inner and outer tanks. An exhaust hood having a generally ring-shaped profile including a plurality of slots formed therein may suction fumes from the inner tank. An anode configuration also is disclosed, having a shunt incorporated into the anode, wherein current going to the anode passes through the shunt.
Systems and methods for preparing and plating of work rolls
The present embodiments are directed to systems and methods for plating of work rolls. In one embodiment, a system includes an inner tank having an inner diameter dimensioned to receive a work roll, and an outer tank, wherein the inner tank is disposed coaxially within the outer tank. The inner tank and the outer tank may each include cylindrical shapes. A temperature regulating tank, positioned outside of the outer tank, may be in fluid communication with an annular space between the inner and outer tanks. An exhaust hood having a generally ring-shaped profile including a plurality of slots formed therein may suction fumes from the inner tank. An anode configuration also is disclosed, having a shunt incorporated into the anode, wherein current going to the anode passes through the shunt.
System for Electrochemical Treatment and Method Thereof
A head unit for electrochemical treatment of a surface including a handle having an output tube and a vacuum tube. The output tube and the vacuum tube configured to couple the handle to a portable cart. The head unit including a body coupled to the handle and an electrode disposed within the body and coupled to the output tube and the vacuum tube. The electrode including a plurality of output channels for outputting an electrochemical solution and a plurality of vacuum channels for vacuuming the electrochemical solution outputted from the plurality of output channels. Each of the plurality of output channels is disposed proximate to at least one of the plurality of vacuum channels and the electrode is fluidly coupled to the output tube to receive the electrochemical solution from the output tube.
System for Electrochemical Treatment and Method Thereof
A head unit for electrochemical treatment of a surface including a handle having an output tube and a vacuum tube. The output tube and the vacuum tube configured to couple the handle to a portable cart. The head unit including a body coupled to the handle and an electrode disposed within the body and coupled to the output tube and the vacuum tube. The electrode including a plurality of output channels for outputting an electrochemical solution and a plurality of vacuum channels for vacuuming the electrochemical solution outputted from the plurality of output channels. Each of the plurality of output channels is disposed proximate to at least one of the plurality of vacuum channels and the electrode is fluidly coupled to the output tube to receive the electrochemical solution from the output tube.
DEVICE AND METHOD FOR COATING A COMPONENT OR SEMI-FINISHED PRODUCT WITH A CHROMIUM LAYER
The invention relates to a device for coating a component or semi-finished product with a chromium layer, the device comprising an undivided deposition cell, in which there is an anode and which is suitable for receiving a cathodically connected component, wherein: there is an electrolyte solution containing chromium(II) in the deposition cell; the device has an electrolytic cell, which is divided by a membrane disposed in the electrolytic cell into a cathode chamber, in which there is a cathode, and an anode chamber, in which there is an anode; the cathode chamber is connected to the deposition cell by means of a line and a pump disposed in the line; the pump can pump liquid from the cathode chamber into the deposition cell and/or can pump liquid from the deposition cell into the cathode chamber.
DEVICE AND METHOD FOR COATING A COMPONENT OR SEMI-FINISHED PRODUCT WITH A CHROMIUM LAYER
The invention relates to a device for coating a component or semi-finished product with a chromium layer, the device comprising an undivided deposition cell, in which there is an anode and which is suitable for receiving a cathodically connected component, wherein: there is an electrolyte solution containing chromium(II) in the deposition cell; the device has an electrolytic cell, which is divided by a membrane disposed in the electrolytic cell into a cathode chamber, in which there is a cathode, and an anode chamber, in which there is an anode; the cathode chamber is connected to the deposition cell by means of a line and a pump disposed in the line; the pump can pump liquid from the cathode chamber into the deposition cell and/or can pump liquid from the deposition cell into the cathode chamber.
Apparatus for plating and method of controlling apparatus for plating
An object is to reduce the field shielding effect of a paddle during plating. There is provided an apparatus for plating that is configured to plate a substrate and comprises a plating tank; an anode placed in the plating tank; a rotation mechanism configured to rotate the substrate in a first direction and in a second direction that is opposite to the first direction; and a control device configured to control the rotation mechanism, such that a time period when the substrate is rotated in the first direction becomes equal to a time period when the substrate is rotated in the second direction or such that a time integrated value of a rotation speed in the first direction becomes equal to a time integrated value of a rotation speed in the second direction.
Apparatus for plating and method of controlling apparatus for plating
An object is to reduce the field shielding effect of a paddle during plating. There is provided an apparatus for plating that is configured to plate a substrate and comprises a plating tank; an anode placed in the plating tank; a rotation mechanism configured to rotate the substrate in a first direction and in a second direction that is opposite to the first direction; and a control device configured to control the rotation mechanism, such that a time period when the substrate is rotated in the first direction becomes equal to a time period when the substrate is rotated in the second direction or such that a time integrated value of a rotation speed in the first direction becomes equal to a time integrated value of a rotation speed in the second direction.
Plating systems having reduced air entrainment
Electroplating processing systems according to the present technology may include a recirculating tank containing a first volume of processing fluid. The recirculating tank may be fluidly coupled with a delivery pump. The systems may include a vessel configured to receive the processing fluid from the pump. The vessel may include an inner chamber and an outer chamber, and the inner chamber may be sized to hold a second volume of processing fluid less than the first volume of processing fluid. A liquid level sensor may be associated with the vessel to provide a liquid level indication in the outer chamber. The systems may include a return line coupled with an outlet of the vessel and coupled with an inlet of the recirculating tank. The systems may also include a return pump fluidly coupled with the return line. The return pump may be electrically coupled with the liquid level sensor.
Plating systems having reduced air entrainment
Electroplating processing systems according to the present technology may include a recirculating tank containing a first volume of processing fluid. The recirculating tank may be fluidly coupled with a delivery pump. The systems may include a vessel configured to receive the processing fluid from the pump. The vessel may include an inner chamber and an outer chamber, and the inner chamber may be sized to hold a second volume of processing fluid less than the first volume of processing fluid. A liquid level sensor may be associated with the vessel to provide a liquid level indication in the outer chamber. The systems may include a return line coupled with an outlet of the vessel and coupled with an inlet of the recirculating tank. The systems may also include a return pump fluidly coupled with the return line. The return pump may be electrically coupled with the liquid level sensor.