A finishing system includes a frame that includes a bath station configured to communicate with an electrode. A hoist supported by the frame is movable into register with the bath station to establish electrical communication between the hoist and a current generated by a power source. The current drives deposition of a coating onto a load carried by the hoist. A drive assembly of the system is supported by the hoist and is operable to rotate a sprocket. The drive assembly includes a rotary conductor electrically coupled to the sprocket and configured to come into electrical communication with the frame. An electrically conductive lifting chain is operable through rotation of the sprocket to lower the load into the bath station. The frame communicates current from the power source to the rotary conductor, and the lifting chain communicates current from the rotary conductor to the load.

A finishing system includes a frame that includes a bath station configured to communicate with an electrode. A hoist supported by the frame is movable into register with the bath station to establish electrical communication between the hoist and a current generated by a power source. The current drives deposition of a coating onto a load carried by the hoist. A drive assembly of the system is supported by the hoist and is operable to rotate a sprocket. The drive assembly includes a rotary conductor electrically coupled to the sprocket and configured to come into electrical communication with the frame. An electrically conductive lifting chain is operable through rotation of the sprocket to lower the load into the bath station. The frame communicates current from the power source to the rotary conductor, and the lifting chain communicates current from the rotary conductor to the load.

A method of operating a finishing system includes providing a plurality of stations along a frame in a process direction, each station configured to receive and treat a load. A latent coating material is suspended in a liquid provided in an immersion station. A power supply generates electrical charge to the frame and the liquid. A hoist moves along the process direction and into register with the immersion station, the hoist including an electrically conductive lifting chain and an electrically conductive sprocket meshed with the lifting chain. The power supply and the sprocket are electrically communicated through the hoist. The load is connected to the lifting chain and immersed in the liquid. A path of conduction is established between the sprocket and the load solely through the lifting chain. Electrophoretic deposition of the coating material onto the load is driven through the electrical charge generated by the power supply.

A method of operating a finishing system includes providing a plurality of stations along a frame in a process direction, each station configured to receive and treat a load. A latent coating material is suspended in a liquid provided in an immersion station. A power supply generates electrical charge to the frame and the liquid. A hoist moves along the process direction and into register with the immersion station, the hoist including an electrically conductive lifting chain and an electrically conductive sprocket meshed with the lifting chain. The power supply and the sprocket are electrically communicated through the hoist. The load is connected to the lifting chain and immersed in the liquid. A path of conduction is established between the sprocket and the load solely through the lifting chain. Electrophoretic deposition of the coating material onto the load is driven through the electrical charge generated by the power supply.

The present disclosure relates to a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a device for chemical and/or electrolytic surface treatment of a substrate in a process fluid, a use of the distribution system, and a method for manufacturing the distribution system. The distribution system comprises: a first distribution body, a substitute body, and a framework. The first distribution body is configured to direct a flow of the process fluid and/or an electrical current to the substrate. The first distribution body and the substitute body are arranged to insert the substrate between them. The framework is configured to mount the first distribution body and the substitute body relative to each other. The framework is further configured to form, together with the first distribution body and the substitute body, a casing surrounding the substrate.

The present disclosure relates to a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a device for chemical and/or electrolytic surface treatment of a substrate in a process fluid, a use of the distribution system, and a method for manufacturing the distribution system. The distribution system comprises: a first distribution body, a substitute body, and a framework. The first distribution body is configured to direct a flow of the process fluid and/or an electrical current to the substrate. The first distribution body and the substitute body are arranged to insert the substrate between them. The framework is configured to mount the first distribution body and the substitute body relative to each other. The framework is further configured to form, together with the first distribution body and the substitute body, a casing surrounding the substrate.

The present invention relates to a plating device for improving plating quality and preventing gloss deterioration of an object to be plated. An object of the present invention is to improve both plating quality and manufacturing yield of a vertical continuous plating bath or a general dip-type plating bath. In an embodiment, the present invention provides a plating device for improving plating quality and preventing gloss deterioration of an object to be plated, wherein the plating device includes a plating bath, an e-duct, a substrate mounting bar, and a mounting bar moving unit. Thus, the inventive plating device injects pressure through the e-duct while moving the to-be-plated object in the forward/rearward, left/right, and upward/downward directions within the plating bath, so that the influence of the e-duct can be evenly applied to to-be-plated objects with different aspect ratios and thicknesses.

The application discloses a method of liquid cold welding (LCW) including: (a) engaging two or more porous conductive substrate layers between perforated non-conductive frames so that the substrate layers contact one another; (b) immersing the substrate layers in an electrolyte solution; and (c) applying electric current and/or voltage and/or electric power to the electrolyte solution. Apparatus suitable for performance of some embodiments of the method are also disclosed.

The application discloses a method of liquid cold welding (LCW) including: (a) engaging two or more porous conductive substrate layers between perforated non-conductive frames so that the substrate layers contact one another; (b) immersing the substrate layers in an electrolyte solution; and (c) applying electric current and/or voltage and/or electric power to the electrolyte solution. Apparatus suitable for performance of some embodiments of the method are also disclosed.

A horizontal electroplating production line includes a horizontal electroplating apparatus and a circuit board feeding device. The horizontal electroplating apparatus includes a first frame, an electroplating tank and a horizontal electroplating conveying device arranged at the first frame, the electroplating tank extends along a first direction, the horizontal electroplating conveying device is configured to clamp a circuit board and move the circuit board in the electroplating tank for electroplating, the circuit board feeding device includes a second frame and a feeding conveying mechanism arranged at the second frame, the feeding conveying mechanism is a conveying line with a certain length, and the feeding conveying mechanism is configured to place the circuit board horizontally and convey the circuit board to the horizontal electroplating conveying device of the electroplating apparatus.