A method of making Flat No-Lead Packages with plated lead surfaces exposed on lateral faces thereof. The method includes providing a plurality of Flat No-Lead Packages having severed, unplated lead surfaces exposed on lateral faces thereof and having plated lead surfaces exposed on bottom faces thereof. The method further includes batch electroplating the severed unplated lead surfaces of the plurality of Flat No-Lead Packages.

A system and method for plating a workpiece are described. In one aspect, an apparatus includes a deposition chamber, a workpiece holder adapted for insertion into and removal from the deposition chamber, a shield with patterns of apertures corresponding to features on the workpiece, a shield holder also adapted for insertion into and removal from the deposition chamber and a positioning mechanism to position the workpiece in the workpiece holder such that the pattern of apertures on the shield will align with the corresponding features on the workpiece when the workpiece holder and shield holder are inserted into the deposition chamber.

There is provided a substrate holder for holding a substrate including a first holding member having a first opening portion for exposing a first surface of the substrate, and a second holding member configured to hold the substrate together with the first holding member and having a second opening portion for exposing a second surface of the substrate, wherein the first holding member has at least one first external connection contact, and the second holding member has at least one second external connection contact that is independent of the first external connection contact.

There is provided a substrate holder for holding a substrate including a first holding member having a first opening portion for exposing a first surface of the substrate, and a second holding member configured to hold the substrate together with the first holding member and having a second opening portion for exposing a second surface of the substrate, wherein the first holding member has at least one first external connection contact, and the second holding member has at least one second external connection contact that is independent of the first external connection contact.

The workpiece holding jig includes a first frame body and a second frame body, both frame bodies each have a body, a conductive member, a contact member provided so as to be able to come into electrical contact with a periphery of a workpiece, and an inner circumferential seal member provided over an entire circumference of the body. Both frame bodies are configured to constitute a seal space for accommodating the periphery of the workpiece, the conductive member of both frame bodies, and the contact member of both frame bodies, in a state where each of the inner circumferential seal members and the contact member abut against the periphery of the workpiece from both sides. The inner circumferential seal member has a contact projection, and an inner surface of the contact projection is slanted outward.

The workpiece holding jig includes a first frame body and a second frame body, both frame bodies each have a body, a conductive member, a contact member provided so as to be able to come into electrical contact with a periphery of a workpiece, and an inner circumferential seal member provided over an entire circumference of the body. Both frame bodies are configured to constitute a seal space for accommodating the periphery of the workpiece, the conductive member of both frame bodies, and the contact member of both frame bodies, in a state where each of the inner circumferential seal members and the contact member abut against the periphery of the workpiece from both sides. The inner circumferential seal member has a contact projection, and an inner surface of the contact projection is slanted outward.

A decorative work piece or component, such as a decorative automotive trim component, and method for plating a work piece is provided. An electroless layer of material is applied to the work piece using an electroless plating process. A barrier in electrical conductivity is provided on the work piece to divide the work piece into a first segment and a second segment which are substantially electrically insulated from one another, prior to electroplating the work piece. A plurality of methods are disclosed for dividing the work piece into the first and second segments. The component includes different surface finishes on each of the electrically isolated segments, with the finishes having different appearance, gloss level, color, and/or distinction of image as a result of electroplating and without post-electroplating mechanical alteration and assembly.

The present disclosure illustrates a vertical electroplating module and an electroplating method for a fan-out panel level chip. The vertical electroplating module has an electroplating tank module, an exhaust tank module and a clamping module. A first box of the electroplating tank module has a first receiving chamber, a second receiving chamber and a third receiving chamber, the first receiving chamber is communicated with a bottom of the second receiving chamber, and a top of the second receiving chamber is communicated with the third receiving chamber. The exhaust tank module is communicated with the first receiving chamber and the third receiving chamber respectively via a first pump and a second pump. The clamping module is disposed around the opening on a wall of the second receiving chamber. The production made by the vertical electroplating module can meet a single-side production, without immersing the entire product in the chemical medicine.

A method capable of removing a liquid from a seal of a substrate holder so as to prevent contact between the liquid and an electrical contact of the substrate holder is provided. The method includes: immersing the substrate in a plating solution, with a seal and an electrical contact of the substrate holder in contact with the substrate; applying a voltage between the substrate and an anode in the presence of the plating solution to plate the substrate; pulling up the plated substrate from the plating solution; separating the seal from the plated substrate; and forming a flow of gas passing through a gap between the plated substrate and the seal, the flow of gas being directed from an inside to an outside of the substrate holder.

The present invention relates to a plating hanger device having a shock-absorbing structure and, more specifically, to a plating hanger device having a shock-absorbing structure, the device allowing a hanger to be transferred at a uniform speed and reducing noise and shock, which are generated during transferring, so as to enable a uniform plated layer to be formed on a substrate. According to the plating hanger device having the shock-absorbing structure, of the present invention, an elastic spring is pressed by the load of the plating hanger device and a jig, and sequentially, the elastic spring presses a connection shaft and the connection shaft presses a transfer housing so as to improve adhesion between the transfer housing and a driving gear, thereby enabling transferring at uniform speed, and reducing the noise and shock generated during transferring by means of the elastic spring.