Patent classifications
C25D17/14
Color Controlled Metal Finishing Pen
Convenient anodizing is provided through a pen form factor anodizing tool having a reservoir for holding anodizing fluid and an electrical cable connection communicating electrical power to a tip dispensing anodizing fluid from the reservoir at a anodizing voltage from electrical power through the electrical cable connection.
METHOD FOR PRODUCING METAL POROUS BODY, AND PLATING APPARATUS
A method for producing a metal porous body includes the steps of: performing electrical conduction treatment on a surface of a skeleton of a sheet-like resin porous body having the skeleton with a three-dimensional network structure, to obtain a conductive resin porous body having a conductive layer; performing electroplating treatment on a surface of a skeleton of the conductive resin porous body to obtain a plated resin porous body having a metal plating layer; and performing treatment of removing at least the resin porous body from the plated resin porous body to obtain a metal porous body. In the electroplating treatment, the conductive resin porous body is supplied with power by a rotating electrode roller, the electrode roller is supplied with power by bringing a power supply brush formed by a material containing iron as a main component into sliding contact with a part of a rotation shaft, and at least a surface of at least the part of the rotation shaft with which the power supply brush is brought into contact is formed by a material containing iron or nickel as a main component.
METHOD FOR PRODUCING METAL POROUS BODY, AND PLATING APPARATUS
A method for producing a metal porous body includes the steps of: performing electrical conduction treatment on a surface of a skeleton of a sheet-like resin porous body having the skeleton with a three-dimensional network structure, to obtain a conductive resin porous body having a conductive layer; performing electroplating treatment on a surface of a skeleton of the conductive resin porous body to obtain a plated resin porous body having a metal plating layer; and performing treatment of removing at least the resin porous body from the plated resin porous body to obtain a metal porous body. In the electroplating treatment, the conductive resin porous body is supplied with power by a rotating electrode roller, the electrode roller is supplied with power by bringing a power supply brush formed by a material containing iron as a main component into sliding contact with a part of a rotation shaft, and at least a surface of at least the part of the rotation shaft with which the power supply brush is brought into contact is formed by a material containing iron or nickel as a main component.
Selective Electrochemical Machining of Workpieces and Systems for Producing a Workpiece
Various embodiments include a device for the selective electrochemical machining of workpieces comprising: a machining head equipped with an electrolyte transmitter; and a supply channel for an electrolyte. The electrolyte transmitter is arranged in an interior of the supply channel and protrudes through an outlet opening of the supply channel to form a machining surface for the workpiece. The electrolyte transmitter comprises a cylinder arranged movably in the supply channel axially displaceable in the outlet opening.
PLATING DIAPHRAGM, PLATING METHOD, AND PLATING APPARATUS
Provided is a plating diaphragm used for a plating method including disposing the plating diaphragm between an anode and a substrate that is a cathode, applying a voltage between the anode and the substrate, in a state in which a surface of the substrate is in contact with the plating diaphragm, to reduce metal ions contained in the plating diaphragm, and depositing a metal derived from the metal ions on the surface of the substrate, to form a metal film on the surface of the substrate, the plating diaphragm containing a base made of a polyolefin porous membrane, in a case in which pure water is dropped on a surface of the plating diaphragm, a contact angle between a droplet of the pure water and the surface of the plating diaphragm after one second has passed since landing of the droplet of the pure water on the surface is from 0 to 90, and a tensile breaking strength is from 11 MPa to 300 MPa.
Systems and methods for electroprocessing a gun barrel using a moving electrode
A guide system for use in electro-processing a bore of a gun barrel includes a non-conductive external bore guide and a non-conductive internal bore guide. The external bore guide is an adapter that is configured to removably engage the outside of the gun barrel and includes a conduit formed therein. The conduit is disposed such that it is axially aligned with a bore of the gun barrel when the external bore guide is engaged with the gun barrel. The internal bore guide is elongated and includes an axial recess that is sized to seat an electro-processing electrode (an anode). A method for uniformly plating the bore includes moving an anode through the gun barrel at one or more rate(s) of travel to uniformly plate the bore is also disclosed. The plating is sufficiently uniform to conform to military specifications. The systems, methods, support structures, etc. described herein are particularly well-suited to plating small-bore gun barrels.
Systems and methods for electroprocessing a gun barrel using a moving electrode
A guide system for use in electro-processing a bore of a gun barrel includes a non-conductive external bore guide and a non-conductive internal bore guide. The external bore guide is an adapter that is configured to removably engage the outside of the gun barrel and includes a conduit formed therein. The conduit is disposed such that it is axially aligned with a bore of the gun barrel when the external bore guide is engaged with the gun barrel. The internal bore guide is elongated and includes an axial recess that is sized to seat an electro-processing electrode (an anode). A method for uniformly plating the bore includes moving an anode through the gun barrel at one or more rate(s) of travel to uniformly plate the bore is also disclosed. The plating is sufficiently uniform to conform to military specifications. The systems, methods, support structures, etc. described herein are particularly well-suited to plating small-bore gun barrels.
METHOD OF NO-BATH PLASMA ELECTROLYTIC OXIDATION AND DEVICE FOR IMPLEMENTING THE SAME
An applicator for no-bath plasma gel electrolytic oxidation of a workpiece made of a valve metal or an alloy thereof; the applicator movable over a surface of a workpiece to be treated. The applicator including an electrode connectable to a power supply and configured for applying electric voltage to a gap between the electrode and a workpiece. A gel electrolytic medium body is mounted in a holder being in an electric contact with the electrode.
FILM FORMING APPARATUS FOR FORMING METAL FILM
Provided is a metal film forming apparatus capable of forming a uniform metal film on a surface of a substrate by uniformly pressurizing an electrolyte membrane against the surface of the substrate. The film forming apparatus includes first and second film forming units, a coupling portion that couples the first and second film forming units together, a pressure device including a pressure unit that pressurizes substrates with electrolyte membranes of the respective film forming units via the coupling portion, and a power supply unit adapted to apply a voltage across each anode and each substrate. The film forming units are coupled to the coupling portion via their respective first elastic bodies that elastically deform in the pressurization direction of the pressure unit.
Film forming method for metal film and film forming apparatus therefor
In a film forming method, in a state where a metal solution is sealed in a first accommodation chamber of a housing with a solid electrolyte membrane and a fluid is sealed in a second accommodation chamber of a placing table with a thin film, a substrate is placed on the placing table and the placing table and the housing are moved relative to each other to cause the substrate to be interposed between the solid electrolyte membrane and the thin film, the solid electrolyte membrane and the thin film are pressed against the substrate interposed therebetween to cause the solid electrolyte membrane and the thin film to conform to a surface and a rear surface of the substrate, thereby forming a metal film.