An electrochemical treatment system includes a treatment fluid supply manifold, a fluid return manifold, and an electrode section connected to the treatment fluid supply manifold. A plurality of treatment fluid supply ports feed fluid through or across the electrode and a plurality of fluid return ports proximate the treatment fluid supply ports are connected to the fluid return manifold. A porous pad is coupled to the electrode section for contacting a substrate to be treated and receives the treatment fluid via the plurality of treatment fluid supply ports. The plurality of fluid return ports remove spent and excess treatment fluid and gases from the substrate, the surrounding air, and the porous pad.

A solid electrolyte membrane (13) is arranged on a surface of an anode (11) between the anode (11) and a substrate (B) that serves as a cathode. The solid electrolyte membrane (13) is brought into contact with the substrate (B). At the same time, a metal film (F) is formed on the surface of the substrate (B) by causing metal to precipitate onto the surface of the substrate (B) from metal ions through application of voltage between the anode (11) and the substrate (B) in a first contact state where the solid electrolyte membrane (13) contacts the substrate (B). The metal ions are contained inside the solid electrolyte membrane (13).

A solid electrolyte membrane (13) is arranged on a surface of an anode (11) between the anode (11) and a substrate (B) that serves as a cathode. The solid electrolyte membrane (13) is brought into contact with the substrate (B). At the same time, a metal film (F) is formed on the surface of the substrate (B) by causing metal to precipitate onto the surface of the substrate (B) from metal ions through application of voltage between the anode (11) and the substrate (B) in a first contact state where the solid electrolyte membrane (13) contacts the substrate (B). The metal ions are contained inside the solid electrolyte membrane (13).

The present invention relates to a method for structuring layers of oxidisable materials. At least one layer, disposed on a substrate, of an oxidisable material is hereby subjected to local oxidation with at least one oxidation step. In the case of the latter, at least one selected region of the layer of oxidisable material is oxidised so that the layer, after oxidation, is sub-divided into regions, which are electrically insulated from each other, by at least one oxidised region extending over the entire layer thickness.

The presently disclosed apparatus and method offer the capability to electroplate pure metals or alloys onto substrates, having no current collectors or being connected to the power supply by a low conductivity seed layer. Thus, the disclosed system enables pure metal or alloy deposition on various substrates, including flexible electronic circuits, wafers for IC processing, and discrete electronic devices in surface finishing applications.

The presently disclosed apparatus and method offer the capability to electroplate pure metals or alloys onto substrates, having no current collectors or being connected to the power supply by a low conductivity seed layer. Thus, the disclosed system enables pure metal or alloy deposition on various substrates, including flexible electronic circuits, wafers for IC processing, and discrete electronic devices in surface finishing applications.

A head unit for electrochemical treatment of a surface including a handle having an output tube and a vacuum tube. The output tube and the vacuum tube configured to couple the handle to a portable cart. The head unit including a body coupled to the handle and an electrode disposed within the body and coupled to the output tube and the vacuum tube. The electrode including a plurality of output channels for outputting an electrochemical solution and a plurality of vacuum channels for vacuuming the electrochemical solution outputted from the plurality of output channels. Each of the plurality of output channels is disposed proximate to at least one of the plurality of vacuum channels and the electrode is fluidly coupled to the output tube to receive the electrochemical solution from the output tube.

Reagents A, B, C are added to an electrolyte bath for co-depositing tin-bismuth alloys (SnBi). Reagent A is a larger acid molecule that binds to Bi.sup.3+ ions while reagent B is a small molecule that binds to the Bi.sup.3+ ions in spaces between the reagent A molecules. Reagents A and B reduce the standard electrode potential difference of Sn and Bi to permit co-deposition rates that yield a SnBi alloy of 30-70% Bi by weight, around the 58% eutectic, with an alloy melting point below 180 C. for use as a low-temperature solder. Reagent C has a hydrophilic end that attaches to the electrode surface and a hydrophobic tail that is an aliphatic chain that attracts hydrogen gas, removing H.sub.2 gas from the electrode surface. Reagent C improves alloy microstructure by removing H.sub.2 gas generated at the cathode that can block Bi.sup.3+ ions from uniformly depositing on the surface.

Reagents A, B, C are added to an electrolyte bath for co-depositing tin-bismuth alloys (SnBi). Reagent A is a larger acid molecule that binds to Bi.sup.3+ ions while reagent B is a small molecule that binds to the Bi.sup.3+ ions in spaces between the reagent A molecules. Reagents A and B reduce the standard electrode potential difference of Sn and Bi to permit co-deposition rates that yield a SnBi alloy of 30-70% Bi by weight, around the 58% eutectic, with an alloy melting point below 180 C. for use as a low-temperature solder. Reagent C has a hydrophilic end that attaches to the electrode surface and a hydrophobic tail that is an aliphatic chain that attracts hydrogen gas, removing H.sub.2 gas from the electrode surface. Reagent C improves alloy microstructure by removing H.sub.2 gas generated at the cathode that can block Bi.sup.3+ ions from uniformly depositing on the surface.

An apparatus for electromodification of a conductive surface of a part may comprise a stencil having a mask pattern, a retainer joined to the stencil and configured to capture an electrolyte, and a sacrificial metal joined to the stencil and the retainer for form an integrated assembly. The stencil may be positioned in the assembly to contact the conductive surface of the part, and establish electrical contact between the electrolyte and the conductive surface through the mask pattern when electrical power with a predetermined polarity is applied between the sacrificial metal and the conductive surface.