The present invention relates to the field of plating, including, but not limited to electroplating metallic articles, for example metallic discs that can be used as, or converted into, coins. Embodiments of the present invention described herein incorporate luminescent particles into plated metallic layers so that they can be detected for security purposes.

The present invention relates to the field of plating, including, but not limited to electroplating metallic articles, for example metallic discs that can be used as, or converted into, coins. Embodiments of the present invention described herein incorporate luminescent particles into plated metallic layers so that they can be detected for security purposes.

A rotational surface treating device with a high treatment efficiency that allows a treatment liquid to be discharged in a short time is provided. When a treatment bath 2 is rotated, parts 20 contact an electrode 50 to be electroplated. In this event, a plating liquid 16 is used as circulated by a pump P. The plating liquid 16 is discharged to the outside through a gap in a side wall 80 for replacement of the plating liquid 16 or the like. During discharge, the plating liquid 16 is not circulated by the pump P. The gap 8 which is formed in the side wall 80 is formed to be smaller than the minimum dimension of the parts 20 on the inner side. The gap 8 is formed to be wider toward the outer side. Thus, water is discharged immediately.

A rotational surface treating device with a high treatment efficiency that allows a treatment liquid to be discharged in a short time is provided. When a treatment bath 2 is rotated, parts 20 contact an electrode 50 to be electroplated. In this event, a plating liquid 16 is used as circulated by a pump P. The plating liquid 16 is discharged to the outside through a gap in a side wall 80 for replacement of the plating liquid 16 or the like. During discharge, the plating liquid 16 is not circulated by the pump P. The gap 8 which is formed in the side wall 80 is formed to be smaller than the minimum dimension of the parts 20 on the inner side. The gap 8 is formed to be wider toward the outer side. Thus, water is discharged immediately.

A plating apparatus includes a plating tank and a plating unit that performs electrolytic plating on an object. The plating unit includes a workpiece passage region including a partition wall that allows passage of the plating solution but does not allow passage of the object, the workpiece passage region passing the object from above toward below, an injection unit that injects the plating solution from below toward above, a mixing unit that mixes the plating solution injected by the injection unit and the object to be plated passing through the workpiece passage region, an anode outside the workpiece passage region, a cathode inside the workpiece passage region including a hollow region through which a mixed fluid of the plating solution and the object to be plated passes from below toward above, and a guidance unit that guides the mixed fluid to the workpiece passage region.

A plating apparatus includes a plating tank and a plating unit that performs electrolytic plating on an object. The plating unit includes a workpiece passage region including a partition wall that allows passage of the plating solution but does not allow passage of the object, the workpiece passage region passing the object from above toward below, an injection unit that injects the plating solution from below toward above, a mixing unit that mixes the plating solution injected by the injection unit and the object to be plated passing through the workpiece passage region, an anode outside the workpiece passage region, a cathode inside the workpiece passage region including a hollow region through which a mixed fluid of the plating solution and the object to be plated passes from below toward above, and a guidance unit that guides the mixed fluid to the workpiece passage region.

An electroplating processor includes a base having a vessel body. A membrane assembly including a membrane housing is attached to a membrane plate. A membrane is provided on a membrane support attached to the membrane housing. An anode assembly includes an anode cup and one or more anodes in the anode cup. An anode plate is attached to the anode cup. Two or more posts on a first side of the anode plate are engageable with post fittings on the membrane plate. Latches on a second side of the anode plate are engageable with and releasable from a latch fitting on the membrane plate. The anode assembly is quickly and easily removable from the processor for maintenance, without disturbing or removing other components of the processor.

Methods for providing laminated coatings on metal articles using electroplating methods such as barrel plating, vibratory plating, rocker plating or other non-rack methods that involve movement of articles to be plated in a containment apparatus, as well as articles made from such processes. Embodiments of such processes involve mass-transfer modulation to provide compositionally modulated coatings.

Methods for providing laminated coatings on metal articles using electroplating methods such as barrel plating, vibratory plating, rocker plating or other non-rack methods that involve movement of articles to be plated in a containment apparatus, as well as articles made from such processes. Embodiments of such processes involve mass-transfer modulation to provide compositionally modulated coatings.