Patent classifications
C25D17/28
Method and apparatus for electrolytically depositing a deposition metal on a workpiece
For improving the current transfer during the electrolytic metallization of workpieces, a method is proposed: (a) providing a metal depositing apparatus 17, in which the workpiece, at least one anode 40, 41 and a metal deposition electrolyte AE are arranged and which has a device for electric current generation 60 and at least one current feeding device 31 with in each case at least one electrical contact element 34, 35 for making electrical contact with the workpiece; (b) bringing the at least one electrical contact element 34, 35 into contact with the workpiece; and (c) feeding electric current to the workpiece via the at least one electrical contact element 34, 35 in order that the deposition metal deposits on the workpiece. Before method step (b), in a further method step (d), deposition metal is deposited on the at least one electrical contact element 34, 35.
Method and apparatus for electrolytically depositing a deposition metal on a workpiece
For improving the current transfer during the electrolytic metallization of workpieces, a method is proposed: (a) providing a metal depositing apparatus 17, in which the workpiece, at least one anode 40, 41 and a metal deposition electrolyte AE are arranged and which has a device for electric current generation 60 and at least one current feeding device 31 with in each case at least one electrical contact element 34, 35 for making electrical contact with the workpiece; (b) bringing the at least one electrical contact element 34, 35 into contact with the workpiece; and (c) feeding electric current to the workpiece via the at least one electrical contact element 34, 35 in order that the deposition metal deposits on the workpiece. Before method step (b), in a further method step (d), deposition metal is deposited on the at least one electrical contact element 34, 35.
Plating apparatus and plating method
A plating apparatus includes a plating tank and a plating unit that performs electrolytic plating on an object. The plating unit includes a workpiece passage region including a partition wall that allows passage of the plating solution but does not allow passage of the object, the workpiece passage region passing the object from above toward below, an injection unit that injects the plating solution from below toward above, a mixing unit that mixes the plating solution injected by the injection unit and the object to be plated passing through the workpiece passage region, an anode outside the workpiece passage region, a cathode inside the workpiece passage region including a hollow region through which a mixed fluid of the plating solution and the object to be plated passes from below toward above, and a guidance unit that guides the mixed fluid to the workpiece passage region.
Plating apparatus and plating method
A plating apparatus includes a plating tank and a plating unit that performs electrolytic plating on an object. The plating unit includes a workpiece passage region including a partition wall that allows passage of the plating solution but does not allow passage of the object, the workpiece passage region passing the object from above toward below, an injection unit that injects the plating solution from below toward above, a mixing unit that mixes the plating solution injected by the injection unit and the object to be plated passing through the workpiece passage region, an anode outside the workpiece passage region, a cathode inside the workpiece passage region including a hollow region through which a mixed fluid of the plating solution and the object to be plated passes from below toward above, and a guidance unit that guides the mixed fluid to the workpiece passage region.
Method for the Production of a Metal Strip Coated with a Coating of Chromium and Chromium Oxide Using an Electrolyte Solution with a Trivalent Chromium Compound
A method for producing a metal strip coated with a coating that contains chromium metal and chromium oxide and is electrolytically deposited from an electrolyte solution that contains a trivalent chromium compound onto the metal strip by bringing the metal strip, which is connected as the cathode, into contact with the electrolyte solution. An efficient deposition of coating with a high proportion of chromium oxide is obtained by successively passing the metal strip through a plurality of electrolysis tanks. The electrolyte solution in at least the last electrolysis tank, as viewed in the strip travel direction, or in a rear group of electrolysis tanks has an average temperature of at most 40 C., and the electrolysis time, during which the metal strip is in electrolytically effective contact with the electrolyte solution in the last electrolysis tank or in the rear group of electrolysis tanks is less than 2.0 seconds.
Method for the Production of a Metal Strip Coated with a Coating of Chromium and Chromium Oxide Using an Electrolyte Solution with a Trivalent Chromium Compound
A method for producing a metal strip coated with a coating that contains chromium metal and chromium oxide and is electrolytically deposited from an electrolyte solution that contains a trivalent chromium compound onto the metal strip by bringing the metal strip, which is connected as the cathode, into contact with the electrolyte solution. An efficient deposition of coating with a high proportion of chromium oxide is obtained by successively passing the metal strip through a plurality of electrolysis tanks. The electrolyte solution in at least the last electrolysis tank, as viewed in the strip travel direction, or in a rear group of electrolysis tanks has an average temperature of at most 40 C., and the electrolysis time, during which the metal strip is in electrolytically effective contact with the electrolyte solution in the last electrolysis tank or in the rear group of electrolysis tanks is less than 2.0 seconds.
Plating apparatus and plating method
There are provided a plating apparatus and a plating method enabling continuous operation even while a stocker is taken out of the plating apparatus. The plating apparatus includes a plating treatment section performing plating on a substrate and a plurality of stockers configured to be able to store a holder configured to hold a substrate or an anode. At least one of the plurality of stockers is configured to be movable into and out of the plating apparatus.
Plating apparatus and plating method
There are provided a plating apparatus and a plating method enabling continuous operation even while a stocker is taken out of the plating apparatus. The plating apparatus includes a plating treatment section performing plating on a substrate and a plurality of stockers configured to be able to store a holder configured to hold a substrate or an anode. At least one of the plurality of stockers is configured to be movable into and out of the plating apparatus.
Film formation method for metallic coating and film formation device for metallic coating
It is determined whether an imaginary component at a predetermined frequency of an alternating current impedance is equal to or more than a preliminarily set film-formable value or not. The metallic coating is formed in a state where the substrate is pressed by the solid electrolyte membrane when the imaginary component is equal to or more than the film-formable value in the determining. The metallic coating is formed in a state where the pressing of the substrate by the solid electrolyte membrane is released to separate the solid electrolyte membrane from the substrate, the solid electrolyte membrane is re-tensioned with a constant tensile force, and subsequently, the substrate is pressed by the re-tensioned solid electrolyte membrane when the imaginary component is smaller than the film-formable value in the determining.
Film formation method for metallic coating and film formation device for metallic coating
It is determined whether an imaginary component at a predetermined frequency of an alternating current impedance is equal to or more than a preliminarily set film-formable value or not. The metallic coating is formed in a state where the substrate is pressed by the solid electrolyte membrane when the imaginary component is equal to or more than the film-formable value in the determining. The metallic coating is formed in a state where the pressing of the substrate by the solid electrolyte membrane is released to separate the solid electrolyte membrane from the substrate, the solid electrolyte membrane is re-tensioned with a constant tensile force, and subsequently, the substrate is pressed by the re-tensioned solid electrolyte membrane when the imaginary component is smaller than the film-formable value in the determining.