Electrochemical deposition systems and methods are described that have enhanced crystallization prevention features. The systems may include a bath vessel operable to hold an electrochemical deposition fluid having a metal salt dissolved in water. The systems may also include sensors including a thermometer and concentration sensor operable to measure characteristics of the electrochemical deposition fluid. The systems further include a computer configured to perform operations that include receiving system data from the electrochemical system and generating a control signal to change a characteristic of the electrochemical deposition fluid to prevent crystallization of a metal salt in the fluid. The computer generates the control signal based on processing that may include comparing an actual metal salt concentration in the electrochemical deposition fluid to a theoretical solubility limit for the metal salt in the fluid.

Electrochemical deposition systems and methods are described that have enhanced crystallization prevention features. The systems may include a bath vessel operable to hold an electrochemical deposition fluid having a metal salt dissolved in water. The systems may also include sensors including a thermometer and concentration sensor operable to measure characteristics of the electrochemical deposition fluid. The systems further include a computer configured to perform operations that include receiving system data from the electrochemical system and generating a control signal to change a characteristic of the electrochemical deposition fluid to prevent crystallization of a metal salt in the fluid. The computer generates the control signal based on processing that may include comparing an actual metal salt concentration in the electrochemical deposition fluid to a theoretical solubility limit for the metal salt in the fluid.

An electrolyte solution for chrome plating from trivalent chromium is prepared by dissolving in an aqueous medium a trivalent chromium salt (e.g., chromium (III) chloride or chromium (III) sulfate), dissolving an oxalate compound (e.g., sodium oxalate, potassium oxalate, or oxalic acid), dissolving a metal salt (e.g., aluminum sulfate or aluminum chloride), dissolving an alkali metal sulfate (e.g., sodium sulfate or potassium sulfate), and dissolving an alkali metal halide (e.g., sodium fluoride or potassium fluoride). A substrate is chrome plated from trivalent chromium using the electrolyte solution by passing a current between a cathode and an anode through the electrolyte solution to deposit chromium on the substrate.

An electrolyte solution for chrome plating from trivalent chromium is prepared by dissolving in an aqueous medium a trivalent chromium salt (e.g., chromium (III) chloride or chromium (III) sulfate), dissolving an oxalate compound (e.g., sodium oxalate, potassium oxalate, or oxalic acid), dissolving a metal salt (e.g., aluminum sulfate or aluminum chloride), dissolving an alkali metal sulfate (e.g., sodium sulfate or potassium sulfate), and dissolving an alkali metal halide (e.g., sodium fluoride or potassium fluoride). A substrate is chrome plated from trivalent chromium using the electrolyte solution by passing a current between a cathode and an anode through the electrolyte solution to deposit chromium on the substrate.

The present invention relates to an electrolyte and to a method for the electrolytic deposition of silver-rich silver-palladium alloys which to a minor degree also include selenium and/or tellurium. The electrolyte of the invention allows uniform deposition of such an alloy on conductive surfaces across a wide range of current densities.

The present invention relates to an electrolyte and to a method for the electrolytic deposition of silver-rich silver-palladium alloys which to a minor degree also include selenium and/or tellurium. The electrolyte of the invention allows uniform deposition of such an alloy on conductive surfaces across a wide range of current densities.

Techniques for performing bath metrology on electroplating mixtures are disclosed. In particular, the disclosed techniques can be used in conjection with traditional metrology methods such as cyclic voltammatric stripping (CVS), and are capable of detecting changes in bath components at a more sensitive level than CVS in some circumstances. In some instances, deviations in observed current values from potentiostatic methods vis-à-vis a calibration standard can provide indications of changes in the mixture, and provide an indicator when a depleted component has been sufficiently added to restore the mixture to a previous state.

Techniques for performing bath metrology on electroplating mixtures are disclosed. In particular, the disclosed techniques can be used in conjection with traditional metrology methods such as cyclic voltammatric stripping (CVS), and are capable of detecting changes in bath components at a more sensitive level than CVS in some circumstances. In some instances, deviations in observed current values from potentiostatic methods vis-à-vis a calibration standard can provide indications of changes in the mixture, and provide an indicator when a depleted component has been sufficiently added to restore the mixture to a previous state.

Electroplating techniques including an electroplating system and a method for using the electroplating system are provided. The electroplating system has: an electroplating apparatus for electroplating a workpiece, the electroplating apparatus has an electroplating tank configured to contain a solution including target organics; a first reservoir configured to receive the solution including the target organics from the electroplating tank, and to hold the solution including the target organics; a foaming mechanism configured to, in the first reservoir, separate the target organics from the solution through foaming action such that the solution with a reduced concentration of the target organics is separated from a foam including the separated target organics; and a diverting mechanism configured to selectively feed the solution with the reduced concentration of the target organics to one of the first reservoir and the electroplating tank of the electroplating apparatus.

Electroplating techniques including an electroplating system and a method for using the electroplating system are provided. The electroplating system has: an electroplating apparatus for electroplating a workpiece, the electroplating apparatus has an electroplating tank configured to contain a solution including target organics; a first reservoir configured to receive the solution including the target organics from the electroplating tank, and to hold the solution including the target organics; a foaming mechanism configured to, in the first reservoir, separate the target organics from the solution through foaming action such that the solution with a reduced concentration of the target organics is separated from a foam including the separated target organics; and a diverting mechanism configured to selectively feed the solution with the reduced concentration of the target organics to one of the first reservoir and the electroplating tank of the electroplating apparatus.