An improved apparatus for adding powder comprising at least a metal, such as copper, to a plating solution, and supplying the plating solution to a plating tank is disclosed. The apparatus includes a hopper having an inlet which is connectable to a powder conduit of a powder container holding the powder therein, a feeder which communicates with a bottom opening of the hopper, a motor coupled to the feeder, and a plating-solution tank coupled to an outlet of the feeder and configured to dissolve the powder in the plating solution.

An improved apparatus for adding powder comprising at least a metal, such as copper, to a plating solution, and supplying the plating solution to a plating tank is disclosed. The apparatus includes a hopper having an inlet which is connectable to a powder conduit of a powder container holding the powder therein, a feeder which communicates with a bottom opening of the hopper, a motor coupled to the feeder, and a plating-solution tank coupled to an outlet of the feeder and configured to dissolve the powder in the plating solution.

A method for removing rare earth impurities from a nickel-electroplating solution by keeping a nickel-electroplating solution containing rare earth impurities and having pH of 4.0-5.1 at 60° C. or higher for a certain period of time, and then removing precipitate generated by the heating from the nickel-electroplating solution by sedimentation and/or filtration.

A method for removing rare earth impurities from a nickel-electroplating solution by keeping a nickel-electroplating solution containing rare earth impurities and having pH of 4.0-5.1 at 60° C. or higher for a certain period of time, and then removing precipitate generated by the heating from the nickel-electroplating solution by sedimentation and/or filtration.

Apparatus and methods for electroplating metal onto substrates are disclosed. The electroplating apparatus comprise an electroplating cell and at least one oxidization device. The electroplating cell comprises a cathode chamber and an anode chamber separated by a porous barrier that allows metal cations to pass through but prevents organic particles from crossing. The oxidation device (ODD) is configured to oxidize cations of the metal to be electroplated onto the substrate, which cations are present in the anolyte during electroplating. In some embodiments, the ODD is implemented as a carbon anode that removes Cu(I) from the anolyte electrochemically. In other embodiments, the ODD is implemented as an oxygenation device (OGD) or an impressed current cathodic protection anode (ICCP anode), both of which increase oxygen concentration in anolyte solutions. Methods for efficient electroplating are also disclosed.

Apparatus and methods for electroplating metal onto substrates are disclosed. The electroplating apparatus comprise an electroplating cell and at least one oxidization device. The electroplating cell comprises a cathode chamber and an anode chamber separated by a porous barrier that allows metal cations to pass through but prevents organic particles from crossing. The oxidation device (ODD) is configured to oxidize cations of the metal to be electroplated onto the substrate, which cations are present in the anolyte during electroplating. In some embodiments, the ODD is implemented as a carbon anode that removes Cu(I) from the anolyte electrochemically. In other embodiments, the ODD is implemented as an oxygenation device (OGD) or an impressed current cathodic protection anode (ICCP anode), both of which increase oxygen concentration in anolyte solutions. Methods for efficient electroplating are also disclosed.

An Sn alloy plating apparatus is disclosed. The apparatus includes a plating bath configured to store an Sn alloy plating solution therein with an insoluble anode and a substrate immersed in the Sn alloy plating solution, an Sn dissolving having an anion exchange membrane therein which isolates an anode chamber, in which an Sn anode is disposed, and a cathode chamber, in which a cathode is disposed, from each other, a pure water supply structure configured to supply pure water to the anode chamber and the cathode chamber, a methanesulfonic acid solution supply structure configured to supply a methanesulfonic acid solution, containing a methanesulfonic acid, to the anode chamber and the cathode chamber, and an Sn replenisher supply structure configured to supply an Sn replenisher, produced in the anode chamber and containing Sn ions and a methanesulfonic acid, to the plating bath.

An Sn alloy plating apparatus is disclosed. The apparatus includes a plating bath configured to store an Sn alloy plating solution therein with an insoluble anode and a substrate immersed in the Sn alloy plating solution, an Sn dissolving having an anion exchange membrane therein which isolates an anode chamber, in which an Sn anode is disposed, and a cathode chamber, in which a cathode is disposed, from each other, a pure water supply structure configured to supply pure water to the anode chamber and the cathode chamber, a methanesulfonic acid solution supply structure configured to supply a methanesulfonic acid solution, containing a methanesulfonic acid, to the anode chamber and the cathode chamber, and an Sn replenisher supply structure configured to supply an Sn replenisher, produced in the anode chamber and containing Sn ions and a methanesulfonic acid, to the plating bath.

The present invention is directed towards an electrocoating system for electrocoating a substrate (500), the system comprising a tank (100) configured to hold an electrodepositable coating composition; at least one pump (200) in fluid communication with the tank, at least one return conduit (210) connecting the tank with an inlet of the pump, at least one recirculating pipe (300) comprising a first end in fluid communication with an outlet of the pump and a second end having at least one aperture, and the at least one recirculating pipe comprising at least one external electrode (400) positioned at least partially outside of the tank. Also disclosed herein are methods of coating substrates, systems for coating a substrate, and coated substrates.

The present invention is directed towards an electrocoating system for electrocoating a substrate (500), the system comprising a tank (100) configured to hold an electrodepositable coating composition; at least one pump (200) in fluid communication with the tank, at least one return conduit (210) connecting the tank with an inlet of the pump, at least one recirculating pipe (300) comprising a first end in fluid communication with an outlet of the pump and a second end having at least one aperture, and the at least one recirculating pipe comprising at least one external electrode (400) positioned at least partially outside of the tank. Also disclosed herein are methods of coating substrates, systems for coating a substrate, and coated substrates.