An apparatus for electroplating which is applicable to the electroplating of workpiece is disclosed. The apparatus includes: an electroplating solution container, a target, an absorbent piece, and a power supply. All the electroplating solution, workpiece, absorbent piece, and target are placed inside the electroplating solution container with at least partial portions of each workpiece, absorbent piece and target submerged in the electroplating solution. The positive electrode of the power supply is electrically connected to the target while its negative electrode is electrically connected to the workpiece and absorbent piece simultaneously. When the power supply imposes a current through the circuit, the target releases metal ions into the electroplating solution and metal ions reduce and a metal coating is formed on the workpiece. In the meantime, carbocations in the electroplating solution are adsorbed on the absorbent piece.

The invention relates to an anode for use in electroplating applications for highly alkaline electroplating electrolytes based on sodium hydroxide for depositing zinc and zinc alloys onto steel substrates and die-cast zinc substrates.

The invention relates to an anode for use in electroplating applications for highly alkaline electroplating electrolytes based on sodium hydroxide for depositing zinc and zinc alloys onto steel substrates and die-cast zinc substrates.

The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. In many cases the material is a metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold defined on the bottom by the channeled plate, on the top by the substrate, and on the sides by a cross flow confinement ring. During plating, fluid enters the cross flow manifold both upward through the channels in the channeled plate, and laterally through a cross flow side inlet positioned on one side of the cross flow confinement ring. The flow paths combine in the cross flow manifold and exit at the cross flow exit, which is positioned opposite the cross flow inlet. These combined flow paths result in improved plating uniformity.

A problem to be solved is to provide a method for regenerating plating liquid from plating waste liquid in a simple and easy way and a plating method utilizing the regenerating method.

A method for regenerating plating liquid from plating waste liquid that is produced as a result of performing a copper plating on steel and that contains respective ions of Fe, Cu and Sn comprises repetitively performing processing steps of applying electric current with the plating waste liquid 11 side taken as a cathode 15 and electrolytic solution 12 side taken as an anode 16 in the state that the plating waste liquid 11 and the electrolytic solution 12 are connected through an anion exchange membrane 13; separating copper by making a copper deposition electrode as a result of depositing copper on the cathode 15 being in contact with the plating waste liquid 11, to turn the plating waste liquid to processed remaining liquid; and using as the anode 16 a copper deposition electrode formed previously and dissolving copper in the electrolytic solution 12 to generate copper ion-containing solution.

A problem to be solved is to provide a method for regenerating plating liquid from plating waste liquid in a simple and easy way and a plating method utilizing the regenerating method.

A method for regenerating plating liquid from plating waste liquid that is produced as a result of performing a copper plating on steel and that contains respective ions of Fe, Cu and Sn comprises repetitively performing processing steps of applying electric current with the plating waste liquid 11 side taken as a cathode 15 and electrolytic solution 12 side taken as an anode 16 in the state that the plating waste liquid 11 and the electrolytic solution 12 are connected through an anion exchange membrane 13; separating copper by making a copper deposition electrode as a result of depositing copper on the cathode 15 being in contact with the plating waste liquid 11, to turn the plating waste liquid to processed remaining liquid; and using as the anode 16 a copper deposition electrode formed previously and dissolving copper in the electrolytic solution 12 to generate copper ion-containing solution.

A problem to be solved is to provide a method for regenerating plating liquid from plating waste liquid in a simple and easy way and a plating method utilizing the regenerating method. A method for regenerating plating liquid from plating waste liquid that is produced as a result of performing a copper plating on steel and that contains respective ions of Fe, Cu and Sn comprises repetitively performing processing steps of applying electric current with the plating waste liquid 11 side taken as a cathode 15 and electrolytic solution 12 side taken as an anode 16 in the state that the plating waste liquid 11 and the electrolytic solution 12 are connected through an anion exchange membrane 13; separating copper by making a copper deposition electrode as a result of depositing copper on the cathode 15 being in contact with the plating waste liquid 11, to turn the plating waste liquid to processed remaining liquid; and using as the anode 16 a copper deposition electrode formed previously and dissolving copper in the electrolytic solution 12 to generate copper ion-containing solution.

A problem to be solved is to provide a method for regenerating plating liquid from plating waste liquid in a simple and easy way and a plating method utilizing the regenerating method. A method for regenerating plating liquid from plating waste liquid that is produced as a result of performing a copper plating on steel and that contains respective ions of Fe, Cu and Sn comprises repetitively performing processing steps of applying electric current with the plating waste liquid 11 side taken as a cathode 15 and electrolytic solution 12 side taken as an anode 16 in the state that the plating waste liquid 11 and the electrolytic solution 12 are connected through an anion exchange membrane 13; separating copper by making a copper deposition electrode as a result of depositing copper on the cathode 15 being in contact with the plating waste liquid 11, to turn the plating waste liquid to processed remaining liquid; and using as the anode 16 a copper deposition electrode formed previously and dissolving copper in the electrolytic solution 12 to generate copper ion-containing solution.

Examples are disclosed that relate to operating an electrodeposition system comprising an inert anode. In one example system, the electrodeposition system includes a substrate holder and a cathode chamber configured to hold a catholyte. An anode chamber configured to hold an anolyte during the electrodeposition process comprises an inert anode. An intermediate chamber is positioned between the cathode chamber and the anode chamber. The intermediate chamber is separated from the cathode chamber by an ion exchange membrane.

Examples are disclosed that relate to operating an electrodeposition system comprising an inert anode. In one example system, the electrodeposition system includes a substrate holder and a cathode chamber configured to hold a catholyte. An anode chamber configured to hold an anolyte during the electrodeposition process comprises an inert anode. An intermediate chamber is positioned between the cathode chamber and the anode chamber. The intermediate chamber is separated from the cathode chamber by an ion exchange membrane.