A process for removing metallic support structures, sinter cakes and/or discharge lugs on an additively manufactured metal component, wherein the metal component is treated electrolytically in an acidic electrolyte, the metal component being operated as an anode for a defined period of time, wherein, during the defined period of time, a higher voltage and then a lower voltage or a higher current density and then a lower current density are alternately applied to the metal component multiple times.

A process for removing metallic support structures, sinter cakes and/or discharge lugs on an additively manufactured metal component, wherein the metal component is treated electrolytically in an acidic electrolyte, the metal component being operated as an anode for a defined period of time, wherein, during the defined period of time, a higher voltage and then a lower voltage or a higher current density and then a lower current density are alternately applied to the metal component multiple times.

An electrochemical deposition system—for the electrochemical deposition of a metal-based material (e.g., aluminum or an aluminum alloy)—comprises an electrolyte solution, at least one working electrode, and at least one counter electrode. The electrolyte solution comprises at least one imidazolium-based tetrahalo-metallate compound (e.g., alkyl methylimidazolium tetrachloroaluminate(s)) and at least one metal-containing compound (e.g., AlCl.sub.3, AlBr.sub.3) of a metal of the metal-based material to be electrodeposited on the at least one working electrode. The working electrode is configured to be exposed to the electrolyte solution. The at least one counter electrode is in contact with the electrolyte solution. In some embodiments, the system is configured for additive manufacturing of the metal-based material being electrochemically deposited. Related methods are also disclosed.

A method for forming holes to form holes in a surface of a metal part includes: putting the metal part into a first solution as an anode; applying a first voltage on the metal part to form the first holes in a surface of the metal part; and cleaning and drying the metal part with the first holes. The first solution comprises a first organic solvent, chloride, and a phosphoric acid compound. The disclosure also provides a metal product and a metal composite.

A method for forming holes to form holes in a surface of a metal part includes: putting the metal part into a first solution as an anode; applying a first voltage on the metal part to form the first holes in a surface of the metal part; and cleaning and drying the metal part with the first holes. The first solution comprises a first organic solvent, chloride, and a phosphoric acid compound. The disclosure also provides a metal product and a metal composite.

Lithographic printing plate precursors are prepared with a unique aluminum-containing substrate prepared using two separate anodizing processes to provide an inner aluminum oxide layer of average dry thickness (T.sub.i) of 300-3,000 nm and a multiplicity of inner micropores of average inner micropore diameter (D.sub.i) of ≤100 nm. An outer aluminum oxide layer is also provided to have a multiplicity of outer micropores of average outer micropore diameter (D.sub.o) of 15-30 nm and a dry thickness (T.sub.o) of 30-650 nm. A hydrophilic layer disposed on the outer aluminum oxide layer at 0.0002-0.1 g/m.sup.2 has at least a hydrophilic copolymer composed of (a) recurring units having an amide group and (b) recurring units comprising an —OM group directly connected to a phosphorus atom, wherein M represents a hydrogen, sodium, potassium, or aluminum atom.

A superhydrophobic hemispherical array which can realize droplet pancake bouncing phenomenon is provided. The superhydrophobic hemispherical array shows an arc-shape structure which is narrow at the top and wide at the bottom, where a is the angle that substrate-gas interface goes across the gas and reaches substrate-hemisphere interface, d refers to the diameter of the contact area between hemispherical structure and substrate, s represents the space between two adjoining hemispheres, h denotes the vertical height from the top of hemisphere to substrate surface, and 70°≤a≤90°, 900 μm≤d ≤1700 μm, s≤550 μm, 600 μm≤h≤1100 μm, respectively. The superhydrophobic hemispherical array has a water contact angle larger than 150° and roll-off angle lower than 10°.

Anode foil, preferably aluminum anode foil, is etched using a process of treating the foil in an electrolyte bath composition comprising a perfluoroalkylsulfonate, a sulfate, a halide, and an oxidizing agent. The anode foil is etched in the electrolyte bath composition by passing a direct current charge through the bath. The etched anode foil is suitable for use in an electrolytic capacitor.

Anode foil, preferably aluminum anode foil, is etched using a process of treating the foil in an electrolyte bath composition comprising a perfluoroalkylsulfonate, a sulfate, a halide, and an oxidizing agent. The anode foil is etched in the electrolyte bath composition by passing a direct current charge through the bath. The etched anode foil is suitable for use in an electrolytic capacitor.

An aluminum-based coating of a flat steel product is applied in a hot-dipping method and comprises a mass percentage of silicon within a given range. The coating for a flat steel product, in particular for press mold hardening components, offers a shortened required minimum oven dwell time and a sufficiently large processing window when heating in an oven. This is achieved in that the surface of the coating has a degree of absorption for thermal radiation ranging between 0.35 and 0.95 prior to an annealing treatment, where the degree of absorption relates to an oven temperature ranging from 880 to 950° C. during the austenitizing annealing treatment. The invention additionally relates to an improved method for producing a flat steel product with an aluminum-based coating, to an inexpensive method for producing press-hardened components from such flat steel products, and to a press-hardened component made of such flat steel products.