The invention relates to a strip consisting of an aluminium alloy for providing adhesive connections. In addition, the invention relates to a method for producing a strip having a one or two-sided surface structure which consists of an aluminium alloy, at least provided in certain areas and prepared for an adhesive connection, and also relates to a corresponding adhesive connection. The object of providing an aluminium alloy strip optimised for adhesive connections, which has optimised surface properties for ageing-resistant adhesive connections, on the one hand, and which can be cost-effectively produced in a way which is reliable in terms of the process, on the other hand, is achieved for a strip consisting of an aluminium alloy for providing adhesive connections by the strip at least in areas having a surface structure prepared for adhesive connections, wherein the surface structure has depressions which were produced using an electrochemical graining process.

A chemical etch is performed on a sheet of material. An electrochemical etch is performed on the sheet of material after the chemical etch is performed on the sheet of material. A capacitor is fabricated such that an electrode included in the capacitor includes material from the sheet of material after the electrochemical etch was performed on the sheet of material. In some instances, the chemical etch included at least partially immersing the sheet of material in an etch bath that includes molybdenum. Additionally or alternately, the chemical etch can be performed for a period of time less than 60 s.

A chemical etch is performed on a sheet of material. An electrochemical etch is performed on the sheet of material after the chemical etch is performed on the sheet of material. A capacitor is fabricated such that an electrode included in the capacitor includes material from the sheet of material after the electrochemical etch was performed on the sheet of material. In some instances, the chemical etch included at least partially immersing the sheet of material in an etch bath that includes molybdenum. Additionally or alternately, the chemical etch can be performed for a period of time less than 60 s.

A heterostructure comprising at least one first surface containing only copper and at least one second surface, opposite the first surface, containing only aluminium or an aluminium alloy with solid solutions present in the alloy, wherein a. an anchoring layer is arranged between the first and second surfaces, wherein b. each slice plane running perpendicular to the anchoring layer has at least one aluminium or aluminium-alloy island surrounded by copper, and c. at most the aluminium alloy solid solutions which are present in the alloy occur in the anchoring layer. Also, an aluminium-copper connector and a heterostructure production method.

A heterostructure comprising at least one first surface containing only copper and at least one second surface, opposite the first surface, containing only aluminium or an aluminium alloy with solid solutions present in the alloy, wherein a. an anchoring layer is arranged between the first and second surfaces, wherein b. each slice plane running perpendicular to the anchoring layer has at least one aluminium or aluminium-alloy island surrounded by copper, and c. at most the aluminium alloy solid solutions which are present in the alloy occur in the anchoring layer. Also, an aluminium-copper connector and a heterostructure production method.

An object is to provide an aluminum plate having favorable coating properties and favorable adhesiveness to active materials and a method for manufacturing an aluminum plate. The aluminum plate having a plurality of through holes that penetrate in a thickness direction includes through holes A which have an average opening diameter of the through holes of 0.1 m or more and less than 100 m and have a shape in which a maximum diameter Ra is formed inside and the maximum diameter Ra and a minimum diameter Rb satisfy 1>Rb/Ra0.1.

An object is to provide an aluminum plate having favorable coating properties and favorable adhesiveness to active materials and a method for manufacturing an aluminum plate. The aluminum plate having a plurality of through holes that penetrate in a thickness direction includes through holes A which have an average opening diameter of the through holes of 0.1 m or more and less than 100 m and have a shape in which a maximum diameter Ra is formed inside and the maximum diameter Ra and a minimum diameter Rb satisfy 1>Rb/Ra0.1.

An object is to provide a method for manufacturing an aluminum plate having a plurality of through-holes in a thickness direction in which the locations of the through-holes are controlled and a manufacturing apparatus that is used in the method for manufacturing the aluminum plate. A method for manufacturing an aluminum plate of the present invention is a method for manufacturing an aluminum plate having a plurality of through-holes in a thickness direction, the method including a coating-forming step of forming a coating of an aluminum compound on a surface of an aluminum substrate having a thickness of 5 to 1,000 m, a partial coating removal step of removing, out of the coating, the coating present on portions in which the through-holes need to be formed, and a through-hole-forming step of forming the through-holes in the aluminum substrate by carrying out an electrochemical melting treatment on the aluminum substrate after the partial coating removal step.

An object is to provide a method for manufacturing an aluminum plate having a plurality of through-holes in a thickness direction in which the locations of the through-holes are controlled and a manufacturing apparatus that is used in the method for manufacturing the aluminum plate. A method for manufacturing an aluminum plate of the present invention is a method for manufacturing an aluminum plate having a plurality of through-holes in a thickness direction, the method including a coating-forming step of forming a coating of an aluminum compound on a surface of an aluminum substrate having a thickness of 5 to 1,000 m, a partial coating removal step of removing, out of the coating, the coating present on portions in which the through-holes need to be formed, and a through-hole-forming step of forming the through-holes in the aluminum substrate by carrying out an electrochemical melting treatment on the aluminum substrate after the partial coating removal step.

The present invention is directed to a method of etching anode foil in a non-uniform manner which minimizes thermal oxidation during foil cutting. Having less oxide improves the ability to cut through aluminum anodes with lower energy rates. In aluminum foils, it has been found that a masking step before etching reduces conversion of boehmite aluminum oxide to alpha-phase corundum during laser cutting of anodes, which increases edge quality and productivity. Additionally, the non-etched anode frame allows for less surface area to form during the aging process. As a result, the leakage current is reduced by the proportion of edge to anode surface area, and the aging process will be faster, leading to higher productivity.