The present disclosure is directed a process for the electrolytic polishing of a metallic substrate, including the steps of (i) providing an electrolyte in an electrolytic cell having at least one electrode, (ii) disposing a metallic substrate as an anode in the electrolytic cell, (iii) applying a current at a voltage of 270 to 315 V from a power source between the at least one electrode and the metallic substrate, and (iv) immersing the metallic substrate in the electrolyte, wherein the electrolyte includes at least one acid compound, at least one fluoride compound, and at least one complexing agent.

An electrolyte (EL) for the electrolytic polishing of a metallic substrate includes at least one fluoride compound (F) and/or one chloride compound (Cl), and at least one complexing agent (CA), wherein the electrolyte (EL) does not contain an acid compound that is not a complexing agent. Furthermore, a process for the electrolytic polishing of a metallic substrate wherein the electrolyte (EL) is applied is described.

An electrolyte (EL) for the electrolytic polishing of a metallic substrate includes at least one fluoride compound (F) and/or one chloride compound (Cl), and at least one complexing agent (CA), wherein the electrolyte (EL) does not contain an acid compound that is not a complexing agent. Furthermore, a process for the electrolytic polishing of a metallic substrate wherein the electrolyte (EL) is applied is described.

A method for pre-treating lithium metal for a lithium secondary battery including stripping a surface oxide film formed on a surface of the lithium metal by discharging the battery, and a plating lithium metal on the surface of the lithium metal, from which the surface oxide film has been stripped, by charging the battery.

A low-hazardous electropolishing process has been developed to remove oxide layer(s) from the surface of nitinol needles. Low concentrations of citric acid and sulfamic acid are mixed with medium concentrations of sulfuric acid to use as an electrolyte solution. The process can be easily fitted into current suture needle manufacturing processes as well as into processes require electropolishing of nitinol-containing medical devices.

In some example embodiments, there is provided example embodiments related to providing a more uniform lithium deposition based on pulsing. In some example embodiments, there is provided a method including: generating a first energy pulse followed by a second energy pulse; and applying the first energy pulse and the second energy pulse to a lithium metal electrode to electrically treat the lithium metal electrode to reduce and/or eliminate growth of dendrites on at least a portion of a surface of the lithium metal. Related systems, methods, and articles of manufacture are also disclosed.

In some example embodiments, there is provided example embodiments related to providing a more uniform lithium deposition based on pulsing. In some example embodiments, there is provided a method including: generating a first energy pulse followed by a second energy pulse; and applying the first energy pulse and the second energy pulse to a lithium metal electrode to electrically treat the lithium metal electrode to reduce and/or eliminate growth of dendrites on at least a portion of a surface of the lithium metal. Related systems, methods, and articles of manufacture are also disclosed.

The invention relates to a method for the electrochemical polishing of metal surfaces by means of repeating pulse sequences, wherein at least one anodic pulse is provided, the current intensity of which rises continuously in the time curve up to a specifiable value. The invention further relates to the use of said method for components produced in 3-D and to a system therefor.

An electrolyte (EL) for the electrolytic polishing of a metallic substrate includes at least one fluoride compound (F) and/or one chloride compound (Cl), and at least one complexing agent (CA), wherein the electrolyte (EL) does not contain an acid compound that is not a complexing agent. Furthermore, a process for the electrolytic polishing of a metallic substrate wherein the electrolyte (EL) is applied is described.

An electrolyte (EL) for the electrolytic polishing of a metallic substrate includes at least one fluoride compound (F) and/or one chloride compound (Cl), and at least one complexing agent (CA), wherein the electrolyte (EL) does not contain an acid compound that is not a complexing agent. Furthermore, a process for the electrolytic polishing of a metallic substrate wherein the electrolyte (EL) is applied is described.