An electrolyte for the electrochemical machining of a γ-γ″ nickel-based superalloy, includes NaNO3 in a content of between 10% and 30% by weight relative to the total weight of the electrolyte; a complexing agent selected from sulfosalicylic acid at a pH of between 3 and 10 and nitrilotriacetic acid at a pH of between 7 and 14, the complexing agent being present in a content of between 1% and 5% by weight relative to the total weight of the electrolyte; optionally, an anionic surfactant in a content of between 1% and 5% by weight relative to the total weight of the electrolyte; optionally, NaOH in order to obtain the desired pH; and an aqueous solvent.

A method and an electrocatalytic electrode for electrochemically reducing carbon dioxide to methanol are provided. An exemplary electrocatalytic electrode includes copper (I) oxide crystals electrodeposited over an atomically smooth copper electrode.

A method for forming an atomically smooth surface on a copper electrode through electropolishing and the atomically smooth surface are provided. An exemplary method for forming an atomically smooth surface by electropolishing includes placing a copper foil in an electrolyte solution including ethylene glycol and phosphoric acid. The copper foil is coupled to a current source. Current is applied to the copper foil to electropolish the copper foil. The electropolishing is stopped when the electropolishing is completed

A method for forming an atomically smooth surface on a copper electrode through electropolishing and the atomically smooth surface are provided. An exemplary method for forming an atomically smooth surface by electropolishing includes placing a copper foil in an electrolyte solution including ethylene glycol and phosphoric acid. The copper foil is coupled to a current source. Current is applied to the copper foil to electropolish the copper foil. The electropolishing is stopped when the electropolishing is completed

Methods and devices for treatment of metal surfaces by means of electrically active solid particles that include a step of contact of the solid particles with the electrode of an electric source, a step of shooting the particles towards the metal surface to be treated and a step of transmission of electric charge of the particles on the metal surface to be treated. The transmission of the electricity between the electric source and the metal surface during the step of shooting preferably is by net charge of the particles or by electric conductivity by contact or by electric conductivity by means of voltaic arches. The current applied to the electrode is preferably a DC or a current that contains positive sections and negative sections.

A bone implant for at least partial insertion into a bone and/or cartilage. The bone implant is at least partially formed of a metal alloy of at least about 90 wt % of a solid solution or a rhenium and molybdenum alloy.

Direct copper-copper bonding at low temperatures is achieved by electroplating copper features on a substrate followed by electroplanarizing the copper features. The copper features are electroplated on the substrate under conditions so that nanotwinned copper structures are formed. Electroplanarizing the copper features is performed by anodically biasing the substrate and contacting the copper features with an electrolyte so that copper is electrochemically removed. Such electrochemical removal is performed in a manner so that roughness is reduced in the copper features and substantial coplanarity is achieved among the copper features. Copper features having nanotwinned copper structures, reduced roughness, and better coplanarity enable direct copper-copper bonding at low temperatures.

Direct copper-copper bonding at low temperatures is achieved by electroplating copper features on a substrate followed by electroplanarizing the copper features. The copper features are electroplated on the substrate under conditions so that nanotwinned copper structures are formed. Electroplanarizing the copper features is performed by anodically biasing the substrate and contacting the copper features with an electrolyte so that copper is electrochemically removed. Such electrochemical removal is performed in a manner so that roughness is reduced in the copper features and substantial coplanarity is achieved among the copper features. Copper features having nanotwinned copper structures, reduced roughness, and better coplanarity enable direct copper-copper bonding at low temperatures.

A copper alloy plate including 0.3 mass % or more and 1.2 mass % or less of Mg, 0.001 mass % or more and 0.2 mass % or less of P, and the balance Cu with inevitable impurities in a thickness center portion in a plate thickness direction; Mg concentration on a plate surface is 30% or less of bulk Mg concentration at the thickness center portion; a surface layer part having a depth from the plate surface to where it is 90% of the bulk Mg concentration is provided; and in the surface layer part, the Mg concentration increases from the plate surface toward the thickness center portion with a concentration gradient 1.8 mass %/μm or more and 50 mass %/μm or less.

Methods for electropolishing and coating aluminum on a surface of an air and/or moisture sensitive substrate, including: in a vessel, submerging the substrate in a first molten salt bath and applying an anodizing current to the substrate at a first temperature to electropolish the surface of the substrate; wherein the first molten salt bath includes one of a first organic salt bath and first inorganic salt bath; wherein, when used, the first organic salt bath includes one of (a) aluminum halide and ionic liquid, (b) a combination of an aluminum halide and halogenatedmethylphenylsulfone (C.sub.6(H.sub.5-y,X.sub.y)SO.sub.2CX.sub.3, where y is a number from 0-5), (c) a combination of an aluminum halide, an ionic liquid, and halogenatedmethylphenylsulfone (C.sub.6(H.sub.5-y,X.sub.y)SO.sub.2CX.sub.3), and (d) AlF.sub.3-organofluoride-hydrofluoric acid adduct; wherein, when used, the first inorganic salt bath includes aluminum halide and alkali metal halide; and wherein the anodizing current is 10-30 mA/cm.sup.2.