A method for making a transition metal dichalcogenide crystal having a chemical formula represented as MX.sub.2 is provided, wherein M represents a central transition metal element, and X represents a chalcogen element. The method includes providing a MX.sub.2 polycrystalline powder, a MX.sub.2 seed crystal, and a transport medium. The MX.sub.2 polycrystalline powder and the transport medium are placed in a first reaction chamber. The first reaction chamber and the MX.sub.2 seed crystal are placed in a second reaction chamber having a source end and a deposition end opposite to the source end. The first reaction chamber is placed at the source end, and the MX.sub.2 seed crystal is placed at the deposition end.

A substrate is mounted on a rotator provided in a reaction chamber, while a first process gas containing no source gas is supplied to an upper surface of the substrate from above the substrate and the substrate is rotated at 300 rpm or more, a temperature of a wall surface is changed, and after a temperature of the substrate is allowed to rise, the substrate is controlled to a predetermined film formation temperature and a second process gas containing a source gas is supplied to the upper surface of the substrate from above the substrate to grow an SiC film on the substrate.

A substrate is mounted on a rotator provided in a reaction chamber, while a first process gas containing no source gas is supplied to an upper surface of the substrate from above the substrate and the substrate is rotated at 300 rpm or more, a temperature of a wall surface is changed, and after a temperature of the substrate is allowed to rise, the substrate is controlled to a predetermined film formation temperature and a second process gas containing a source gas is supplied to the upper surface of the substrate from above the substrate to grow an SiC film on the substrate.

A system for manufacturing one or more single crystals of a semiconductor material by physical vapor transport (PVT) includes a reactor having an inner chamber adapted to accommodate a PVT growth structure for growing the one or more single crystals inside. The reactor accommodates the PVT growth structure in an orientation with a growth direction of the one or more single crystals inside the PVT growth structure substantially horizontal with respect to a direction of gravity or within an angle from horizontal of less than a predetermined value.

A system for manufacturing one or more single crystals of a semiconductor material by physical vapor transport (PVT) includes a reactor having an inner chamber adapted to accommodate a PVT growth structure for growing the one or more single crystals inside. The reactor accommodates the PVT growth structure in an orientation with a growth direction of the one or more single crystals inside the PVT growth structure substantially horizontal with respect to a direction of gravity or within an angle from horizontal of less than a predetermined value.

A gallium nitride vapor phase epitaxy apparatus capable of doping magnesium is provided. The apparatus is used in vapor phase epitaxy not using organic metal as a gallium raw material. The apparatus comprises a reactor vessel and a wafer holder. The apparatus comprises a first raw material gas supply pipe configured to supply a first raw material gas containing gallium. The apparatus comprises a second raw material gas supply pipe configured to supply a second raw material gas, which contains nitrogen and configured to react with the first raw material gas. The apparatus comprises a third raw material gas supply pipe configured to supply a third raw material gas containing magnesium. The third raw material gas supply pipe is configured capable of placing a magnesium-based oxide on its supply path. The apparatus comprises a first heating unit configured to heat the magnesium-based oxide in a first temperature range.

A gallium nitride vapor phase epitaxy apparatus capable of doping magnesium is provided. The apparatus is used in vapor phase epitaxy not using organic metal as a gallium raw material. The apparatus comprises a reactor vessel and a wafer holder. The apparatus comprises a first raw material gas supply pipe configured to supply a first raw material gas containing gallium. The apparatus comprises a second raw material gas supply pipe configured to supply a second raw material gas, which contains nitrogen and configured to react with the first raw material gas. The apparatus comprises a third raw material gas supply pipe configured to supply a third raw material gas containing magnesium. The third raw material gas supply pipe is configured capable of placing a magnesium-based oxide on its supply path. The apparatus comprises a first heating unit configured to heat the magnesium-based oxide in a first temperature range.

The present disclosure generally relates to a substrate support for processing of semiconductor substrates. In one example, the substrate support has a body. The body has a top surface configured to support a substrate thereon. The body has a bottom surface opposite the top surface. The body has an upper portion disposed at the top surface and a lower portion disposed at the bottom surface. An IR blocking material is encased by the upper portion and the lower portion, wherein the IR blocking material is an optically opaque at IR wavelengths and the lower portion is optically transparent at IR wavelengths.

Hydride phase vapor epitaxy (HVPE) growth apparatus, methods and materials and structures grown thereby. An HVPE reactor includes generation, accumulation, and growth zones. A source material for growth of indium nitride is generated and collected inside the reactor. A first reactive gas reacts with an indium source inside the generation zone to produce a first gas product having an indium-containing compound. The first gas product is cooled and condenses into a liquid or solid condensate or source material having an indium-containing compound. The source material is collected in the accumulation zone. Vapor or gas resulting from evaporation of the condensate forms a second gas product, which reacts with a second reactive gas in the growth zone for growth of indium nitride.

Hydride phase vapor epitaxy (HVPE) growth apparatus, methods and materials and structures grown thereby. An HVPE reactor includes generation, accumulation, and growth zones. A source material for growth of indium nitride is generated and collected inside the reactor. A first reactive gas reacts with an indium source inside the generation zone to produce a first gas product having an indium-containing compound. The first gas product is cooled and condenses into a liquid or solid condensate or source material having an indium-containing compound. The source material is collected in the accumulation zone. Vapor or gas resulting from evaporation of the condensate forms a second gas product, which reacts with a second reactive gas in the growth zone for growth of indium nitride.