The present invention refers to a method for preparing a network of nanowires; to a network of nanowires obtainable by said method; to a nonwoven material comprising the network, to an electrode comprising the network, a pharmaceutical composition 10 comprising the network of nanowires, to the use of the network of nanowires and to the use of the nonwoven material.

An ingot having a first surface, a second surface opposite to the first surface, and a third surface extending in a first direction from the second surface to the first surface and connecting the first and second surfaces includes a first mono-like crystalline portion, a first intermediate portion including one or more mono-like crystalline sections, and a second mono-like crystalline portion sequentially adjacent to one another in a second direction perpendicular to the first direction. The first and second mono-like crystalline portions have a greater width than the first intermediate portion in the second direction. A first boundary between the first mono-like crystalline portion and the first intermediate portion and a second boundary between the second mono-like crystalline portion and the first intermediate portion each include a coincidence boundary. At least one of the first or second boundary is curved in an imaginary cross section perpendicular to the first direction.

An ingot having a first surface, a second surface opposite to the first surface, and a third surface extending in a first direction from the second surface to the first surface and connecting the first and second surfaces includes a first mono-like crystalline portion, a first intermediate portion including one or more mono-like crystalline sections, and a second mono-like crystalline portion sequentially adjacent to one another in a second direction perpendicular to the first direction. The first and second mono-like crystalline portions have a greater width than the first intermediate portion in the second direction. A first boundary between the first mono-like crystalline portion and the first intermediate portion and a second boundary between the second mono-like crystalline portion and the first intermediate portion each include a coincidence boundary. At least one of the first or second boundary is curved in an imaginary cross section perpendicular to the first direction.

Provided is a device for manufacturing monocrystalline silicon and a cooling method thereof. The device includes a crystal puller and a cooling apparatus. A heating apparatus and a first thermal insulation structure are arranged in the crystal puller. The first thermal insulation structure is located above the heating apparatus. The cooling apparatus includes a jacking mechanism and a cooling pipe. The cooling pipe is capable of moving into or out of the crystal puller. When the cooling pipe enters the crystal puller, the cooling pipe is connected to the first thermal insulation structure, and the cooling pipe lifts the first thermal insulation structure through the jacking mechanism to increase a distance between the first thermal insulation structure and the heating apparatus, and a cooling medium is output to the cooling pipe to cool the crystal puller. The cooling medium may be liquid or gas.

Provided is a device for manufacturing monocrystalline silicon and a cooling method thereof. The device includes a crystal puller and a cooling apparatus. A heating apparatus and a first thermal insulation structure are arranged in the crystal puller. The first thermal insulation structure is located above the heating apparatus. The cooling apparatus includes a jacking mechanism and a cooling pipe. The cooling pipe is capable of moving into or out of the crystal puller. When the cooling pipe enters the crystal puller, the cooling pipe is connected to the first thermal insulation structure, and the cooling pipe lifts the first thermal insulation structure through the jacking mechanism to increase a distance between the first thermal insulation structure and the heating apparatus, and a cooling medium is output to the cooling pipe to cool the crystal puller. The cooling medium may be liquid or gas.

Methods for producing single crystal silicon ingots by Continuous Czochralski (CCz) are disclosed. One or more plates are added to the outer melt zone of a crucible assembly such that the plates are disposed on the initial charge of solid-state silicon. The silicon is melted and the plates float on the silicon melt. When silicon is added to the outer melt zone to replenish the melt during ingot growth, the silicon contacts the plates rather than falling directly into the melt in the outer melt zone. The silicon melts and falls through openings that extend through the thickness of the plates.

Methods for producing single crystal silicon ingots by Continuous Czochralski (CCz) are disclosed. One or more plates are added to the outer melt zone of a crucible assembly such that the plates are disposed on the initial charge of solid-state silicon. The silicon is melted and the plates float on the silicon melt. When silicon is added to the outer melt zone to replenish the melt during ingot growth, the silicon contacts the plates rather than falling directly into the melt in the outer melt zone. The silicon melts and falls through openings that extend through the thickness of the plates.

A polycrystalline silicon manufacturing apparatus according to the present invention may comprise an electrode adapter that electrically connects a core wire holder and a metal electrode, wherein the electrode adapter may be non-conductive with respect to a screwing part formed in the metal electrode. A polycrystalline silicon manufacturing apparatus according to the present invention may comprise an electrode adapter that electrically connects a core wire holder and a metal electrode, wherein the electrode adapter may be fixed to the metal electrode by a fixing mechanism part, and the electrode adapter may be non-conductive with respect to the fixing mechanism part.

A polycrystalline silicon manufacturing apparatus according to the present invention may comprise an electrode adapter that electrically connects a core wire holder and a metal electrode, wherein the electrode adapter may be non-conductive with respect to a screwing part formed in the metal electrode. A polycrystalline silicon manufacturing apparatus according to the present invention may comprise an electrode adapter that electrically connects a core wire holder and a metal electrode, wherein the electrode adapter may be fixed to the metal electrode by a fixing mechanism part, and the electrode adapter may be non-conductive with respect to the fixing mechanism part.

A method for determining an amount of metallic impurities within silicon. The method includes the steps of (a) providing a rodlike silicon sample and a rodlike seed crystal in a zone melting apparatus, (b) zone melting to form a single silicon crystal having a conical end region with a droplike melt forming at the end of the single silicon crystal in a separation step, (c) cooling of the droplike melt to form a solidified silicon drop, (d) partial or complete dissolution of the silicon drop in an acid, and analyzing the solution obtained in step (d) by a trace analysis technique. Wherein the separation step further includes a remelting step for the silicon sample to reduce its diameter, forming a droplike melting zone, and separation of the seed crystal and the silicon sample by moving the seed crystal and the silicon sample apart from one another.